Nexperia USA Inc. S26KL512SDABHA030
- Part No.:
- S26KL512SDABHA030
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S26KL512SDABHA030.pdf
- Description:
- S26KL512S - 3V 512MBIT, HYPERFLA
- Quantity:
- Payment:

- Shipping:

Inventory:1,418
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Product details
Overview
S26KL512SDABHA030 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DDR data bus (DQ[7:0]), and read-data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.
For engineers reviewing the S26KL512SDABHA030 datasheet, S26KL512SDABHA030 pinout, S26KL512SDABHA030 application, or S26KL512SDABHA030 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-synchronized DDR read latency (96 ns initial access), ECC 1-bit correction/2-bit detection capability, and support for wrapped/linear burst configurations in embedded boot and code-execution systems.
Technical Context
The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with dual-edge sampling referenced to CK/CK#. Its internal MIRRORBIT™ architecture enables page-aligned 32-byte random reads with configurable 5–16 clock-cycle initial latency and automatic next-page prefetch during linear bursts.
Control logic is split between Host Interface Controller (HIC) handling real-time signal capture and RWDS generation, and Embedded Algorithm Controller (EAC) executing non-volatile program/erase sequences-including sector erase, buffer programming, and volatile/non-volatile sector protection-without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full application image storage and XIP execution in resource-constrained SoCs |
| Interface Standard | HYPERTBUS™ DDR - reduces pin count vs parallel NOR while maintaining high bandwidth via 8-bit bus + dual-edge sampling |
| Max Read Throughput | 333 MBps - achieved at 166 MHz clock with 2× data per cycle on DQ[7:0], enabling fast boot and firmware load |
| Initial Access Time | 96 ns - defines minimum latency for first word retrieval after CS# assertion, critical for real-time response |
| ECC Capability | 1-bit correction / 2-bit detection - protects against single-bit errors and flags double-bit faults in stored code/data |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - ensures long-term reliability in industrial control firmware storage |
| Operating Temp | –40°C to +85°C (Industrial) - validated for use in factory automation, motor drives, and edge gateway environments |
| Package | 24-ball FBGA (VAA024, 6 × 8 × 1.0 mm) - compact footprint compatible with high-density PCB layouts and automated assembly |
Pinout & Package
Package: 24-ball Fortified Ball Grid Array (FBGA), VAA024 footprint (6 mm × 8 mm × 1.0 mm height), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR sampling of DQ and RWDS; enables precise timing margin control in high-speed read operations |
| CS# | Chip select (active low) | Enables device communication; must be asserted before command/address transfer and held active during burst transactions |
| RWDS | Read data strobe output | Edge-aligned output synchronized to read data transitions; used by host to latch valid DQ values during reads |
| DQ[7:0] | Bi-directional DDR data bus | Carries command, address, and 8-bit-wide data on both clock edges; shared path requires strict timing alignment |
| INT# | Interrupt output | Asserts on busy-to-ready transition or ECC error detection, enabling asynchronous host notification without polling |
| RSTO# | Reset output | User-configurable open-drain reset pulse for system-level power-on initialization; driven LOW for programmable duration |
| VCC / VCCQ | Core & I/O supply | 1.8 V for I/O (VCCQ) and core (VCC); decoupling required per datasheet layout guidelines to maintain signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - enables optimization for cache line fill vs sequential streaming |
| 512-byte program buffer | Reduces write overhead by allowing up to 512 bytes to be loaded before commit - improves effective programming speed to ~1 MBps |
| Active clock stop | Enters low-power read state (12 mA) with no wake-up delay when CK stops - ideal for intermittent firmware access in battery-backed systems |
| Advanced sector protection | Volatile (lock bits) and non-volatile (OTP fuse) methods per 256-KB sector - prevents accidental overwrite of bootloader or calibration data |
| HYPERBUS™ DCARS | DDR center-aligned read strobe functionality - eliminates setup/hold timing constraints on host DQ capture logic |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code and safety-critical firmware for radar processing units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Non-volatile XIP-capable memory providing deterministic 96-ns random access and ECC-protected instruction fetch over HYPERBUS™. Use Value: Enables secure, fast startup and runtime code integrity verification without external error-checking logic. | Use Scenario: Holds field-upgradable ladder logic and motion control algorithms in programmable logic controllers deployed in factory environments. IC Role / Device Role / Timing Role: High-reliability NOR flash with 100K-cycle endurance and 20-year retention, interfaced via microcontroller's HYPERBUS™ master peripheral. Use Value: Eliminates need for external SRAM buffering during firmware updates and supports seamless in-field reprogramming. |
| Medical Imaging System Code Storage | 5G Small Cell Baseband Processor Memory |
