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Infineon Technologies S26KL512SDABHV023

Part No.:
S26KL512SDABHV023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL512SDABHV023.pdf
Description:
IC FLASH 256MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,727

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Product details

Overview

S26KL512SDABHV023 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DDR data bus (DQ[7:0]), and read data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, and supports industrial-plus temperature range (–40°C to +105°C) in 24-ball FBGA package for embedded boot code storage in automotive ADAS controllers.

For engineers reviewing the S26KL512SDABHV023 datasheet, S26KL512SDABHV023 pinout, S26KL512SDABHV023 application, or S26KL512SDABHV023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), ECC 1-bit correction/2-bit detection capability, RWDS-synchronized DDR read alignment, and deep power-down current (8 µA typical) for low-power firmware update scenarios.

Technical Context

The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for high-density NOR storage and supports both wrapped (16/32/64-byte) and linear burst modes with hybrid burst configuration.

HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR timing; read operations use edge-aligned data relative to RWDS transitions, and write operations require center-aligned command/address with precise setup/hold timing referenced to CK/CK#. Initial latency ranges from 5–16 clock cycles depending on configuration.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - supports full boot image + firmware partitioning for complex microcontrollers
Interface StandardHYPERTBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe for deterministic timing
Max Read Throughput333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte per transfer, enabling fast XIP execution
Random Access Time96 ns - initial latency for page-aligned reads, critical for interrupt response in real-time systems
Operating Voltage1.8 V I/O, 3.0 V core - allows direct interfacing with 1.8 V SoC I/O rails while maintaining robust core operation
ECC Support1-bit correction / 2-bit detection - hardware-implemented error handling for mission-critical automotive firmware storage
Temperature Range–40°C to +105°C (Industrial Plus) - qualified for under-hood ADAS ECUs and industrial HMIs

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for all DDR timing; CK rising/falling edges sample command/address; CK# provides noise immunity
CS#Chip select (active-low)Enables device communication; HIGH places device in standby or deep power-down mode
RWDSRead data strobe outputIndicates valid read data windows; edges aligned with DQ transitions during read bursts
DQ[7:0]DDR bidirectional data busCarries command, address, and 16-bit data (LSB/MSB per half-cycle); requires controlled impedance routing
INT#Interrupt outputAsserts on ECC error detection or busy-to-ready transition, enabling asynchronous host notification
RSTO#Reset outputGenerates system-level power-on reset pulse; duration configurable via non-volatile register

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces pin count vs parallel NOR while sustaining >300 MBps read speed - ideal for space-constrained SoC designs
Configurable burst modeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill efficiency for different CPU architectures
512-byte program bufferEnables 1 MBps effective programming rate - cuts firmware update time by ~2× vs single-word writes
Deep power-down mode8 µA typical current draw with 300 µs wake-up - preserves battery life in always-on telematics modules
Automotive qualificationAEC-Q100 Grade 2 (–40°C to +105°C) and ISO/TS16949 certified - meets functional safety requirements for ASIL-B systems

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Storing boot loader, safety monitor, and sensor fusion firmware in radar/EPS ECUs requiring AEC-Q100 compliance.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable HYPERBUS™ interface enabling zero-wait-state execution from flash.

Use Value: 333 MBps read throughput reduces boot time by >40% vs legacy parallel NOR; ECC ensures firmware integrity across 15-year vehicle lifecycle.

Use Scenario: Holding field-upgradable control logic and HMI assets in modular automation controllers deployed in harsh factory environments.

IC Role / Device Role / Timing Role: High-reliability firmware repository with sector protection and 100K erase cycles for frequent OTA updates.

Use Value: 256-KB uniform sectors simplify partition management; deep power-down mode extends backup battery life during brownout events.

Medical Imaging System Boot Memory5G Baseband Radio Unit Firmware

Use Scenario: Hosting secure boot ROM and diagnostic firmware in portable ultrasound devices requiring extended temperature operation.

IC Role / Device Role / Timing Role: Certified industrial-plus flash providing deterministic read latency (96 ns) for real-time image processing initialization.

