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Infineon Technologies S26KL512SDABHM033

Part No.:
S26KL512SDABHM033
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL512SDABHM033.pdf
Description:
IC FLASH 256MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,305

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Product details

Overview

S26KL512SDABHM033 from Infineon Technologies is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), and 8-bit data bus (DQ[7:0]). It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and features ECC 1-bit correction/2-bit detection for automotive-grade reliability in –40°C to +105°C environments.

For engineers reviewing the S26KL512SDABHM033 datasheet, S26KL512SDABHM033 pinout, S26KL512SDABHM033 application, or S26KL512SDABHM033 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-synchronized DDR read strobe behavior, 512-byte program buffer efficiency, and AEC-Q100 Grade 2 qualification for ADAS and infotainment boot storage.

Technical Context

The S26KL512SDABHM033 implements a synchronous DDR interface using differential CK/CK# for precise timing capture and RWDS as a read-data strobe referenced to CK edges. Its MIRRORBIT™ architecture enables 16-bit word-aligned addressing and page-based access with 32-byte pages composed of two 16-byte half-pages.

Internal control logic splits functionality between Host Interface Controller (HIC) for signal-level protocol handling and Embedded Algorithm Controller (EAC) for autonomous execution of program/erase sequences. Command/address/data all transfer over the same 8-bit DQ bus in DDR fashion, eliminating dedicated address pins.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512 Mb (64 MB) - supports full OS image or multi-application firmware storage in space-constrained automotive ECUs.
Interface Protocol HYPERTBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read throughput via dual-edge DQ sampling.
Clock Input Differential CK/CK# - enables robust high-speed timing margin in noisy automotive environments without single-ended clock skew.
Read Latency 96 ns initial random access, 5–16 clock cycles - determines minimum boot code fetch delay before first instruction execution.
ECC Capability 1-bit correction / 2-bit detection - ensures functional safety compliance (ISO 26262 ASIL-B) for critical boot memory paths.
Endurance & Retention 100,000 program/erase cycles, 20-year data retention - validated for lifetime operation in automotive powertrain and chassis modules.
Operating Temperature –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood and infotainment head unit deployment without derating.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CK / CK# Differential clock input Defines sampling edge for all DDR transfers; CK# enables skew cancellation and jitter immunity up to 166 MHz.
CS# Chip select (active low) Enables device communication; HIGH places device in standby (25 µA) or deep power-down (4 µA).
RWDS Read data strobe output Edge-aligned with read data on DQ; used by host to latch valid data during burst reads - no separate address bus required.
DQ[7:0] Bi-directional DDR data bus Carries command, address, and data in time-multiplexed DDR format; eliminates 20+ address pins of legacy parallel NOR.
INT# Interrupt output Asserts on ECC error detection or busy-to-ready transition - enables real-time fault reporting without polling.
RSTO# Reset output User-configurable LOW pulse duration for system-level power-on reset coordination with MCU or PMIC.

Key Features

Feature Design Value
HYPERBUS™ DDR interface Reduces interface pin count to 12 signals (vs ≥40 for x16 parallel NOR), enabling smaller PCB footprints and lower EMI.
Configurable burst modes Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line alignment for ARM Cortex-A/R cores.
512-byte program buffer Enables 1 MBps effective programming rate (vs 4 KBps for single-word writes), accelerating firmware field updates.
Advanced sector protection Volatile and non-volatile lock bits per 256-KB sector - prevents accidental overwrite of bootloader or calibration data in production.
Low-power modes Deep power-down draws only 4 µA at 85°C - extends battery life in always-on telematics modules during vehicle sleep states.

Applications

Automotive ADAS Camera Module Infotainment Head Unit

Use Scenario: Stores boot firmware and real-time vision processing algorithms for front-facing camera ECU.

IC Role / Device Role / Timing Role: Primary boot memory with deterministic <96 ns random access and ECC-protected read path for ASIL-B compliance.

Use Value: Enables sub-100 ms cold boot time and continuous integrity checking of neural network weights during runtime.

Use Scenario: Holds Linux kernel, GUI assets, and OTA update staging area in 10-inch touchscreen head units.

IC Role / Device Role / Timing Role: High-throughput code execution memory interfaced directly to i.MX8MP's HYPERBUS™ controller.

Use Value: Delivers 333 MBps sequential reads to sustain 60 fps UI rendering and concurrent audio/video decode streams.

