Spansion S26KS128SDGBHV030
- Part No.:
- S26KS128SDGBHV030
- Manufacturer:
- Spansion
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS128SDGBHV030.pdf
- Description:
- FLASH, 16MX8, 96NS, PBGA24
- Quantity:
- Payment:

- Shipping:

Inventory:334
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S26KS128SDGBHV030 from Infineon is a 128 Mb (16 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.
For engineers reviewing the S26KS128SDGBHV030 datasheet, S26KS128SDGBHV030 pinout, S26KS128SDGBHV030 application, or S26KS128SDGBHV030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns tACC), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive boot code storage.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and data transfer synchronization with CK/CK# and RWDS, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for high-density NOR storage and supports both wrapped (16/32/64-byte) and linear burst modes.
HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers; read data is edge-aligned to RWDS transitions, while commands are center-aligned to CK edges. Initial random access latency is configurable from 5–16 clock cycles, with 96 ns maximum access time at 166 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) - fixed capacity for boot code and firmware storage in resource-constrained embedded systems |
| Interface Standard | HYPERTBUS™ DDR - low-pin-count (11–12 signals), differential clock support enables noise-immune high-speed reads up to 333 MBps |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 8-bit bus, enabling fast application loading from flash |
| Random Access Time | 96 ns - defines worst-case latency for first word retrieval after CS# assertion, critical for real-time boot response |
| Endurance & Retention | 100,000 P/E cycles / 20-year data retention - ensures long-term reliability in industrial control and automotive ECUs |
| Power Modes | Deep Power-Down: 4 µA (typical) - allows ultra-low standby current during system sleep without wake-up delay |
| ECC Capability | 1-bit correction / 2-bit detection - mitigates single-event upsets in safety-critical applications without external error handling logic |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides precise edge-aligned timing reference for DDR data capture; eliminates single-ended clock skew limitations |
| CS# | Chip select (active low) | Enables device communication; must be asserted before command initiation and held active during burst transactions |
| RWDS | Read data strobe output | Indicates valid read data windows on DQ; synchronized to data edges, not clock - essential for reliable DDR sampling |
| DQ[7:0] | Bi-directional DDR data bus | Carries multiplexed commands, addresses, and 8-bit data on both clock edges; requires matched trace lengths for signal integrity |
| INT# | Interrupt output | Asserts on Busy→Ready transition or ECC error detection - enables asynchronous host notification without polling |
| RSTO# | Reset output | Generates system-level power-on reset pulse; user-configurable LOW duration supports custom reset timing requirements |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces signal count to 12 pins vs. traditional parallel NOR, enabling smaller PCB footprints and lower EMI in space-constrained designs |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes bandwidth utilization for sequential code fetch or random data access |
| Advanced Sector Protection | Volatile and non-volatile locking per 256-KB sector - prevents accidental firmware overwrite during field updates or debug sessions |
| 512-Byte Program Buffer | Enables 1 MBps effective programming rate via buffer write - cuts flash update time by ~2× vs. single-word programming (4 KBps) |
| AEC-Q100 Grade 3 | Qualified for automotive applications at –40°C to +85°C - meets functional safety requirements for instrument clusters and ADAS boot memory |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and GUI assets for real-time display rendering in digital dashboards. IC Role / Device Role / Timing Role: Primary non-volatile code execution memory interfaced directly to MCU's HYPERBUS™ controller. Use Value: 333 MBps read speed enables sub-100 ms boot time; ECC and AEC-Q100 Grade 3 ensure ASIL-B compliance. | Use Scenario: Holding firmware images and configuration tables for programmable logic controllers in factory automation. IC Role / Device Role / Timing Role: Standalone boot memory with sector protection to prevent corruption during over-the-air updates. Use Value: 256-KB uniform sectors allow atomic firmware partitioning; deep power-down (4 µA) extends battery backup runtime. |
| Medical Imaging Boot Memory | Avionics Data Logger |
