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NXP Semiconductors S26KS128SDGBHN030

Part No.:
S26KS128SDGBHN030
Manufacturer:
NXP Semiconductors
Category:
Memory
Package:
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Datasheet:
AetrixS26KS128SDGBHN030.pdf
Description:
S26KS512S - 3V 512MBIT, HYPERFLA
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Product details

Overview

S26KS128SDGBHN030 from Cypress Semiconductor is a 128 Mb (16 MB) HyperFlash™ synchronous NOR flash memory with 1.8V core/I/O, differential clock interface (CK/CK#), 8-bit DDR data bus (DQ[7:0]), and Read-Write Data Strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, supports wrapped/linear burst modes, and integrates ECC 1-bit correction/2-bit detection for automotive-grade reliability.

For engineers reviewing the S26KS128SDGBHN030 datasheet, S26KS128SDGBHN030 pinout, S26KS128SDGBHN030 application, or S26KS128SDGBHN030 equivalent, key selection criteria include HyperBus DDR timing compliance, 24-ball FBGA package compatibility, AEC-Q100 Grade 2 qualification (–40°C to +105°C), and support for DCARS-enabled RWDS phase alignment in high-speed embedded boot applications.

Technical Context

The S26KS128SDGBHN030 implements Cypress's HyperBus interface - a low-pin-count, DDR-capable protocol using CK/CK# for command/address/data capture and RWDS for edge-aligned read data strobing. It operates exclusively in 1.8V I/O mode with 12 mandatory and optional signals, including PSC/PSC# for DDR Center Aligned Read Strobe (DCARS) functionality.

Internally, it uses MirrorBit® NOR architecture with uniform 256-KB erase sectors and a 512-byte write buffer. Embedded Algorithm Controller (EAC) manages program/erase sequences, while Host Interface Controller (HIC) handles real-time signal synchronization, supporting both linear and wrapped burst reads up to 64 bytes per transaction.

Key Specifications

ParameterValue and Actual Design Meaning
Density128 Mb (16 MB) - fixed capacity for boot code storage in space-constrained automotive ECUs.
InterfaceHyperBus DDR - 8-bit bidirectional DQ bus with differential CK/CK#, RWDS output, and CS# control; eliminates parallel NOR's high pin count.
Max Clock Rate166 MHz at 1.8V - enables 333 MBps sustained read throughput (1 byte × 2 edges × 166 MHz).
Initial Access Time96 ns - deterministic latency for first word retrieval during cold boot or firmware update verification.
ECC Support1-bit correction / 2-bit detection per 16-byte half-page - hardware-level data integrity for safety-critical automotive firmware.
Operating TempAEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood engine control and ADAS domain controllers.
Power ModesDeep Power-Down: 4 µA (typical); Active Clock Stop During Read: 12 mA - enables low-quiescent-power always-on firmware storage.

Pinout & Package

Package: 24-ball FBGA (6 mm × 8 mm, 1.0 mm or 1.2 mm height), 1 mm pitch, RoHS-compliant. Ball layout conforms to Cypress's standardized 5×5 array footprint with VSS/VSSQ power separation and RFU ball assignments per model variant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for all HyperBus transactions; defines start/end of command/address/data transfer windows.
CK / CK#Differential Clock InputsMandatory for 1.8V operation; provides edge-aligned timing reference for DDR command/address/data sampling on DQ[7:0].
RWDSRead Data Strobe OutputOpen-drain output edge-aligned with read data; used for timing capture by host controller - not used during writes.
DQ[7:0]Bi-directional Data Bus8-bit DDR bus carrying commands, addresses, and 16-bit data words (MSB on rising CK/RWDS, LSB on falling CK/RWDS).
PSC / PSC#Phase Shifted Clock InputsOptional inputs enabling DCARS mode; allow RWDS edge centering within DQ valid window for timing margin optimization.
INT#Interrupt OutputOpen-drain signal asserting low upon completion of program/erase/ECC error events - eliminates polling overhead.
RSTO#Reset OutputOpen-drain POR indicator; transitions to high-impedance after user-configurable timeout, enabling system-level reset coordination.
VCC / VCCQCore & I/O PowerSeparate 1.8V supplies: VCC powers logic/core, VCCQ powers I/O drivers - improves noise isolation and signal integrity.

