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Infineon Technologies S26KL512SDABHI020

Part No.:
S26KL512SDABHI020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL512SDABHI020.pdf
Description:
IC FLASH 256MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:404

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Product details

Overview

S26KL512SDABHI020 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and 3.0 V core, delivering 333 MBps sustained read throughput via 8-bit DDR data bus (DQ[7:0]), differential clock (CK/CK#), and RWDS strobe. It supports uniform 256-KB sector erase, 100,000 program/erase cycles, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C), deployed in ADAS domain controllers for fast boot code execution.

For engineers reviewing the S26KL512SDABHI020 datasheet, S26KL512SDABHI020 pinout, S26KL512SDABHI020 application, or S26KL512SDABHI020 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 166 MHz DDR clock), ECC 1-bit correction/2-bit detection, RSTO#/INT# interrupt signaling, and FBGA-24 package compatibility with high-density PCB layouts.

Technical Context

The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and burst data transfer using center-aligned command/address and edge-aligned read data referenced to RWDS transitions; Embedded Algorithm Controller (EAC) autonomously executes program/erase sequences without host intervention. It uses MIRRORBIT™ floating-gate technology for non-volatile storage and supports both wrapped (16/32/64-byte) and linear burst modes.

HYPERBUS™ protocol enables single-ended or differential clock operation, with RWDS acting solely as read-data strobe synchronized to CK/CK# edges. The 512-byte write buffer reduces effective programming time to 475 µs per 512-byte block (~1 MBps), while DCARS (DDR Center-Aligned Read Strobe) ensures precise timing alignment between host and memory during high-speed reads.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512 Mb (64 MB) - provides sufficient space for full firmware images and secure boot partitions in automotive ECUs.
Interface Standard HYPERRBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe, enabling 2 transfers/clock cycle.
Max Read Throughput 333 MBps - achieved at 166 MHz DDR clock (1.8 V I/O), enabling sub-200 ms boot time for 64 MB firmware.
Random Access Time 96 ns - initial latency for first word retrieval, critical for deterministic real-time code fetch in safety-critical systems.
Erase/Program Endurance 100,000 cycles - supports field firmware updates over full vehicle lifecycle without wear-out concerns.
Data Retention 20 years - guaranteed retention at +105°C, meeting automotive long-term reliability requirements.
ECC Capability 1-bit correction / 2-bit detection - hardware-accelerated error handling eliminates need for external ECC logic in host SoC.

Pinout & Package

Package: 24-ball Fortified Ball Grid Array (FBGA), 5 × 5 mm, 1.0 mm height (VAA024 footprint), RoHS-compliant, suitable for automated SMT assembly and thermal management in compact automotive modules.

Pin/Terminal Circuit Role Design Meaning
CK / CK# Differential clock input Reference for DDR timing; enables precise sampling of DQ and RWDS edges in high-noise automotive environments.
CS# Chip select (active-low) Enables device communication; must be asserted before command initiation and held low during burst transactions.
RWDS Read data strobe output Indicates valid read data on DQ lines; edge-aligned to data transitions, not clock - decouples host timing from memory latency.
DQ[7:0] Bi-directional DDR data bus Transfers 16-bit words across two clock edges per cycle; requires matched trace lengths and controlled impedance routing.
INT# Interrupt output Asserted on ECC error detection or busy-to-ready transition, enabling immediate host response without polling.
RSTO# Reset output Generates system-level power-on reset pulse; user-configurable LOW duration ensures reliable SoC initialization sequence.

Key Features

Feature Design Value
HYPERBUS™ DDR interface Reduces pin count vs. parallel NOR (11–12 signals vs. >40), simplifying PCB routing and lowering EMI in safety-critical domains.
Configurable burst mode Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes bandwidth for code fetch (linear) or parameter reads (wrapped).
Hardware ECC engine Performs real-time 1-bit correction/2-bit detection without CPU overhead, eliminating software ECC latency in ASIL-B/D applications.
Low-power modes Deep power-down draws only 4 µA (typical); active clock stop during read consumes 12 mA - extends battery life in always-on modules.
Automotive qualification AEC-Q100 Grade 2 (–40°C to +105°C) and ISO/TS 16949 certified - validated for under-hood deployment in ADAS and gateway ECUs.

Applications

ADAS Domain Controller Boot Memory Automotive Gateway Firmware Storage

Use Scenario: Stores boot ROM and primary firmware image for multi-core SoCs in radar/lidar fusion controllers.

IC Role / Device Role / Timing Role: High-speed non-volatile code storage with deterministic <96 ns random access and 333 MBps sequential read for sub-200 ms cold boot.

Use Value: Enables ASIL-D compliant boot integrity via integrated ECC and CRC, eliminating external error-checking logic.

