Infineon Technologies S26KL512SDABHM020
- Part No.:
- S26KL512SDABHM020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL512SDABHM020.pdf
- Description:
- IC FLASH 256MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,674
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Product details
Overview
S26KL512SDABHM020 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and read data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.
For engineers reviewing the S26KL512SDABHM020 datasheet, S26KL512SDABHM020 pinout, S26KL512SDABHM020 application, or S26KL512SDABHM020 equivalent, key selection criteria include HYPERBUS™ DDR timing compliance, RWDS-synchronized read latency (96 ns tACC), sector protection configuration, deep power-down current (8 µA), and AEC-Q100 grade compatibility for automotive control modules.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfers, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses center-aligned command/address and edge-aligned read data relative to RWDS transitions.
HYPERBUS™ protocol enables burst-oriented operations with configurable wrapped (16/32/64-byte) or linear bursts, and supports both initial random access (5–16 clock cycles latency) and continuous sequential reads. The MIRRORBIT™ core enables 16-bit word-wide addressing and page-based 32-byte random access aligned to half-page boundaries.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports boot code and firmware storage for high-end microcontrollers and SoCs. |
| Interface Standard | HYPERTBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe for precise read timing. |
| Max Read Throughput | 333 MBps - achieved at 166 MHz clock with 2 transfers/cycle on DQ[7:0], enabling fast application loading. |
| Random Access Time | 96 ns tACC - defines minimum time from CS# assertion to first valid data, critical for low-latency boot execution. |
| Power Modes | Deep Power-Down: 8 µA (typical) - enables ultra-low standby current with 300 µs wake-up, suitable for battery-backed systems. |
| ECC & Data Integrity | 1-bit correction / 2-bit detection + CRC - ensures reliability in automotive and industrial environments without external error handling. |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - validated for long-life embedded firmware storage. |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR sampling of command/address/data; enables jitter-tolerant high-speed timing. |
| CS# | Chip select (active low) | Enables device communication; must be asserted before any transaction and held active during burst. |
| RWDS | Read data strobe output | Source-synchronous output indicating valid DQ data edges during read; used only for reads, not writes. |
| DQ[7:0] | Bi-directional data bus | Transfers 16-bit words across two clock edges per cycle; requires impedance-controlled routing for signal integrity. |
| INT# | Interrupt output | Asserted on Busy-to-Ready transition or ECC error detection; enables asynchronous host notification. |
| RSTO# | Reset output | User-configurable LOW pulse for system-level power-on reset; driven after power stabilization. |
Key Features
| Feature | Design Value |
|---|---|
| DDR center-aligned read strobe (DCARS) | Enables precise RWDS alignment to data edges, reducing setup/hold margin requirements in high-speed layouts. |
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill and DMA efficiency. |
| 512-byte program buffer | Reduces write overhead by allowing 512 B programming in ~475 µs (~1 MBps), improving firmware update speed. |
| Volatile/non-volatile sector protection | Allows runtime lock/unlock (volatile) or permanent lockdown (non-volatile) of 256-KB sectors - secures bootloader regions. |
| Automotive qualification | AEC-Q100 Grade 3 certified (–40°C to +85°C), ISO/TS16949 compliant - qualified for engine control and ADAS ECUs. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and real-time control algorithms in an AEC-Q100-compliant ECU. IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 96 ns random access and 333 MBps sequential reads for fast startup and OTA updates. Use Value: Enables sub-100 ms cold boot and secure field updates via ECC-protected 256-KB sector erase, meeting ASIL-B functional safety requirements. | Use Scenario: Holding firmware and configuration data for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: High-reliability NOR flash with 20-year data retention and deep power-down (8 µA) for energy-efficient standby modes. Use Value: Eliminates need for external backup power or supercapacitors during brownouts due to fast wake-up (300 µs) and robust sector protection. |
| Medical Imaging System Boot Memory | 5G Baseband Processor Code Storage |
