Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Spansion S26KS128SDGBHV030

Part No.:
S26KS128SDGBHV030
Manufacturer:
Spansion
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS128SDGBHV030.pdf
Description:
FLASH, 16MX8, 96NS, PBGA24
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:334

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S26KS128SDGBHV030 from Infineon is a 128 Mb (16 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.

For engineers reviewing the S26KS128SDGBHV030 datasheet, S26KS128SDGBHV030 pinout, S26KS128SDGBHV030 application, or S26KS128SDGBHV030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns tACC), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive boot code storage.

Technical Context

The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and data transfer synchronization with CK/CK# and RWDS, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for high-density NOR storage and supports both wrapped (16/32/64-byte) and linear burst modes.

HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers; read data is edge-aligned to RWDS transitions, while commands are center-aligned to CK edges. Initial random access latency is configurable from 5–16 clock cycles, with 96 ns maximum access time at 166 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) - fixed capacity for boot code and firmware storage in resource-constrained embedded systems
Interface StandardHYPERTBUS™ DDR - low-pin-count (11–12 signals), differential clock support enables noise-immune high-speed reads up to 333 MBps
Max Read Throughput333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 8-bit bus, enabling fast application loading from flash
Random Access Time96 ns - defines worst-case latency for first word retrieval after CS# assertion, critical for real-time boot response
Endurance & Retention100,000 P/E cycles / 20-year data retention - ensures long-term reliability in industrial control and automotive ECUs
Power ModesDeep Power-Down: 4 µA (typical) - allows ultra-low standby current during system sleep without wake-up delay
ECC Capability1-bit correction / 2-bit detection - mitigates single-event upsets in safety-critical applications without external error handling logic

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides precise edge-aligned timing reference for DDR data capture; eliminates single-ended clock skew limitations
CS#Chip select (active low)Enables device communication; must be asserted before command initiation and held active during burst transactions
RWDSRead data strobe outputIndicates valid read data windows on DQ; synchronized to data edges, not clock - essential for reliable DDR sampling
DQ[7:0]Bi-directional DDR data busCarries multiplexed commands, addresses, and 8-bit data on both clock edges; requires matched trace lengths for signal integrity
INT#Interrupt outputAsserts on Busy→Ready transition or ECC error detection - enables asynchronous host notification without polling
RSTO#Reset outputGenerates system-level power-on reset pulse; user-configurable LOW duration supports custom reset timing requirements

Key Features

FeatureDesign Value
HYPERBUS™ DDR InterfaceReduces signal count to 12 pins vs. traditional parallel NOR, enabling smaller PCB footprints and lower EMI in space-constrained designs
Configurable Burst ModeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes bandwidth utilization for sequential code fetch or random data access
Advanced Sector ProtectionVolatile and non-volatile locking per 256-KB sector - prevents accidental firmware overwrite during field updates or debug sessions
512-Byte Program BufferEnables 1 MBps effective programming rate via buffer write - cuts flash update time by ~2× vs. single-word programming (4 KBps)
AEC-Q100 Grade 3Qualified for automotive applications at –40°C to +85°C - meets functional safety requirements for instrument clusters and ADAS boot memory

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Storing boot code and GUI assets for real-time display rendering in digital dashboards.

IC Role / Device Role / Timing Role: Primary non-volatile code execution memory interfaced directly to MCU's HYPERBUS™ controller.

Use Value: 333 MBps read speed enables sub-100 ms boot time; ECC and AEC-Q100 Grade 3 ensure ASIL-B compliance.

Use Scenario: Holding firmware images and configuration tables for programmable logic controllers in factory automation.

IC Role / Device Role / Timing Role: Standalone boot memory with sector protection to prevent corruption during over-the-air updates.

Use Value: 256-KB uniform sectors allow atomic firmware partitioning; deep power-down (4 µA) extends battery backup runtime.

Medical Imaging Boot MemoryAvionics Data Logger

Use Scenario: Hosting certified bootloader and diagnostic firmware in portable ultrasound and MRI control units.

IC Role / Device Role / Timing Role: Secure, tamper-resistant code storage with CRC and ECC for regulatory audit trails.

Use Value: 20-year data retention meets FDA 21 CFR Part 11 archival requirements; INT# alerts host on ECC events for logging.

Use Scenario: Recording flight-critical sensor logs and black-box data in unmanned aerial vehicles.

IC Role / Device Role / Timing Role: High-reliability non-volatile buffer memory with extended temperature operation (–40°C to +105°C option).

