Infineon Technologies S26KL512SDABHB023
- Part No.:
- S26KL512SDABHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL512SDABHB023.pdf
- Description:
- IC FLASH 256MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,856
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Product details
Overview
S26KL512SDABHB023 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DDR data bus (DQ[7:0]), and read-data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. It is used in automotive ADAS domain controllers for fast boot code execution.
For engineers reviewing the S26KL512SDABHB023 datasheet, S26KL512SDABHB023 pinout, S26KL512SDABHB023 application, or S26KL512SDABHB023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), RWDS-synchronized DDR read alignment, ECC 1-bit correction/2-bit detection capability, and deep power-down current (8 µA typical) for low-power firmware storage.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time signal capture and DDR data transfer timing, while Embedded Algorithm Controller (EAC) executes internal program/erase algorithms without host intervention. It uses MIRRORBIT™ technology for high-density NOR array organization and supports both wrapped (16/32/64-byte) and linear burst modes.
HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers; RWDS output is edge-aligned to CK/CK# transitions during reads, enabling precise data capture. Initial latency is configurable from 5 to 16 clock cycles, and DCARS (DDR Center-Aligned Read Strobe) ensures deterministic timing for high-speed boot loaders.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full OS image or multi-application firmware storage in single-package footprint |
| Interface Protocol | HYPERTBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read throughput |
| Max Clock Rate | 166 MHz at 1.8 V - enables 333 MBps sustained read (1 byte × 2 edges × 166 MHz) |
| Random Access Time | 96 ns - defines minimum latency for first-word fetch in boot sequence |
| ECC Support | 1-bit correction / 2-bit detection - protects against bit-flip errors in long-term firmware storage |
| Power Modes | Deep Power-Down: 8 µA typical - maintains data integrity during system sleep without wake-up overhead |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets automotive firmware update lifecycle requirements |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides edge-aligned timing reference for DDR data capture; eliminates single-ended clock skew in high-speed routing |
| CS# | Chip select (active-low) | Enables device communication; must be asserted before address/command setup on DQ bus |
| RWDS | Read data strobe output | Indicates valid read data windows; synchronized to CK/CK# edges for precise sampling by host controller |
| DQ[7:0] | Bi-directional DDR data bus | Carries multiplexed commands, addresses, and 8-bit-wide data on both clock edges |
| INT# | Interrupt output | Signals Busy-to-Ready transition or ECC error detection event to host processor |
| RSTO# | Reset output | Generates system-level power-on reset pulse; duration user-configurable via register |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR interface | Reduces signal count to 11–12 pins vs 40+ for legacy parallel NOR, simplifying PCB layout and EMI control |
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill efficiency for MCU instruction fetch |
| 512-byte program buffer | Enables 1 MBps effective write speed (vs 4 KBps for single-word programming), accelerating firmware updates |
| Advanced sector protection | Volatile and non-volatile locking per 256-KB sector - prevents accidental overwrite of bootloader or calibration data |
| Automotive qualification | AEC-Q100 Grade 3 certified (–40°C to +85°C) - validated for under-hood ECUs requiring long-term reliability |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Fast boot of vision processing stack from external flash upon vehicle power-up. IC Role / Device Role / Timing Role: Primary non-volatile code storage with sub-100 ns random access and DDR-aligned instruction fetch. Use Value: Enables <100 ms cold-boot time by delivering 333 MBps sequential instruction stream to ARM Cortex-R5F core. | Use Scenario: Storing field-upgradable ladder logic and safety firmware in modular automation controllers. IC Role / Device Role / Timing Role: Secure, endurance-rated firmware repository with ECC and sector-lock protection. Use Value: Guarantees 20-year data retention and 100K reprogramming cycles for ISO 13849-certified safety functions. |
| Medical Imaging System Boot Memory | 5G Baseband Radio Firmware Cache |
