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Infineon Technologies S26KL512SDABHB020

Part No.:
S26KL512SDABHB020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL512SDABHB020.pdf
Description:
IC FLASH 256MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,358

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Product details

Overview

S26KL512SDABHB020 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.

For engineers reviewing the S26KL512SDABHB020 datasheet, S26KL512SDABHB020 pinout, S26KL512SDABHB020 application, or S26KL512SDABHB020 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (8 µA), and AEC-Q100 grade 3 qualification for automotive control modules.

Technical Context

This device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with RWDS edge-aligned to data transitions during reads and CK/CK# differential clocking enabling precise timing capture. The embedded algorithm controller (EAC) autonomously executes program/erase sequences without host intervention, using internal command memory and MIRRORBIT™ architecture for high endurance.

It supports configurable burst modes - wrapped (16/32/64-byte) or linear - with hybrid option, and uses DCARS (DDR Center-Aligned Read Strobe) to align read data to RWDS edges. Initial latency ranges from 5 to 16 clock cycles, and the 512-byte write buffer enables ~1 MBps buffered programming performance.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - supports boot code storage and firmware images for high-end microcontrollers and SoCs.
Interface ProtocolHYPERTBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read throughput via dual-edge DQ transfers.
Random Access Time96 ns - defines minimum latency for first-word retrieval in non-sequential accesses; impacts real-time interrupt response time.
Operating Voltage1.8 V I/O, 3.0 V core - enables low-power operation with backward compatibility to legacy 3.0 V systems via separate VCC/VCCQ rails.
Endurance & Retention100,000 program/erase cycles / 20-year data retention - validated for long-life industrial and automotive applications requiring field-upgradable firmware.
Power ModesDeep Power-Down: 8 µA (typical); Standby: 25 µA - allows ultra-low quiescent current during system sleep states without wake-up delay.
Package24-ball FBGA (VAA024, 5 × 5 mm, 0.8 mm pitch) - surface-mount compatible with automated PCB assembly and thermal reliability for reflow profiles.

Pinout & Package

Package: 24-ball Fortified Ball Grid Array (FBGA), VAA024 footprint (5 mm × 5 mm, 0.8 mm ball pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides precise edge-aligned timing reference for DDR data capture; required for 166 MHz operation at 1.8 V.
CS#Chip select (active low)Enables device communication; must be asserted before command/address transfer and held active during burst transactions.
RWDSRead data strobe outputIndicates valid read data on DQ lines; synchronized to data edges, not clock - critical for host sampling timing.
DQ[7:0]Bi-directional DDR data busCarries command, address, and 8-bit-wide data on both clock edges; supports 16-bit word-aligned addressing only.
INT#Interrupt outputAsserts on ECC error detection or busy-to-ready transition - enables asynchronous host notification without polling.
RSTO#Reset outputGenerates system-level power-on reset pulse; duration user-configurable via register - eliminates need for external reset IC.
PSC / PSC#Power supply control inputsEnable hardware data protection during power loss; latch write operations when VCC drops below threshold.

Key Features

FeatureDesign Value
HYPERBUS™ DDR InterfaceReduces signal count to 11–12 pins vs traditional parallel NOR, enabling compact PCB routing and lower EMI in space-constrained designs.
Configurable Burst ModeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill efficiency for MCU instruction fetch and DMA streaming.
ECC & CRC ProtectionOn-the-fly 1-bit correction / 2-bit detection plus CRC for command/address integrity - ensures robustness in safety-critical automotive and industrial firmware storage.
Advanced Sector ProtectionVolatile and non-volatile lock bits per 256-KB sector and optional 4-KB parameter sectors - prevents accidental overwrite of bootloader or calibration data.
Low-Power Deep Power-Down8 µA typical current draw with 300 µs wake-up - extends battery life in always-on edge nodes without sacrificing firmware accessibility.

Applications

Automotive ADAS ControllerIndustrial PLC Firmware Storage

Use Scenario: Stores boot firmware and real-time sensor fusion algorithms for radar/Ethernet-based ADAS domain controllers.

IC Role / Device Role / Timing Role: High-speed non-volatile code execution memory interfaced directly to ARM Cortex-R5F or R7F SoC via HYPERBUS™ master.

Use Value: 333 MBps read throughput enables zero-wait-state instruction fetch; AEC-Q100 Grade 3 qualification ensures operation across –40°C to +85°C ambient.

Use Scenario: Holds programmable logic controller (PLC) runtime firmware, configuration tables, and diagnostic logs in factory automation systems.

IC Role / Device Role / Timing Role: Boot memory and persistent data store for dual-core ARM Cortex-A9 MPUs running real-time Linux or RTOS.