Use Scenario: Stores FPGA configuration bitstreams and real-time image processing firmware in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-power, temperature-stable memory supporting deep power-down (8 µA) and 333 MBps burst reads for rapid algorithm loading. Use Value: Reduces thermal load and extends battery life while meeting IEC 60601-1 environmental stress requirements. | Use Scenario: Provides boot image and DSP firmware for baseband processors in outdoor 5G small cell radios operating at extended temperature. IC Role / Device Role / Timing Role: Industrial Plus grade (–40°C to +105°C) HYPERFLASH™ with RSTO#-driven system reset coordination and INT#-triggered firmware validation. Use Value: Ensures robust cold-start behavior and fault-aware firmware update sequencing in thermally constrained enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS512SDABHA020 | Same 512 Mb density and FBGA-24 package but rated for 3.0 V I/O only; max 200 MBps read throughput at 100 MHz | Limited to legacy 3.0 V controller designs; lacks differential clock support and DCARS timing | Select only when migrating from older 3.0 V HYPERBUS™ platforms without clock differential capability |
| Infineon S26KL256SDABHA030 | 256 Mb density, identical 1.8 V I/O, FBGA-24, and HYPERBUS™ timing; shares same ECC, burst, and power modes | Used where firmware size fits within 32 MB and BOM cost reduction is prioritized over future scalability | Drop-in replacement if design does not require >256 MB capacity; retains full feature compatibility |
Compared with S26KL512SDABHA030, the S26KS512SDABHA020 trades bandwidth and timing flexibility for 3.0 V compatibility, while the S26KL256SDABHA030 offers identical interface behavior at half the density-making it suitable for cost-sensitive or space-constrained implementations where 256 MB suffices.
Availability
S26KL512SDABHA030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, and medical imaging systems requiring stable component supply, AEC-Q100 qualification, and long-term firmware storage reliability.
Supply support for S26KL512SDABHA030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and communications markets.
The HYPERFLASH™ product line targets high-performance embedded systems needing fast, reliable, pin-efficient non-volatile memory for code execution and firmware storage-especially where DDR interface bandwidth and ECC integrity are critical.
FAQ
What is the purpose of the RWDS signal in S26KL512SDABHA030?
RWDS (Read Data Strobe) is an output signal synchronized to read data transitions on DQ[7:0]. It provides edge-aligned timing reference for the host to correctly sample valid data during DDR read operations. Unlike clock signals, RWDS is only active during read bursts and is essential for meeting setup/hold timing margins in high-speed interfaces.
Does S26KL512SDABHA030 support true random access or only burst reads?
S26KL512SDABHA030 supports true random access at 32-byte page granularity, with 96 ns initial access time and configurable 5–16 clock-cycle latency. While all reads are burst-oriented, the device allows arbitrary starting addresses within a page and supports single-word reads via short bursts, enabling direct code execution and pointer-based data access.
How does the 512-byte program buffer improve write performance?
The 512-byte buffer allows the host to issue one command and stream up to 512 bytes of data before triggering internal programming. This reduces command overhead and enables sustained write speeds of ~1 MBps-over 2000× faster than single-word programming (4 KBps)-making firmware updates significantly more efficient in production and field deployment.
Can S26KL512SDABHA030 operate in deep power-down mode while retaining data integrity?
Yes-deep power-down draws only 4 µA (typical) at 85°C and preserves all stored data. The device requires a 300 µs wake-up period before accepting commands, but no data loss occurs. This mode is ideal for battery-powered systems requiring ultra-low standby current without compromising non-volatility or ECC protection.
S26KL512SDABHA030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
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- Clock Frequency:
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- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
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- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
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- Supplier Device Package:
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S26KL512SDABHA030 FAQ
1.How can I place an order for S26KL512SDABHA030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL512SDABHA030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL512SDABHA030 reliable?
The price and inventory of S26KL512SDABHA030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHA030 is usually 5 days.
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S26KL512SDABHA030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL512SDABHA030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL512SDABHA030?
For technical support, including S26KL512SDABHA030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHA030 requirements.
6.How does Aetrix verify that S26KL512SDABHA030 is sourced from the original manufacturer or authorized distributors?
All S26KL512SDABHA030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHA030 meets industry standards.
7.What is the process for return or replacement of S26KL512SDABHA030?
All S26KL512SDABHA030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHA030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL512SDABHA030 part is unused and in its original packaging.
Return procedure for S26KL512SDABHA030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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