Use Scenario: Hosting boot ROM and FPGA configuration bitstream in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-power, high-reliability code storage with deep power-down mode active between imaging sessions. Use Value: Reduces standby current to 8 µA typical, extending battery life without compromising boot performance. | Use Scenario: Caching baseband DSP firmware in massive-MIMO radio units requiring rapid reconfiguration. IC Role / Device Role / Timing Role: High-throughput read accelerator interfaced directly to Xilinx Zynq UltraScale+ MPSoC PS side. Use Value: Eliminates DRAM dependency for firmware fetch, reducing BOM cost and thermal load in sealed RF enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS512SDABHB020 | Same HYPERBUS™ interface, identical 512 Mb density and 24-ball FBGA package, but rated for Industrial Plus (–40°C to +105°C) | Preferred for extended-temperature industrial gateways where ambient exceeds +85°C | Select when operating temperature exceeds +85°C; otherwise functionally interchangeable |
| Infineon S26KL256SDABHB020 | 256 Mb density, same package and timing specs, lower power consumption (6 mA active clock stop) | Suitable for cost-optimized designs with smaller firmware footprints (<32 MB) | Choose for BOM cost reduction where 256 MB capacity suffices and thermal budget is tighter |
Compared with S26KL512SDABHB023, the S26KS512SDABHB020 extends temperature range without trade-offs in speed or pinout, while the S26KL256SDABHB020 halves density and active current-enabling smaller firmware storage with lower power draw in space-constrained modules.
Availability
S26KL512SDABHB023 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot memory requiring stable component supply across extended product lifecycles.
Supply support for S26KL512SDABHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
The HYPERFLASH™ product line targets high-speed, low-pin-count firmware storage for automotive, industrial, and medical systems requiring deterministic boot performance and long-term data integrity.
FAQ
What is the purpose of the RWDS signal in S26KL512SDABHB023?
RWDS (Read Data Strobe) is an output signal synchronized to CK/CK# edges during read operations, indicating valid data windows on the DQ[7:0] bus. It enables precise edge-aligned sampling by the host controller and is not used during write operations. Its timing is defined in HYPERBUS™ specification section 4.3 and supports DCARS functionality for jitter-tolerant data capture.
Does S26KL512SDABHB023 support both 1.8 V and 3.0 V I/O operation?
No - S26KL512SDABHB023 is a 1.8 V I/O variant only, with differential clock (CK/CK#) and 12-signal HYPERBUS™ interface. The 3.0 V I/O variants (e.g., S26KL512SDABHA023) use single-ended clock and 11-signal interface. Mixing voltage domains violates absolute maximum ratings and risks permanent damage.
How does the 512-byte program buffer improve write performance?
The 512-byte buffer allows burst programming of up to 512 bytes per command, achieving ~1 MBps effective write speed versus 4 KBps for single-word writes. This reduces total firmware update time by >95% in typical OTA scenarios and minimizes host CPU occupancy during flash programming sequences.
Is RSTO# output configurable for different reset pulse durations?
Yes - RSTO# duration is programmable via internal configuration register (CR2[7:4]). Valid settings range from 16 to 256 clock cycles of CK, enabling system-level reset pulses tailored to downstream power rail stabilization times. Default value is 64 cycles, yielding ~384 ns at 166 MHz.
S26KL512SDABHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL512SDABHB023 FAQ
1.How can I place an order for S26KL512SDABHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL512SDABHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL512SDABHB023 reliable?
The price and inventory of S26KL512SDABHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHB023 is usually 5 days.
3.What payment methods are accepted for S26KL512SDABHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL512SDABHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KL512SDABHB023?
S26KL512SDABHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL512SDABHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL512SDABHB023?
For technical support, including S26KL512SDABHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHB023 requirements.
6.How does Aetrix verify that S26KL512SDABHB023 is sourced from the original manufacturer or authorized distributors?
All S26KL512SDABHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHB023 meets industry standards.
7.What is the process for return or replacement of S26KL512SDABHB023?
All S26KL512SDABHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL512SDABHB023 part is unused and in its original packaging.
Return procedure for S26KL512SDABHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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