Use Scenario: Hosting certified bootloader and diagnostic firmware in portable ultrasound and MRI control units. IC Role / Device Role / Timing Role: Secure, tamper-resistant code storage with CRC and ECC for regulatory audit trails. Use Value: 20-year data retention meets FDA 21 CFR Part 11 archival requirements; INT# alerts host on ECC events for logging. | Use Scenario: Recording flight-critical sensor logs and black-box data in unmanned aerial vehicles. IC Role / Device Role / Timing Role: High-reliability non-volatile buffer memory with extended temperature operation (–40°C to +105°C option). Use Value: 100,000 P/E cycles support frequent log rotation; RSTO# integration simplifies power-on reset sequencing in DO-160 environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S26KS128SDABHV020 | Same density and HYPERBUS™ interface, but 3.0 V I/O (vs. 1.8 V); max clock 100 MHz (200 MBps) | Targeted at legacy 3.0 V systems with lower bandwidth needs and higher voltage tolerance | Select when interfacing with older MCUs lacking 1.8 V HYPERBUS™ PHY or requiring higher noise margin |
| S26KL128SDGBHV030 | Identical pinout and timing, but 3.0 V core/VCCQ (vs. 1.8 V); supports single-ended clock only (no CK#/RWDS DDR) | Designed for cost-sensitive industrial applications where differential signaling is unnecessary | Choose for simplified layout and reduced BOM count where 200 MBps read speed suffices |
Compared with S26KS128SDGBHV030, the S26KS128SDABHV020 trades bandwidth for voltage compatibility, while S26KL128SDGBHV030 sacrifices DDR performance and ECC for lower system cost-making the original optimal for new 1.8 V designs demanding maximum throughput and safety features.
Availability
S26KS128SDGBHV030 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging boot memory, and avionics data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S26KS128SDGBHV030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
This device belongs to Infineon's HYPERFLASH™ family, engineered specifically for high-bandwidth, low-pin-count boot memory in automotive, industrial, and medical systems requiring deterministic read performance and functional safety compliance.
FAQ
What is the minimum supported clock frequency for S26KS128SDGBHV030?
The device supports variable clock rates down to DC (0 Hz) in active mode, with no specified minimum frequency. However, timing parameters such as tACC and tCS are guaranteed only within the rated operating range (up to 166 MHz at 1.8 V). For reliable initialization and command execution, the host must meet setup/hold times relative to CK/CK# edges regardless of frequency.
Does S26KS128SDGBHV030 require external pull-up resistors on DQ lines?
Yes - the DQ[7:0] bus is open-drain compatible and requires external pull-up resistors (typically 10 kΩ) to VCCQ (1.8 V) for proper signal termination and bus contention management during bidirectional operation. Pull-ups must be placed close to the flash device to maintain signal integrity at 166 MHz DDR rates.
How is the 512-byte program buffer utilized during write operations?
The buffer accepts up to 512 bytes of data in a single write transaction, then internally programs them in parallel across the flash array. This reduces total programming time to ~475 µs (vs. 500 µs per 2-byte word), achieving ~1 MBps effective throughput. The host must issue a "Buffer Write" command followed by address and data, then poll status until completion.
Can RWDS be used as a general-purpose output signal?
No - RWDS is strictly a read-data strobe output synchronized to internal flash timing and cannot be repurposed. Its duty cycle, phase relationship to CK, and assertion timing are fixed by the HYPERBUS™ protocol. Using it for other functions would violate timing specifications and cause read data corruption.
S26KS128SDGBHV030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Spansion
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS128SDGBHV030 FAQ
1.How can I place an order for S26KS128SDGBHV030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS128SDGBHV030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS128SDGBHV030 reliable?
The price and inventory of S26KS128SDGBHV030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDGBHV030 is usually 5 days.
3.What payment methods are accepted for S26KS128SDGBHV030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDGBHV030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS128SDGBHV030?
S26KS128SDGBHV030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS128SDGBHV030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS128SDGBHV030?
For technical support, including S26KS128SDGBHV030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDGBHV030 requirements.
6.How does Aetrix verify that S26KS128SDGBHV030 is sourced from the original manufacturer or authorized distributors?
All S26KS128SDGBHV030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDGBHV030 meets industry standards.
7.What is the process for return or replacement of S26KS128SDGBHV030?
All S26KS128SDGBHV030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDGBHV030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS128SDGBHV030 part is unused and in its original packaging.
Return procedure for S26KS128SDGBHV030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S26KS128SDGBHV030 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

