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Infineon Technologies S26KL512SDABHB023

Part No.:
S26KL512SDABHB023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL512SDABHB023.pdf
Description:
IC FLASH 256MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,856

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Product details

Overview

S26KL512SDABHB023 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DDR data bus (DQ[7:0]), and read-data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. It is used in automotive ADAS domain controllers for fast boot code execution.

For engineers reviewing the S26KL512SDABHB023 datasheet, S26KL512SDABHB023 pinout, S26KL512SDABHB023 application, or S26KL512SDABHB023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), RWDS-synchronized DDR read alignment, ECC 1-bit correction/2-bit detection capability, and deep power-down current (8 µA typical) for low-power firmware storage.

Technical Context

The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time signal capture and DDR data transfer timing, while Embedded Algorithm Controller (EAC) executes internal program/erase algorithms without host intervention. It uses MIRRORBIT™ technology for high-density NOR array organization and supports both wrapped (16/32/64-byte) and linear burst modes.

HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers; RWDS output is edge-aligned to CK/CK# transitions during reads, enabling precise data capture. Initial latency is configurable from 5 to 16 clock cycles, and DCARS (DDR Center-Aligned Read Strobe) ensures deterministic timing for high-speed boot loaders.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - supports full OS image or multi-application firmware storage in single-package footprint
Interface ProtocolHYPERTBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read throughput
Max Clock Rate166 MHz at 1.8 V - enables 333 MBps sustained read (1 byte × 2 edges × 166 MHz)
Random Access Time96 ns - defines minimum latency for first-word fetch in boot sequence
ECC Support1-bit correction / 2-bit detection - protects against bit-flip errors in long-term firmware storage
Power ModesDeep Power-Down: 8 µA typical - maintains data integrity during system sleep without wake-up overhead
Endurance & Retention100,000 program/erase cycles / 20-year data retention - meets automotive firmware update lifecycle requirements

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides edge-aligned timing reference for DDR data capture; eliminates single-ended clock skew in high-speed routing
CS#Chip select (active-low)Enables device communication; must be asserted before address/command setup on DQ bus
RWDSRead data strobe outputIndicates valid read data windows; synchronized to CK/CK# edges for precise sampling by host controller
DQ[7:0]Bi-directional DDR data busCarries multiplexed commands, addresses, and 8-bit-wide data on both clock edges
INT#Interrupt outputSignals Busy-to-Ready transition or ECC error detection event to host processor
RSTO#Reset outputGenerates system-level power-on reset pulse; duration user-configurable via register

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 11–12 pins vs 40+ for legacy parallel NOR, simplifying PCB layout and EMI control
Configurable burst modeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill efficiency for MCU instruction fetch
512-byte program bufferEnables 1 MBps effective write speed (vs 4 KBps for single-word programming), accelerating firmware updates
Advanced sector protectionVolatile and non-volatile locking per 256-KB sector - prevents accidental overwrite of bootloader or calibration data
Automotive qualificationAEC-Q100 Grade 3 certified (–40°C to +85°C) - validated for under-hood ECUs requiring long-term reliability

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Fast boot of vision processing stack from external flash upon vehicle power-up.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with sub-100 ns random access and DDR-aligned instruction fetch.

Use Value: Enables <100 ms cold-boot time by delivering 333 MBps sequential instruction stream to ARM Cortex-R5F core.

Use Scenario: Storing field-upgradable ladder logic and safety firmware in modular automation controllers.

IC Role / Device Role / Timing Role: Secure, endurance-rated firmware repository with ECC and sector-lock protection.

Use Value: Guarantees 20-year data retention and 100K reprogramming cycles for ISO 13849-certified safety functions.

Medical Imaging System Boot Memory5G Baseband Radio Firmware Cache

Use Scenario: Hosting boot ROM and FPGA configuration bitstream in portable ultrasound devices.

IC Role / Device Role / Timing Role: Low-power, high-reliability code storage with deep power-down mode active between imaging sessions.