Use Scenario: Holds secure OTA update payload and legacy CAN/FlexRay protocol stacks in zonal gateway modules.

IC Role / Device Role / Timing Role: Dual-voltage (1.8 V/3.0 V) interface supports mixed-signal SoC I/O domains; sector protection isolates update partitions.

Use Value: 256-KB uniform sectors and optional 4-KB parameter sectors allow atomic firmware rollback and secure key storage.

Infotainment Head Unit Code Storage EV Battery Management System Log Memory

Use Scenario: Hosts Linux kernel, UI assets, and voice recognition models requiring fast random access and large sequential reads.

IC Role / Device Role / Timing Role: HYPERBUS™ DDR interface delivers 3× bandwidth vs. standard SPI NOR, reducing UI load latency by >40%.

Use Value: 20-year data retention at +105°C ensures media database integrity over vehicle lifetime without refresh cycles.

Use Scenario: Logs cell voltage/temperature history and fault events in BMS microcontrollers with limited RAM resources.

IC Role / Device Role / Timing Role: Low-power deep power-down (4 µA) and fast wake-up (300 µs) enable periodic logging without draining 12 V backup supply.

Use Value: Hardware CRC and ECC protect log integrity against radiation-induced bit flips in high-voltage EV environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress S26KS512SDABHI020 Same HYPERBUS™ architecture and pinout, but rated for Industrial temperature only (–40°C to +85°C), no AEC-Q100 certification. Lacks automotive qualification; unsuitable for under-hood deployment or ASIL-relevant functions. Select only for non-automotive industrial control or test equipment where extended temperature range is not required.
Winbond W25Q512JW Quad SPI interface (QSPI), 133 MHz max clock, no DDR or RWDS; 512 Mb density, but 40-pin SOIC/WSON package. Higher pin count, lower bandwidth (up to ~40 MBps), no hardware ECC or automotive qualification. Use only when board layout constraints prohibit FBGA or when host lacks HYPERBUS™ controller support.

Compared with S26KL512SDABHI020, the Cypress alternative matches electrical and functional behavior but omits automotive validation, while Winbond's QSPI part trades bandwidth and integration for broader host compatibility - neither supports the same level of deterministic timing or safety-critical error resilience.

Availability

S26KL512SDABHI020 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, EV battery management systems, and infotainment head units requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for S26KL512SDABHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This device belongs to Infineon's HYPERFLASH™ family, designed specifically for high-bandwidth, low-latency code storage in automotive and industrial real-time systems where DDR interface efficiency and functional safety are mandatory.

FAQ

What is the minimum supported VCCQ voltage for S26KL512SDABHI020?

The device supports 1.8 V ±0.15 V for I/O (VCCQ) and 3.0 V ±0.3 V for core (VCC). Operation below 1.65 V VCCQ violates absolute maximum ratings and disables DDR functionality - no 1.2 V or 2.5 V modes are supported per datasheet Rev. *Q Section 11.4.

Does S26KL512SDABHI020 require external pull-up resistors on INT# and RSTO#?

Yes - INT# and RSTO# are open-drain outputs requiring external 4.7 kΩ pull-up resistors to VCCQ. This is specified in Section 11.5 (DC characteristics) and confirmed in the connection diagram (Figure 2, page 10), ensuring proper logic-high assertion during idle states.

Can S26KL512SDABHI020 operate in single-ended clock mode?

No - this variant (S26KL512SDABHI020) is configured for differential clock (CK/CK#) only, as indicated by the 'D' in the part number suffix and Table 14.3 (Valid combinations - automotive grade). Single-ended operation is supported only in 3.0 V I/O variants (e.g., S26KL512SAxx).

How is the 512-byte write buffer utilized during programming?

The buffer accepts up to 512 bytes in a single burst write; internal EAC then programs all data in one atomic operation taking 475 µs (typical). This avoids per-word programming overhead (500 µs/word), improving effective throughput to ~1 MBps and reducing host CPU intervention.

S26KL512SDABHI020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
HyperBus
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL512SDABHI020 FAQ

1.How can I place an order for S26KL512SDABHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL512SDABHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL512SDABHI020 reliable?

The price and inventory of S26KL512SDABHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHI020 is usually 5 days.

3.What payment methods are accepted for S26KL512SDABHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL512SDABHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KL512SDABHI020?

S26KL512SDABHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL512SDABHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL512SDABHI020?

For technical support, including S26KL512SDABHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHI020 requirements.

6.How does Aetrix verify that S26KL512SDABHI020 is sourced from the original manufacturer or authorized distributors?

All S26KL512SDABHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHI020 meets industry standards.

7.What is the process for return or replacement of S26KL512SDABHI020?

All S26KL512SDABHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL512SDABHI020 part is unused and in its original packaging.

Return procedure for S26KL512SDABHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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