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Infineon Technologies S26KS128SDABHA030

Part No.:
S26KS128SDABHA030
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS128SDABHA030.pdf
Description:
IC FLASH 128MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,021

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Product details

Overview

S26KS128SDABHA030 from Infineon Technologies is a 128 Mb (16 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, 1-bit ECC correction/2-bit detection, and operates from –40°C to +105°C (Industrial Plus grade) in automotive and industrial embedded boot memory applications.

For engineers reviewing the S26KS128SDABHA030 datasheet, S26KS128SDABHA030 pinout, S26KS128SDABHA030 application, or S26KS128SDABHA030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), RWDS-synchronized DDR read alignment, configurable burst length (16/32/64 bytes), deep power-down current (4 µA), and AEC-Q100 Grade 2 qualification for automotive control units.

Technical Context

The S26KS128SDABHA030 implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS timing alignment, while Embedded Algorithm Controller (EAC) executes autonomous program/erase sequences without host intervention. Its MIRRORBIT™ NOR core enables word-wide (16-bit) addressing and page-aligned 32-byte random reads.

It uses center-aligned command/address transfers and edge-aligned read data relative to RWDS transitions, supporting both wrapped (circular) and linear burst modes. The device requires no wake-up from active clock stop (12 mA) or standby (25 µA), and features RSTO# for system-level power-on reset with user-configurable LOW pulse duration.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 Mb (16 MB) - fixed capacity for boot code storage in resource-constrained microcontrollers.
Interface Protocol HYPERRBUS™ DDR - 8-bit bidirectional data bus with differential CK/CK# clock, eliminating parallel address bus overhead.
Max Read Throughput 333 MBps - achieved via dual-edge 8-bit transfers at 166 MHz, enabling fast application loading in ADAS ECUs.
Random Access Time 96 ns - initial latency for first word retrieval, critical for deterministic boot time in real-time systems.
ECC Capability 1-bit correction / 2-bit detection - hardware-implemented error handling for field-reliable firmware storage.
Operating Temperature –40°C to +105°C (Industrial Plus) - qualified per AEC-Q100 Grade 2 for under-hood automotive use.
Endurance & Retention 100,000 program/erase cycles / 20-year data retention - ensures long-term reliability in infotainment and gateway modules.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CK / CK# Differential clock input Reference for all DDR timing; enables precise sampling of DQ and RWDS edges in high-noise environments.
CS# Chip select (active low) Enables device communication; HIGH places device in standby (25 µA) or deep power-down (4 µA).
RWDS Read data strobe output Indicates valid read data on DQ; synchronized to data edges, not clock - essential for timing margin in high-speed reads.
DQ[7:0] Bidirectional DDR data bus Transfers 16-bit words across two clock edges per cycle; shared for commands, addresses, and data.
INT# Interrupt output Asserts on ECC error detection or busy-to-ready transition - enables host firmware to avoid polling.
RSTO# Reset output Drives system-level POR; LOW pulse duration programmable via configuration register for custom power sequencing.

Key Features

Feature Design Value
Configurable burst mode Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes bandwidth for sequential code fetch vs. scattered config reads.
Program buffer 512-byte write buffer enables ~1 MBps programming speed - reduces host CPU wait time during firmware updates.
Advanced sector protection Volatile and non-volatile lock bits per 256-KB sector - prevents accidental overwrite of bootloader or calibration data.
Low-power operation Deep power-down draws only 4 µA at 85°C - extends battery life in always-on telematics modules.
One-time programmable array 1024-byte OTP area for secure keys or unique device identifiers - isolated from main array for tamper resistance.

Applications

Automotive ADAS Camera Module Industrial PLC Firmware Storage

Use Scenario: Stores boot firmware and image processing algorithms for front-facing camera ECU requiring <100 ms cold boot.

IC Role / Device Role / Timing Role: Primary boot memory interfaced directly to ARM Cortex-R5F MCU via HYPERBUS™, delivering 333 MBps read speed with sub-100 ns latency.

Use Value: Eliminates external SRAM cache by sustaining linear burst reads across full 32-byte pages, reducing BOM cost and PCB area.

Use Scenario: Holds field-upgradable ladder logic and safety-critical motion control firmware in DIN-rail mounted PLCs operating at 85°C ambient.

IC Role / Device Role / Timing Role: Non-volatile program store with AEC-Q100 Grade 2 qualification and 20-year retention - certified for SIL-3 functional safety systems.

Use Value: Sector protection and 1-bit ECC prevent runtime corruption during brown-out events, avoiding unsafe machine states.