Use Value: Reduces standby current to 8 µA typical, extending battery life without compromising boot performance.

Use Scenario: Caching baseband DSP firmware in massive-MIMO radio units requiring rapid reconfiguration.

IC Role / Device Role / Timing Role: High-throughput read accelerator interfaced directly to Xilinx Zynq UltraScale+ MPSoC PS side.

Use Value: Eliminates DRAM dependency for firmware fetch, reducing BOM cost and thermal load in sealed RF enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KS512SDABHB020Same HYPERBUS™ interface, identical 512 Mb density and 24-ball FBGA package, but rated for Industrial Plus (–40°C to +105°C)Preferred for extended-temperature industrial gateways where ambient exceeds +85°CSelect when operating temperature exceeds +85°C; otherwise functionally interchangeable
Infineon S26KL256SDABHB020256 Mb density, same package and timing specs, lower power consumption (6 mA active clock stop)Suitable for cost-optimized designs with smaller firmware footprints (<32 MB)Choose for BOM cost reduction where 256 MB capacity suffices and thermal budget is tighter

Compared with S26KL512SDABHB023, the S26KS512SDABHB020 extends temperature range without trade-offs in speed or pinout, while the S26KL256SDABHB020 halves density and active current-enabling smaller firmware storage with lower power draw in space-constrained modules.

Availability

S26KL512SDABHB023 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot memory requiring stable component supply across extended product lifecycles.

Supply support for S26KL512SDABHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

The HYPERFLASH™ product line targets high-speed, low-pin-count firmware storage for automotive, industrial, and medical systems requiring deterministic boot performance and long-term data integrity.

FAQ

What is the purpose of the RWDS signal in S26KL512SDABHB023?

RWDS (Read Data Strobe) is an output signal synchronized to CK/CK# edges during read operations, indicating valid data windows on the DQ[7:0] bus. It enables precise edge-aligned sampling by the host controller and is not used during write operations. Its timing is defined in HYPERBUS™ specification section 4.3 and supports DCARS functionality for jitter-tolerant data capture.

Does S26KL512SDABHB023 support both 1.8 V and 3.0 V I/O operation?

No - S26KL512SDABHB023 is a 1.8 V I/O variant only, with differential clock (CK/CK#) and 12-signal HYPERBUS™ interface. The 3.0 V I/O variants (e.g., S26KL512SDABHA023) use single-ended clock and 11-signal interface. Mixing voltage domains violates absolute maximum ratings and risks permanent damage.

How does the 512-byte program buffer improve write performance?

The 512-byte buffer allows burst programming of up to 512 bytes per command, achieving ~1 MBps effective write speed versus 4 KBps for single-word writes. This reduces total firmware update time by >95% in typical OTA scenarios and minimizes host CPU occupancy during flash programming sequences.

Is RSTO# output configurable for different reset pulse durations?

Yes - RSTO# duration is programmable via internal configuration register (CR2[7:4]). Valid settings range from 16 to 256 clock cycles of CK, enabling system-level reset pulses tailored to downstream power rail stabilization times. Default value is 64 cycles, yielding ~384 ns at 166 MHz.

S26KL512SDABHB023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
HyperBus
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL512SDABHB023 FAQ

1.How can I place an order for S26KL512SDABHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL512SDABHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL512SDABHB023 reliable?

The price and inventory of S26KL512SDABHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHB023 is usually 5 days.

3.What payment methods are accepted for S26KL512SDABHB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL512SDABHB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KL512SDABHB023?

S26KL512SDABHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL512SDABHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL512SDABHB023?

For technical support, including S26KL512SDABHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHB023 requirements.

6.How does Aetrix verify that S26KL512SDABHB023 is sourced from the original manufacturer or authorized distributors?

All S26KL512SDABHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHB023 meets industry standards.

7.What is the process for return or replacement of S26KL512SDABHB023?

All S26KL512SDABHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL512SDABHB023 part is unused and in its original packaging.

Return procedure for S26KL512SDABHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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