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Infineon Technologies S26KS128SDGBHI030

Part No.:
S26KS128SDGBHI030
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS128SDGBHI030.pdf
Description:
IC FLASH 128MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,373

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Product details

Overview

S26KS128SDGBHI030 from Infineon Technologies is a 128 Mb (16 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, supporting 1.8 V I/O and differential clock (CK/CK#), delivering 333 MBps sustained read throughput at 166 MHz, 96 ns initial random access time, and ECC 1-bit correction/2-bit detection - deployed in automotive infotainment boot code storage.

For engineers reviewing the S26KS128SDGBHI030 datasheet, S26KS128SDGBHI030 pinout, S26KS128SDGBHI030 application, or S26KS128SDGBHI030 equivalent, key selection criteria include HYPERBUS™ timing compliance (tACC ≤ 96 ns), RWDS-synchronized DDR read strobe behavior, sector protection granularity (256 KB uniform + optional 4 KB parameter sectors), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements a DDR center-aligned read strobe (DCARS) architecture where command/address and data are transferred over the same 8-bit DQ bus using double-data-rate signaling synchronized to CK/CK#. RWDS output is edge-aligned to CK transitions during reads, enabling precise data capture by the host controller.

The embedded algorithm controller (EAC) manages all non-volatile operations - including 512-byte buffer programming (475 µs), 256 KB sector erase (930 ms), and volatile/non-volatile sector protection - without host intervention. Memory array uses MIRRORBIT™ technology for high endurance (100,000 cycles) and 20-year data retention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) organized as 8,388,608 × 16-bit words
Interface StandardHYPERTBUS™ DDR with 12-signal bus: CK/CK#, CS#, DQ[7:0], RWDS, RSTO#, INT#, PSC/PSC#
Max Read Throughput333 MBps sustained (166 MHz clock × 2 transfers/cycle × 1 byte)
Initial Access Latency96 ns tACC; 5–16 clock cycles depending on configuration and address alignment
ECC Capability1-bit error correction and 2-bit error detection per 512-byte sector
Operating Temp RangeIndustrial Plus: –40°C to +105°C (AEC-Q100 Grade 2 qualified)
Endurance & Retention100,000 program/erase cycles; 20-year data retention at max operating temperature

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputDDR timing reference; enables 166 MHz operation with precise edge alignment for DQ and RWDS
CS#Chip select (active low)Enables device communication; must be asserted before command/address transfer
RWDSRead data strobe outputIndicates valid read data on DQ; edge-aligned to CK transitions during burst reads
DQ[7:0]Bi-directional data busTransfers command, address, and 8-bit DDR data; supports both wrapped (16/32/64-byte) and linear bursts
INT#Interrupt outputSignals Busy→Ready transition or ECC error detection event to host system
RSTO#Reset outputUser-configurable active-low reset pulse for system power-on initialization
PSC / PSC#Power supply control inputsEnable deep power-down mode (8 µA typical) with 300 µs wake-up latency

Key Features

FeatureDesign Value
HYPERBUS™ DDR InterfaceReduces signal count to 12 pins while achieving 333 MBps read speed - eliminates need for parallel NOR or QSPI scaling bottlenecks
Configurable Burst ModeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fetches and DMA efficiency
512-Byte Program BufferEnables 1 MBps effective write speed via buffered programming - reduces host CPU overhead vs. single-word writes
Hardware ECC EngineOn-the-fly 1-bit correction/2-bit detection per 512-byte sector - eliminates need for software ECC layer in safety-critical boot code
AEC-Q100 Grade 2 QualificationValidated for automotive applications up to +105°C - includes HTOL, ESD, and thermal cycling per ISO/TS 16949

Applications

Automotive ADAS Boot StorageIndustrial PLC Firmware Image

Use Scenario: Storing boot firmware for radar processing units requiring fast, deterministic load times under extended temperature.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to SoC HYPERBUS™ master; provides sub-100 ns random access for vector table fetch.

Use Value: 333 MBps sustained read eliminates wait states during image decompression; ECC ensures ASIL-B compliant integrity without external checksum validation.

Use Scenario: Holding field-upgradable firmware for programmable logic controllers operating in factory automation environments.

IC Role / Device Role / Timing Role: Standalone flash memory mapped into processor address space; supports in-system programming via RS-485 or Ethernet-based update protocols.

Use Value: Sector protection (256 KB uniform + 4 KB parameter sectors) isolates critical bootloader from application updates; 100K-cycle endurance supports >10 years of field revisions.

Medical Imaging System Code StorageAvionics Display Controller Memory

Use Scenario: Hosting real-time OS kernel and diagnostic modules in portable ultrasound devices with strict thermal and reliability constraints.