Use Scenario: Hosting boot ROM and diagnostic firmware in portable ultrasound devices requiring rapid power cycling. IC Role / Device Role / Timing Role: Low-latency HYPERBUS™ interface delivering 166 MHz DDR reads to accelerate FPGA configuration and DSP initialization. Use Value: Reduces boot time by >40% vs. parallel NOR, while ECC and CRC ensure integrity of life-critical imaging algorithms. | Use Scenario: Storing baseband firmware and calibration tables in 5G small cell radios with strict thermal and power constraints. IC Role / Device Role / Timing Role: High-bandwidth, low-power flash interfacing directly with ARM Cortex-A application processors via HYPERBUS™ PHY. Use Value: Achieves 333 MBps read bandwidth with <80 mA active current, avoiding bottlenecks in multi-GHz RF processing pipelines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4 Mb Quad SPI FRAM; no erase latency, unlimited endurance, but max 40 MBps read speed. | Best for frequent write-intensive logging; unsuitable for boot code due to density and interface mismatch. | Select only when byte-level writes and zero write latency outweigh density and bandwidth needs. |
| S26KS512SDABHM020 | Same 512 Mb density and FBGA package, but 3.0 V I/O (not 1.8 V); 100 MHz max clock (200 MBps), single-ended CK. | Compatible pinout and software, but requires higher VCCQ and lacks differential clock noise immunity. | Choose for legacy 3.0 V systems where EMI sensitivity is low and 200 MBps suffices. |
Compared with CY15B104QN-PSOC and S26KS512SDABHM020, S26KL512SDABHM020 uniquely balances 333 MBps bandwidth, automotive qualification, and 1.8 V low-power operation - making it optimal for next-gen ADAS and edge AI boot memory where speed, density, and reliability converge.
Availability
S26KL512SDABHM020 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, medical imaging boot systems, and 5G baseband processor code storage requiring stable component supply across extended lifecycle programs.
Supply support for S26KL512SDABHM020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS16949.
The HYPERFLASH™ product line targets high-performance embedded systems requiring fast, reliable, and automotive-qualified non-volatile memory - specifically optimized for boot code execution and firmware updates in resource-constrained, safety-critical platforms.
FAQ
What is the function of the RWDS signal in S26KL512SDABHM020?
RWDS (Read Data Strobe) is a source-synchronous output that indicates valid data edges on DQ[7:0] during read operations. It is referenced to CK/CK# transitions and used exclusively for reads-not writes-to enable precise timing capture by the host controller. RWDS does not drive during write or command phases, and its duty cycle matches the data valid window.
Does S26KL512SDABHM020 support both linear and wrapped burst modes?
Yes, S26KL512SDABHM020 supports both linear and wrapped burst modes per transaction. Wrapped bursts are configurable for 16, 32, or 64 bytes; linear bursts continue sequentially until CS# deassertion. The mode is selected dynamically via command, allowing mixed-mode operation across different memory regions for optimal cache-line or DMA alignment.
How does the embedded algorithm controller (EAC) affect host software design?
Host software interacts only with command registers and status bits-the EAC handles all low-level program/erase sequencing internally. This eliminates need for host-side timing loops or voltage ramping logic. Software initiates operations with standard commands (e.g., 0x10 for program, 0x20 for sector erase) and polls status register bit 7 (READY/BUSY) for completion, simplifying driver development.
Is RSTO# output configurable for duration and polarity?
Yes, RSTO# pulse width is user-configurable via non-volatile configuration register bits (CR[15:12]). Valid durations range from 1 ms to 128 ms in powers of two. Polarity is fixed active-low, and RSTO# asserts after VCC/VCCQ stabilize and internal power-on reset completes-providing a clean, synchronized system reset independent of external RC networks.
S26KL512SDABHM020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL512SDABHM020 FAQ
1.How can I place an order for S26KL512SDABHM020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL512SDABHM020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL512SDABHM020 reliable?
The price and inventory of S26KL512SDABHM020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHM020 is usually 5 days.
3.What payment methods are accepted for S26KL512SDABHM020?
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S26KL512SDABHM020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL512SDABHM020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL512SDABHM020?
For technical support, including S26KL512SDABHM020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHM020 requirements.
6.How does Aetrix verify that S26KL512SDABHM020 is sourced from the original manufacturer or authorized distributors?
All S26KL512SDABHM020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHM020 meets industry standards.
7.What is the process for return or replacement of S26KL512SDABHM020?
All S26KL512SDABHM020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHM020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL512SDABHM020 part is unused and in its original packaging.
Return procedure for S26KL512SDABHM020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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