Electric Vehicle Battery Management System Commercial Telematics Gateway

Use Scenario: Stores cell-balancing firmware, calibration tables, and SOC/SOH history logs in BMS master controller.

IC Role / Device Role / Timing Role: Non-volatile configuration and logging memory with 20-year retention and 100K-cycle endurance.

Use Value: Eliminates need for external EEPROM backup; retains critical safety data across 15+ year vehicle lifecycle.

Use Scenario: Hosts dual-firmware images (active + recovery) and secure boot keys for LTE/C-V2X gateway modules.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with one-time-programmable (OTP) 1024-byte array for cryptographic keys.

Use Value: Supports FIPS 140-2 Level 3–aligned secure boot without external TPM, reducing BOM cost and latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress S26KS512SDABHM020 Same 512 Mb density and HYPERBUS™ interface, but rated for Industrial (–40°C to +85°C) only; lacks AEC-Q100 certification. Not suitable for under-hood or safety-critical systems requiring Grade 2 thermal rating. Select only for cost-sensitive industrial HMI where automotive qualification is unnecessary.
Winbond W25Q512JWIM > 1.8 V Quad SPI interface (not HYPERBUS™); max 133 MHz clock, 66 MBps read; no RWDS or differential clock. Requires host-side protocol translation and cannot match 333 MBps throughput or deterministic latency. Use only when board layout prohibits FBGA or when existing QSPI controller lacks HYPERBUS™ support.

Compared with S26KL512SDABHM033, the Cypress alternative sacrifices automotive qualification for lower cost, while the Winbond option trades interface bandwidth and timing precision for broader controller compatibility - neither matches its combination of speed, ECC, and AEC-Q100 Grade 2 in a single package.

Availability

S26KL512SDABHM033 is available at Aetrix Electronics and suitable for automotive ADAS, infotainment head units, battery management systems, and telematics gateways requiring stable component supply across extended product lifecycles.

Supply support for S26KL512SDABHM033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for industrial and automotive markets.

The HYPERFLASH™ product line targets high-speed, low-pin-count boot and code storage in automotive ECUs and industrial controllers where parallel NOR footprint and SPI bandwidth are limiting factors.

FAQ

What is the purpose of the RWDS signal in S26KL512SDABHM033?

RWDS (Read Data Strobe) is an output signal synchronized to read data transitions on DQ[7:0]. It provides edge-aligned timing reference for the host to correctly sample DDR read data, eliminating setup/hold timing constraints that would otherwise require complex PCB routing or slower clock rates. RWDS is not used during write operations.

Does S26KL512SDABHM033 support both 1.8 V and 3.0 V I/O operation?

No - S26KL512SDABHM033 is a 1.8 V I/O variant only, indicated by the "D" in the part number suffix. It requires 1.8 V VCCQ and uses differential CK/CK# signaling. The 3.0 V I/O variants (e.g., S26KL512S*ABHM030) use single-ended CK and different timing specifications.

How does the 512-byte program buffer improve firmware update performance?

The 512-byte buffer allows the device to accept a full cache-line-sized write in one burst, then internally program all 512 bytes in ~475 µs. This achieves ~1 MBps effective programming rate - over 250× faster than single-word programming (500 µs per 2 bytes), significantly reducing OTA update time in automotive systems.

Is RSTO# output configurable for different reset pulse durations?

Yes - RSTO# pulse width is programmable via internal configuration registers. Users can set LOW periods from 100 ns to 100 ms in steps, enabling synchronization with diverse MCU power-on reset requirements or PMIC sequencing delays without external circuitry.

S26KL512SDABHM033 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
HyperBus
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL512SDABHM033 FAQ

1.How can I place an order for S26KL512SDABHM033 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL512SDABHM033 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL512SDABHM033 reliable?

The price and inventory of S26KL512SDABHM033 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHM033 is usually 5 days.

3.What payment methods are accepted for S26KL512SDABHM033?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL512SDABHM033 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KL512SDABHM033?

S26KL512SDABHM033 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL512SDABHM033 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL512SDABHM033?

For technical support, including S26KL512SDABHM033 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHM033 requirements.

6.How does Aetrix verify that S26KL512SDABHM033 is sourced from the original manufacturer or authorized distributors?

All S26KL512SDABHM033 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHM033 meets industry standards.

7.What is the process for return or replacement of S26KL512SDABHM033?

All S26KL512SDABHM033 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHM033, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL512SDABHM033 part is unused and in its original packaging.

Return procedure for S26KL512SDABHM033:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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