Use Value: RSTO# output synchronizes system reset with power rail stabilization; 20-year data retention guarantees long-term regulatory compliance.

Use Scenario: Storing FPGA configuration bitstreams and DSP firmware in outdoor macrocell radios exposed to wide thermal swings.

IC Role / Device Role / Timing Role: High-speed, low-pin-count flash interfaced directly to FPGA HYPERBUS™ PHY blocks for minimal PCB layer count.

Use Value: 24-ball FBGA footprint saves >35% board area vs QFP alternatives; CRC and ECC protect against cosmic-ray-induced bit flips.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KS512SDABHV020Same HYPERBUS™ interface, identical 512 Mb density and 24-ball FBGA package, but rated for industrial (–40°C to +85°C) onlyLacks Industrial Plus temperature rating and AEC-Q100 Grade 2 qualificationSelect when automotive qualification is not required and cost optimization is prioritized
Macronix MX66U51235FMI-10GOCTAL SPI interface (8-line DDR), 512 Mb density, 24-ball WSON package, 133 MHz max clock, no built-in ECCRequires SPI controller with octal support; lacks RWDS synchronization and integrated error correctionSelect when existing platform uses octal SPI and external ECC logic is acceptable

Compared with S26KL512SDABHV023, the Cypress alternative trades temperature grade for lower cost in non-automotive settings, while the Macronix part shifts to octal SPI-reducing timing margin and increasing host software complexity due to missing hardware ECC and RWDS-based DDR alignment.

Availability

S26KL512SDABHV023 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot memory requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for S26KL512SDABHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification infrastructure.

This device belongs to the HYPERFLASH™ family - designed specifically for high-speed, low-pin-count boot memory in automotive, industrial, and communications systems where DDR timing predictability and ECC reliability are mandatory.

FAQ

What is the minimum wake-up time from Deep Power-Down mode?

The S26KL512SDABHV023 requires 300 µs to exit Deep Power-Down mode and resume normal operation. This fixed wake-up latency is specified across the full industrial-plus temperature range and does not vary with VCC or clock frequency. The device automatically reinitializes internal state and validates memory array integrity before accepting new commands.

Does RWDS function during write operations?

No, RWDS operates exclusively as a read data strobe and remains inactive during write transactions. The datasheet explicitly states that HYPERFLASH™ memories use RWDS only for read operations to indicate valid data windows synchronized to CK/CK# edges. Write data timing is governed solely by DQ setup/hold relative to CK.

How is sector protection configured - volatile or non-volatile?

Sector protection supports both volatile (cleared on power cycle) and non-volatile (retained after reset) modes, controlled independently per 256-KB sector via dedicated status registers. Non-volatile protection is enabled using the Write Protection Register command and persists through power loss, making it suitable for safeguarding bootloader regions in safety-critical systems.

Can this device be used with a 3.0 V I/O interface?

No - S26KL512SDABHV023 is a 1.8 V I/O variant (denoted by 'D' in the part number suffix). It requires 1.8 V VCCQ and supports differential clock signaling (CK/CK#). The 3.0 V I/O version is designated as S26KL512SBABHV023 and uses single-ended clock; mixing voltage variants risks interface failure and violates absolute maximum ratings.

S26KL512SDABHV023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
HyperBus
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL512SDABHV023 FAQ

1.How can I place an order for S26KL512SDABHV023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL512SDABHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL512SDABHV023 reliable?

The price and inventory of S26KL512SDABHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHV023 is usually 5 days.

3.What payment methods are accepted for S26KL512SDABHV023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL512SDABHV023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KL512SDABHV023?

S26KL512SDABHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL512SDABHV023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL512SDABHV023?

For technical support, including S26KL512SDABHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHV023 requirements.

6.How does Aetrix verify that S26KL512SDABHV023 is sourced from the original manufacturer or authorized distributors?

All S26KL512SDABHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHV023 meets industry standards.

7.What is the process for return or replacement of S26KL512SDABHV023?

All S26KL512SDABHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHV023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL512SDABHV023 part is unused and in its original packaging.

Return procedure for S26KL512SDABHV023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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