Key Features

FeatureDesign Value
HyperBus DDR InterfaceReduces pin count by >50% vs. legacy parallel NOR while delivering 333 MBps read bandwidth - ideal for MCU boot from flash without external bus expanders.
DCARS (DDR Center Aligned Read Strobe)Enables RWDS edge positioning via PSC/PSC# to maximize setup/hold time margins on high-speed PCB traces - critical for >133 MHz designs.
512-byte Write BufferAllows full-line programming in one command (vs. 256 individual word writes), reducing firmware update time by ~90% compared to non-buffered NOR.
Uniform 256-KB Erase SectorsEnables deterministic sector-level firmware rollback and atomic OTA updates - no partial-erase risk across 16 MB address space.
AEC-Q100 Grade 2 QualificationValidated for –40°C to +105°C operation with 100,000 program/erase cycles and 20-year data retention - meets ASIL-B functional safety requirements.

Applications

Automotive Engine Control Unit (ECU)ADAS Domain Controller Boot Memory

Use Scenario: Stores calibrated engine maps, diagnostic routines, and bootloader firmware in compact ECU modules requiring fast, reliable startup under extreme thermal stress.

IC Role / Device Role / Timing Role: Primary boot flash executing XIP (eXecute-In-Place) code directly over HyperBus; delivers sub-100 ns random access for real-time calibration lookups.

Use Value: AEC-Q100 Grade 2 rating ensures uninterrupted operation at +105°C ambient; 333 MBps read speed cuts boot time by >40% vs. QSPI NOR.

Use Scenario: Holds safety-critical perception stack firmware (camera/radar fusion) and secure boot keys in centralized ADAS domain controllers.

IC Role / Device Role / Timing Role: Secure, ECC-protected firmware repository interfaced to ARM Cortex-R52 or R5F cores via HyperBus PHY; supports encrypted read-through with CRC-32 integrity checks.

Use Value: Hardware ECC corrects single-bit errors in-flight during boot; CRC acceleration offloads host CPU from firmware image validation.

Industrial PLC Firmware StorageMedical Imaging System Boot ROM

Use Scenario: Stores programmable logic controller (PLC) runtime firmware and configuration data in factory automation systems operating continuously at elevated ambient temperatures.

IC Role / Device Role / Timing Role: Non-volatile program memory accessed via deterministic HyperBus timing - eliminates jitter-sensitive SPI/QSPI dependencies in deterministic real-time OS environments.

Use Value: Deep Power-Down mode draws only 4 µA, enabling battery-backed retention during brownouts; 256-KB uniform sectors simplify field firmware patching.

Use Scenario: Hosts boot firmware and FPGA configuration bitstreams for MRI/CT scanner subsystems requiring zero-failure boot reliability and regulatory traceability.

IC Role / Device Role / Timing Role: Certified boot ROM providing tamper-resistant firmware execution path; leverages RSTO# for synchronized system reset during power-up sequencing.

Use Value: 20-year data retention and 100,000 endurance cycles meet IEC 62304 Class C software lifecycle requirements; INT# enables immediate fault reporting to safety monitor.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S26KL128SDHBHI020Same density and HyperBus interface, but 3.0V I/O (not 1.8V); uses single-ended CK only; no PSC/PSC#; AEC-Q100 Grade 3 (–40°C to +85°C).Limited to lower-temperature industrial or infotainment head units; lacks DCARS timing margin optimization capability.Select when board already uses 3.0V I/O rails and thermal range ≤85°C; avoids level-shifter design.
MX25L12873FMI-10G128 Mb Quad SPI NOR; 104 MHz max clock; no DDR, no RWDS, no ECC; standard industrial temp (–40°C to +85°C).Suitable for cost-sensitive consumer devices; lacks automotive qualification, hardware ECC, and HyperBus bandwidth.Choose only for non-safety-critical applications where boot speed <100 MBps is acceptable and BOM cost is primary constraint.