Medical Imaging Control Board 5G Small Cell Baseband Processor

Use Scenario: Stores FPGA configuration bitstream and real-time DSP firmware in portable ultrasound devices with strict thermal limits.

IC Role / Device Role / Timing Role: High-reliability boot memory using deep power-down (4 µA) between imaging sessions to meet IEC 60601-1 battery runtime requirements.

Use Value: 100,000-cycle endurance supports frequent firmware patches during clinical validation without premature wear-out.

Use Scenario: Provides low-latency boot code and protocol stack for Xilinx Zynq UltraScale+ RFSoC in outdoor small cell radios exposed to temperature cycling.

IC Role / Device Role / Timing Role: HYPERBUS™ interface replaces legacy QSPI, cutting read latency by 40% and enabling faster beamforming algorithm load times.

Use Value: RWDS-synchronized DDR timing ensures deterministic data capture at 166 MHz despite RF-induced signal jitter on PCB traces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress S26KL128SDABHA020 Same density and package, but rated for Industrial (–40°C to +85°C) only; lacks AEC-Q100 Grade 2 certification. Not suitable for under-hood automotive use; acceptable for indoor industrial gateways. Select when temperature range and automotive qualification are not required - lower cost alternative.
Infineon S26KS256SDABHA030 256 Mb density, identical timing, package, and qualification; doubles storage capacity at same footprint. Used where larger boot images or dual-firmware redundancy are needed (e.g., OTA update staging). Select when future-proofing or increased code size justifies higher density - pin- and software-compatible upgrade path.

Compared with S26KL128SDABHA020, this part adds automotive-grade reliability and wider temperature tolerance; compared with S26KS256SDABHA030, it offers optimal cost-per-MB for compact boot memory designs without over-provisioning.

Availability

S26KS128SDABHA030 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, medical imaging controllers, and 5G small cell baseband processors requiring stable component supply, AEC-Q100 compliance, and high-speed boot memory performance.

Supply support for S26KS128SDABHA030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and communications markets.

This device belongs to the HYPERFLASH™ family - designed specifically to replace legacy parallel NOR and QSPI flash in high-performance embedded systems demanding >200 MBps read bandwidth and deterministic low-latency access.

FAQ

What voltage levels does the S26KS128SDABHA030 support for VCC and VCCQ?

The device operates with 1.8 V for both core (VCC) and I/O (VCCQ) supply rails. It is not compatible with 3.0 V I/O operation - the 'D' suffix in the part number denotes the 1.8 V-only variant. All timing specifications (including 166 MHz max clock rate and 96 ns tACC) are guaranteed only at 1.8 V.

Does the S26KS128SDABHA030 require external termination resistors for the CK/CK# or DQ lines?

Yes - the datasheet specifies 40 Ω series source termination on CK/CK# and 50 Ω parallel AC termination on DQ[7:0] at the memory side. These values are mandatory to meet setup/hold timing margins at 166 MHz and prevent signal integrity issues in high-speed DDR routing.

How is the RWDS signal used during read operations, and can it be disabled?

RWDS is an active output driven by the device during read data transfer and cannot be disabled. It toggles synchronously with read data edges and must be used by the host controller to latch DQ values. Its timing relationship to CK/CK# is defined in the DCARS (DDR Center-Aligned Read Strobe) specification and is fundamental to correct data capture.

Is the 1024-byte one-time programmable (OTP) array accessible via standard read commands?

No - the OTP array resides in a separate address space (0x0000_0000–0x0000_03FF) and requires dedicated unlock sequences and command codes (e.g., 0x60 followed by 0xD0) to enable write access. Standard read commands access only the main flash array; OTP reads use the same timing but require prior configuration of the OTP enable bit in the configuration register.

S26KS128SDABHA030 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
HyperBus
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS128SDABHA030 FAQ

1.How can I place an order for S26KS128SDABHA030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS128SDABHA030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS128SDABHA030 reliable?

The price and inventory of S26KS128SDABHA030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDABHA030 is usually 5 days.

3.What payment methods are accepted for S26KS128SDABHA030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDABHA030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS128SDABHA030?

S26KS128SDABHA030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS128SDABHA030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS128SDABHA030?

For technical support, including S26KS128SDABHA030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDABHA030 requirements.

6.How does Aetrix verify that S26KS128SDABHA030 is sourced from the original manufacturer or authorized distributors?

All S26KS128SDABHA030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDABHA030 meets industry standards.

7.What is the process for return or replacement of S26KS128SDABHA030?

All S26KS128SDABHA030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDABHA030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS128SDABHA030 part is unused and in its original packaging.

Return procedure for S26KS128SDABHA030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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