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Infineon Technologies S26KS128SDPBHB023

Part No.:
S26KS128SDPBHB023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS128SDPBHB023.pdf
Description:
IC FLASH 128MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,510

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Product details

Overview

S26KS128SDPBHB023 from Infineon Technologies is a 128 Mb (16 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded boot code storage.

For engineers reviewing the S26KS128SDPBHB023 datasheet, S26KS128SDPBHB023 pinout, S26KS128SDPBHB023 application, or S26KS128SDPBHB023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, configurable burst length (16/32/64 bytes), deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive control modules.

Technical Context

This device implements a DDR center-aligned read strobe (DCARS) architecture where command/address and data are transferred over the same 8-bit DQ bus using double-data-rate signaling synchronized to CK/CK#. Read data is edge-aligned to RWDS transitions, while commands are center-aligned to clock edges - enabling deterministic timing for high-speed boot fetch.

The internal control logic splits functionality between Host Interface Controller (HIC) for real-time signal management and Embedded Algorithm Controller (EAC) for autonomous program/erase execution. Sector protection uses both volatile (lock bits) and non-volatile (OTP-based) methods, and the 512-byte write buffer enables ~1 MBps buffered programming performance.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) - sufficient for full firmware images and secure boot ROM in microcontroller-based systems
Interface ProtocolHYPERTBUS™ DDR - 8-bit bidirectional DQ bus with differential CK/CK#, eliminating separate address bus and reducing pin count
Max Read Throughput333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte per transfer, enabling fast application loading
Random Access Time96 ns - initial latency for first word retrieval, critical for low-latency boot code execution
Operating Voltage1.8 V I/O, 3.0 V core - dual-voltage design allows integration into low-power SoC platforms with mixed supply domains
Data Retention20 years - guaranteed data integrity without refresh, suitable for long-lifecycle industrial deployments
Endurance100,000 program/erase cycles - supports field firmware updates in gateways and telematics units

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides precise timing reference for DDR data capture; eliminates single-ended clock skew in high-speed reads
CS#Chip select (active-low)Enables device communication; must be asserted before command initiation and held active during burst transactions
RWDSRead data strobe outputIndicates valid read data windows on DQ; used by host to sample DQ edges synchronously during read bursts
DQ[7:0]Bi-directional data busCarries commands, addresses, and 16-bit data words in DDR mode - no dedicated address pins required
INT#Interrupt outputSignals Busy-to-Ready transition or ECC error detection; enables interrupt-driven host polling instead of status register reads
RSTO#Reset outputGenerates system-level power-on reset pulse; duration configurable via OTP to match host processor reset timing requirements

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 11–12 pins vs. traditional parallel NOR, enabling smaller PCB footprints and simplified routing
Configurable burst modesSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill efficiency for ARM Cortex-A/R cores
ECC and CRC support1-bit correction / 2-bit detection on read data plus CRC for command integrity - meets ASIL-B functional safety requirements
Low-power operationDeep power-down draws only 4 µA at 85°C - extends battery life in always-on automotive modules during sleep states
Automotive qualificationAEC-Q100 Grade 3 (–40°C to +85°C) and ISO/TS 16949 certified - validated for engine control, ADAS sensor hubs, and infotainment head units

Applications

Automotive Engine Control Unit (ECU)Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps and real-time control algorithms in diesel ECU with strict boot-time constraints.

IC Role / Device Role / Timing Role: Primary boot memory delivering executable code directly to ARM Cortex-R5F core via XIP (execute-in-place) over HYPERBUS™.

Use Value: 96 ns random access and 333 MBps sustained read enable sub-100 ms cold-start boot, meeting OEM power-on timing specifications.

Use Scenario: Holding firmware and configuration data for modular programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Non-volatile storage for field-upgradable ladder logic and I/O mapping tables accessed via industrial MCU with HYPERBUS™ master IP.

Use Value: 256-KB uniform sectors allow atomic firmware updates without runtime interruption; 20-year retention ensures reliability across 15+ year plant lifecycles.

ADAS Camera Sensor HubMedical Imaging Boot Loader

Use Scenario: Hosting boot firmware and calibration parameters for multi-camera fusion processors in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: Secure boot ROM with ECC-protected read path, interfacing to TI TDA4VM or NXP S32G via HYPERBUS™ PHY.

Use Value: AEC-Q100 Grade 3 rating and 100,000-cycle endurance support over-the-air updates of vision processing firmware in harsh thermal environments.