Compared with S26KL128SDHBHI020 and MX25L12873FMI-10G, the S26KS128SDGBHN030 uniquely combines AEC-Q100 Grade 2 qualification, 1.8V DDR HyperBus performance, and hardware ECC - making it the only option for high-reliability, high-speed boot in thermally demanding automotive domains.

Availability

S26KS128SDGBHN030 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, ADAS domain controller boot memory, and industrial PLC program retention requiring stable component supply across extended product lifecycles.

Supply support for S26KS128SDGBHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, qualified memory and microcontroller solutions for automotive, industrial, and IoT applications.

The HyperFlash™ family targets high-speed, low-pin-count boot memory for automotive and industrial systems - specifically engineered to replace parallel NOR and accelerate firmware load times via DDR HyperBus interface.

FAQ

What voltage supply does the S26KS128SDGBHN030 require?

The S26KS128SDGBHN030 requires two independent 1.8V supplies: VCC for core logic and VCCQ for I/O drivers. This separation ensures signal integrity and noise immunity in automotive environments. The device does not support 3.0V operation - using 3.0V will damage the IC. Always verify decoupling capacitor placement per Cypress AN98562 layout guidelines for S26KS128SDGBHN030.

Does the S26KS128SDGBHN030 support hardware ECC, and how is it implemented?

Yes, the S26KS128SDGBHN030 implements Hamming ECC with 1-bit correction and 2-bit detection per 16-byte half-page. ECC is automatically generated during write buffer programming and checked on every read. If enabled for two-bit detection, it reports uncorrectable errors via INT# or status register. The S26KS128SDGBHN030 stores ECC syndromes in hidden array locations - no host software overhead is required for basic correction.

What is the purpose of the PSC and PSC# pins on the S26KS128SDGBHN030?

PSC and PSC# are optional differential phase-shifted clock inputs used exclusively for DDR Center Aligned Read Strobe (DCARS) mode. When enabled, they shift RWDS timing relative to CK/CK# to center RWDS edges within the DQ valid window - improving timing margin on long or lossy PCB traces. These pins are unused during write operations and may be tied low per Cypress layout recommendations for S26KS128SDGBHN030.

How does the S26KS128SDGBHN030 handle firmware updates in automotive applications?

The S26KS128SDGBHN030 supports atomic firmware updates via its 512-byte write buffer and uniform 256-KB erase sectors. A full sector can be erased and reprogrammed without affecting adjacent sectors, enabling safe dual-bank OTA updates. Its AEC-Q100 Grade 2 qualification, 100,000 program/erase cycles, and 20-year retention ensure robustness across vehicle lifetime - critical for S26KS128SDGBHN030 deployment in ECU and ADAS systems.

Is the S26KS128SDGBHN030 pin-compatible with other HyperFlash devices like the S26KS256S or S26KS512S?

No - while the S26KS128SDGBHN030 shares the same 24-ball FBGA package and HyperBus interface definition with S26KS256S and S26KS512S, pin functions are identical but density-specific timing and internal address mapping differ. Swapping densities without firmware and timing parameter revalidation risks boot failure. The S26KS128SDGBHN030 must be used with its specific initialization sequence and AC timing parameters defined in Document 001-99198 Rev. *K.

S26KS128SDGBHN030 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
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Technology:
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Access Time:
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S26KS128SDGBHN030 FAQ

1.How can I place an order for S26KS128SDGBHN030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS128SDGBHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS128SDGBHN030 reliable?

The price and inventory of S26KS128SDGBHN030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDGBHN030 is usually 5 days.

3.What payment methods are accepted for S26KS128SDGBHN030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDGBHN030 transactions.

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4.How is shipping managed for S26KS128SDGBHN030?

S26KS128SDGBHN030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS128SDGBHN030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS128SDGBHN030?

For technical support, including S26KS128SDGBHN030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDGBHN030 requirements.

6.How does Aetrix verify that S26KS128SDGBHN030 is sourced from the original manufacturer or authorized distributors?

All S26KS128SDGBHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDGBHN030 meets industry standards.

7.What is the process for return or replacement of S26KS128SDGBHN030?

All S26KS128SDGBHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDGBHN030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS128SDGBHN030 part is unused and in its original packaging.

Return procedure for S26KS128SDGBHN030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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