IC Role / Device Role / Timing Role: High-reliability code storage device with deep power-down support during idle periods; interfaces to ARM Cortex-A series MCU via HYPERBUS™ PHY.

Use Value: 25 µA standby current extends battery life; 20-year data retention meets IEC 62304 Class C software lifecycle requirements.

Use Scenario: Storing display firmware and font assets in certified cockpit display units requiring DO-254 compliance.

IC Role / Device Role / Timing Role: Certified non-volatile memory used for boot ROM and configuration tables; operates in extended temperature range (–40°C to +105°C).

Use Value: AEC-Q100 Grade 2 qualification satisfies DO-160 environmental test requirements; RSTO# output synchronizes display subsystem reset with main processor power-on sequence.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S26KL128SDGBHI0303.0 V I/O variant with single-ended clock (CK only); 100 MHz max clock; 200 MBps read throughputLimited to industrial temperature (–40°C to +85°C); no AEC-Q100 grade optionsSelect when legacy 3.0 V systems require pin compatibility but do not need differential clock noise immunity or Grade 2 temp rating
S26KS256SDGBHI030256 Mb density (32 MB); identical 1.8 V HYPERBUS™ interface, timing, and package; same AEC-Q100 Grade 2 ratingHigher capacity for multi-image storage (e.g., dual-boot or fail-safe firmware partitions)Select when firmware size exceeds 16 MB or future-proofing for larger feature sets is required without changing PCB layout

Compared with S26KL128SDGBHI030, this part delivers 66% higher bandwidth and automotive-grade thermal robustness; versus S26KS256SDGBHI030, it offers optimal cost-per-MB for compact boot images while maintaining identical timing, ECC, and qualification - ideal for space-constrained ADAS ECUs.

Availability

S26KS128SDGBHI030 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, medical imaging subsystems, and avionics display controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S26KS128SDGBHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This device belongs to the HYPERFLASH™ family - designed specifically to replace parallel NOR and QSPI flash in bandwidth-constrained embedded systems requiring deterministic, high-speed code execution from non-volatile memory.

FAQ

What voltage levels does S26KS128SDGBHI030 support for I/O and core operation?

The device supports 1.8 V for both VCC and VCCQ, with all I/O signals (CK/CK#, DQ[7:0], RWDS, etc.) referenced to 1.8 V. It does not support mixed-voltage operation or 3.0 V I/O - use S26KL128SDGBHI030 for 3.0 V systems. Absolute maximum ratings specify –0.5 V to 2.2 V on I/O pins, and DC characteristics are fully characterized at 1.8 V ±5%.

How is the RWDS signal used during read operations?

RWDS is an output-only strobe generated by the device during read bursts, edge-aligned to CK transitions. Host controllers use RWDS edges (not CK) to latch DQ data - ensuring timing margin against clock skew. RWDS remains inactive during write and command phases, and its assertion timing is defined in Table 12.2 of the datasheet (tRWDS, tRWDH, tRWDV).

Does S26KS128SDGBHI030 support hardware write protection independent of software commands?

Yes - it implements both volatile (via status register bits) and non-volatile (OTP lock bits) sector protection. The 256 KB uniform sectors and optional 4 KB parameter sectors can be individually locked. Hardware protection persists through power cycles when non-volatile bits are programmed, and requires dedicated unlock sequences to modify - preventing accidental overwrite during field updates.

What is the purpose of the PSC and PSC# pins?

PSC (Power Supply Control) and PSC# form a differential pair that enables Deep Power-Down mode. When driven to specific logic states (PSC = HIGH, PSC# = LOW), the device enters ultra-low-power state (8 µA typical), retaining memory contents. Exit requires CS# deassertion followed by 300 µs stabilization before issuing first command - documented in Section 11.8 of the datasheet.

S26KS128SDGBHI030 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
HyperBus
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS128SDGBHI030 FAQ

1.How can I place an order for S26KS128SDGBHI030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS128SDGBHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS128SDGBHI030 reliable?

The price and inventory of S26KS128SDGBHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDGBHI030 is usually 5 days.

3.What payment methods are accepted for S26KS128SDGBHI030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDGBHI030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS128SDGBHI030?

S26KS128SDGBHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS128SDGBHI030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS128SDGBHI030?

For technical support, including S26KS128SDGBHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDGBHI030 requirements.

6.How does Aetrix verify that S26KS128SDGBHI030 is sourced from the original manufacturer or authorized distributors?

All S26KS128SDGBHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDGBHI030 meets industry standards.

7.What is the process for return or replacement of S26KS128SDGBHI030?

All S26KS128SDGBHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDGBHI030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS128SDGBHI030 part is unused and in its original packaging.

Return procedure for S26KS128SDGBHI030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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