Use Scenario: Storing certified boot loader and diagnostic self-test routines for FDA-cleared portable ultrasound devices.

IC Role / Device Role / Timing Role: Trusted execution environment (TEE) root-of-trust memory, providing authenticated code load before main application initialization.

Use Value: OTP-based sector protection prevents unauthorized modification; 4 µA deep power-down extends battery runtime during standby without compromising security state.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KS128SDPBHI020Same die, identical electrical specs, but rated for Industrial Plus (–40°C to +105°C) and packaged in same 24-ball FBGARequired for extended-temperature industrial gateways or under-hood automotive modulesSelect when ambient operating temperature exceeds +85°C but HYPERBUS™ timing and pinout compatibility must be preserved
Infineon S26KL128SDPBHB020128 Mb HYPERFLASH™ variant with 3.0 V I/O (vs. 1.8 V), single-ended CK, and 11-signal bus (no CK#)Suitable for legacy designs using 3.0 V SoCs without differential clock capabilityChoose only if host controller lacks differential clock driver or operates exclusively at 3.0 V I/O domain

Compared with S26KS128SDPBHI020, this part trades extended temperature margin for lower cost and standard industrial qualification; versus S26KL128SDPBHB020, it provides higher bandwidth and lower power at the expense of requiring differential clock infrastructure.

Availability

S26KS128SDPBHB023 is available at Aetrix Electronics and suitable for automotive ECU, industrial PLC, ADAS sensor hub, and medical imaging boot applications requiring stable component supply, AEC-Q100 compliance, and HYPERBUS™-based high-speed code execution.

Supply support for S26KS128SDPBHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing facilities.

This device belongs to the HYPERFLASH™ family - designed specifically for high-bandwidth, low-pin-count boot memory in automotive and industrial real-time systems requiring deterministic read latency and long-term data integrity.

FAQ

What is the minimum supported clock frequency for S26KS128SDPBHB023?

The device supports clock frequencies down to DC (0 Hz) in active mode, with no minimum operational clock requirement. It maintains data integrity and accepts commands at any frequency up to 166 MHz. The HYPERBUS™ protocol does not mandate continuous clocking - clock can be stopped during idle periods without wake-up delay, enabling dynamic power gating in battery-powered systems.

Does S26KS128SDPBHB023 support XIP (execute-in-place) operation?

Yes, S26KS128SDPBHB023 supports true XIP operation via its HYPERBUS™ DDR interface. The host processor accesses instruction code directly from flash without copying to RAM, enabled by deterministic 96 ns random access time and burst read capability. This is validated in Infineon's reference designs with ARM Cortex-R and Cortex-A processors using standard MMU and cache coherency protocols.

How is sector protection configured on this device?

Sector protection is implemented through both volatile lock bits (cleared on power cycle) and non-volatile OTP fuses. Each 256-KB sector has independent protection control; parameter sectors (optional 4-KB × 8) support one-time locking. Configuration is performed via standard HYPERBUS™ command sequences (e.g., 0x60 followed by 0xD0), with status verified through protected read attempts or status register polling.

What is the purpose of the RSTO# pin and how is its pulse width set?

RSTO# outputs a system-level power-on reset pulse synchronized to internal VCC ramp-up. Its LOW duration is user-configurable via OTP programming during manufacturing - default values range from 10 ms to 100 ms depending on ordering option. This eliminates need for external RC reset generators and ensures precise timing alignment with host processor reset requirements.

S26KS128SDPBHB023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
HyperBus
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS128SDPBHB023 FAQ

1.How can I place an order for S26KS128SDPBHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS128SDPBHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS128SDPBHB023 reliable?

The price and inventory of S26KS128SDPBHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDPBHB023 is usually 5 days.

3.What payment methods are accepted for S26KS128SDPBHB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDPBHB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS128SDPBHB023?

S26KS128SDPBHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS128SDPBHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS128SDPBHB023?

For technical support, including S26KS128SDPBHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDPBHB023 requirements.

6.How does Aetrix verify that S26KS128SDPBHB023 is sourced from the original manufacturer or authorized distributors?

All S26KS128SDPBHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDPBHB023 meets industry standards.

7.What is the process for return or replacement of S26KS128SDPBHB023?

All S26KS128SDPBHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDPBHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS128SDPBHB023 part is unused and in its original packaging.

Return procedure for S26KS128SDPBHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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