Use Value: 256-KB uniform sectors allow atomic firmware updates; ECC and CRC prevent corruption during brown-out events in noisy industrial environments.

5G Baseband Radio UnitMedical Imaging FPGA Configuration

Use Scenario: Stores FPGA bitstreams and DSP firmware for massive MIMO radio units requiring rapid cold-boot recovery.

IC Role / Device Role / Timing Role: Primary configuration memory accessed by Xilinx Zynq UltraScale+ RFSoC via dedicated HYPERBUS™ PHY IP block.

Use Value: 96 ns random access and 118 ns CS# latency minimize boot time; deep power-down mode reduces standby power in idle RU slots.

Use Scenario: Loads FPGA configuration bitstream and calibration coefficients for high-resolution ultrasound beamforming engines.

IC Role / Device Role / Timing Role: Secure, high-reliability configuration source for radiation-tolerant Xilinx Kintex Ultrascale FPGAs in portable imaging devices.

Use Value: 20-year data retention and 100K-cycle endurance ensure lifetime validity of medical-grade firmware; RSTO# simplifies power sequencing compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KS512SDABHI020Same HYPERFLASH™ family, identical 512 Mb density and FBGA-24 package, but rated for Industrial Plus (–40°C to +105°C) and includes enhanced ECC engine.Preferred for extended-temperature industrial gateways or telecom infrastructure where ambient exceeds +85°C.Select when higher temperature grade and tighter ECC coverage are required; pin- and software-compatible.
Infineon S26KL256SDABHB020256 Mb (32 MB) density, same package, voltage, and timing specs; shares identical HYPERBUS™ protocol and feature set except capacity.Suitable for cost-sensitive applications with smaller firmware footprints, such as mid-tier motor drives or HVAC controllers.Choose for BOM cost reduction where 256 MB is sufficient; full functional and layout compatibility.

Compared with S26KL512SDABHB020, the S26KS512SDABHI020 offers extended temperature support and stronger ECC at no interface or timing penalty, while the S26KL256SDABHB020 provides identical performance in half the density - enabling direct drop-in replacement where firmware size permits.

Availability

S26KL512SDABHB020 is available at Aetrix Electronics and suitable for automotive ADAS controllers, industrial PLCs, 5G radio units, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant flash memory.

Supply support for S26KL512SDABHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D facilities.

This part belongs to the HYPERFLASH™ product line, designed specifically for high-bandwidth, low-pin-count non-volatile memory applications in automotive, industrial, and communications systems requiring fast boot and reliable firmware storage.

FAQ

What is the minimum initial latency for random read access?

The initial random read access latency is configurable from 5 to 16 clock cycles, depending on system timing margin and HYPERBUS™ master setup. This latency occurs after CS# assertion and clock stabilization, before the first data word appears on DQ. It is independent of burst length and applies to all read operations initiated from idle state.

Does S26KL512SDABHB020 support 3.0 V I/O operation?

No - S26KL512SDABHB020 is specified for 1.8 V I/O operation only, with differential CK/CK# clocking. While the broader HYPERFLASH™ family includes 3.0 V I/O variants (e.g., S26KL512Sxxx000), this specific part number (ending in "BHB020") is exclusively 1.8 V I/O compliant per Infineon's ordering matrix and datasheet Rev. *Q section 14.1.

How does the RSTO# output function during power-up?

RSTO# asserts a LOW pulse during power-on reset, with duration configurable via internal register (default 100 ms). It remains LOW until VCC reaches stable operating voltage and internal logic completes initialization, then transitions HIGH to release downstream logic. This eliminates need for discrete reset supervisors in tightly integrated systems.

Can RWDS be used for write-data capture?

No - RWDS is read-only and functions solely as a read data strobe. During write operations, the host must rely on CK/CK# edges and timing parameters (tDS/tDH) to sample DQ signals. RWDS remains inactive (HIGH) during writes and is not driven by the device in that phase, per HYPERBUS™ protocol specification.

S26KL512SDABHB020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
HyperBus
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL512SDABHB020 FAQ

1.How can I place an order for S26KL512SDABHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL512SDABHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL512SDABHB020 reliable?

The price and inventory of S26KL512SDABHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHB020 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL512SDABHB020 transactions.

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4.How is shipping managed for S26KL512SDABHB020?

S26KL512SDABHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL512SDABHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL512SDABHB020?

For technical support, including S26KL512SDABHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHB020 requirements.

6.How does Aetrix verify that S26KL512SDABHB020 is sourced from the original manufacturer or authorized distributors?

All S26KL512SDABHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHB020 meets industry standards.

7.What is the process for return or replacement of S26KL512SDABHB020?

All S26KL512SDABHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL512SDABHB020 part is unused and in its original packaging.

Return procedure for S26KL512SDABHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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