Use Value: 100,000 P/E cycles support frequent log rotation; RSTO# integration simplifies power-on reset sequencing in DO-160 environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S26KS128SDABHV020Same density and HYPERBUS™ interface, but 3.0 V I/O (vs. 1.8 V); max clock 100 MHz (200 MBps)Targeted at legacy 3.0 V systems with lower bandwidth needs and higher voltage toleranceSelect when interfacing with older MCUs lacking 1.8 V HYPERBUS™ PHY or requiring higher noise margin
S26KL128SDGBHV030Identical pinout and timing, but 3.0 V core/VCCQ (vs. 1.8 V); supports single-ended clock only (no CK#/RWDS DDR)Designed for cost-sensitive industrial applications where differential signaling is unnecessaryChoose for simplified layout and reduced BOM count where 200 MBps read speed suffices

Compared with S26KS128SDGBHV030, the S26KS128SDABHV020 trades bandwidth for voltage compatibility, while S26KL128SDGBHV030 sacrifices DDR performance and ECC for lower system cost-making the original optimal for new 1.8 V designs demanding maximum throughput and safety features.

Availability

S26KS128SDGBHV030 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging boot memory, and avionics data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S26KS128SDGBHV030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This device belongs to Infineon's HYPERFLASH™ family, engineered specifically for high-bandwidth, low-pin-count boot memory in automotive, industrial, and medical systems requiring deterministic read performance and functional safety compliance.

FAQ

What is the minimum supported clock frequency for S26KS128SDGBHV030?

The device supports variable clock rates down to DC (0 Hz) in active mode, with no specified minimum frequency. However, timing parameters such as tACC and tCS are guaranteed only within the rated operating range (up to 166 MHz at 1.8 V). For reliable initialization and command execution, the host must meet setup/hold times relative to CK/CK# edges regardless of frequency.

Does S26KS128SDGBHV030 require external pull-up resistors on DQ lines?

Yes - the DQ[7:0] bus is open-drain compatible and requires external pull-up resistors (typically 10 kΩ) to VCCQ (1.8 V) for proper signal termination and bus contention management during bidirectional operation. Pull-ups must be placed close to the flash device to maintain signal integrity at 166 MHz DDR rates.

How is the 512-byte program buffer utilized during write operations?

The buffer accepts up to 512 bytes of data in a single write transaction, then internally programs them in parallel across the flash array. This reduces total programming time to ~475 µs (vs. 500 µs per 2-byte word), achieving ~1 MBps effective throughput. The host must issue a "Buffer Write" command followed by address and data, then poll status until completion.

Can RWDS be used as a general-purpose output signal?

No - RWDS is strictly a read-data strobe output synchronized to internal flash timing and cannot be repurposed. Its duty cycle, phase relationship to CK, and assertion timing are fixed by the HYPERBUS™ protocol. Using it for other functions would violate timing specifications and cause read data corruption.

S26KS128SDGBHV030 Specifications

Product attributes
Attribute value
Manufacturer:
Spansion
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS128SDGBHV030 FAQ

1.How can I place an order for S26KS128SDGBHV030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS128SDGBHV030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS128SDGBHV030 reliable?

The price and inventory of S26KS128SDGBHV030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDGBHV030 is usually 5 days.

3.What payment methods are accepted for S26KS128SDGBHV030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDGBHV030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS128SDGBHV030?

S26KS128SDGBHV030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS128SDGBHV030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS128SDGBHV030?

For technical support, including S26KS128SDGBHV030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDGBHV030 requirements.

6.How does Aetrix verify that S26KS128SDGBHV030 is sourced from the original manufacturer or authorized distributors?

All S26KS128SDGBHV030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDGBHV030 meets industry standards.

7.What is the process for return or replacement of S26KS128SDGBHV030?

All S26KS128SDGBHV030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDGBHV030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS128SDGBHV030 part is unused and in its original packaging.

Return procedure for S26KS128SDGBHV030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S26KS128SDGBHV030 Tags

  • S26KS128SDGBHV030
  • S26KS128SDGBHV030 PDF
  • S26KS128SDGBHV030 Datasheet
  • S26KS128SDGBHV030 Specifications
  • S26KS128SDGBHV030 Images
  • Spansion
  • Spansion S26KS128SDGBHV030
  • Buy S26KS128SDGBHV030
  • S26KS128SDGBHV030 Price
  • S26KS128SDGBHV030 Distributor
  • S26KS128SDGBHV030 Supplier
  • S26KS128SDGBHV030 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER