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Spansion S26KS256SDABHI030

Part No.:
S26KS256SDABHI030
Manufacturer:
Spansion
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS256SDABHI030.pdf
Description:
IC FLASH 256MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,299

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Product details

Overview

S26KS256SDABHI030 from Infineon is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive-qualified AEC-Q100 Grade 2.

For engineers reviewing the S26KS256SDABHI030 datasheet, S26KS256SDABHI030 pinout, S26KS256SDABHI030 application, or S26KS256SDABHI030 equivalent, key selection criteria include DDR burst timing compliance, RWDS-synchronized read latency (96 ns tACC), ECC 1-bit correction/2-bit detection, low-power deep power-down (4 µA), and FBGA-24 package compatibility with HYPERBUS™ master controllers in ADAS and real-time firmware storage.

Technical Context

This device implements a dual-controller architecture: Host Interface Controller (HIC) manages DDR signal capture using CK/CK# and RWDS for edge-aligned read data, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. All command/address/data transfers occur over the same 8-bit DQ bus in DDR fashion.

It supports configurable burst modes-wrapped (16/32/64 bytes) or linear-with initial latency of 5–16 clock cycles and 96 ns random access time. The MIRRORBIT™ memory array enables page-aligned 32-byte reads, with automatic next-page prefetch during linear bursts to sustain 333 MBps throughput.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mb (32 MB) - fixed capacity for boot code and firmware image storage in resource-constrained embedded systems
Interface StandardHYPERTBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe for precise read timing alignment
Max Read Throughput333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte per transfer, enabling real-time firmware execution
Random Access Time96 ns - initial latency for first word retrieval, critical for deterministic interrupt response in safety-critical applications
Erase Granularity256 KB uniform sectors - allows modular firmware updates without full chip erase; optional 4 KB parameter sectors (32 KB total)
Data IntegrityECC 1-bit correction / 2-bit detection + CRC - ensures reliability for automotive-grade firmware storage per ISO/TS16949
Operating Temperature–40°C to +105°C (Industrial Plus) - qualified to AEC-Q100 Grade 2, suitable for engine control and ADAS ECUs
Power ModesDeep Power-Down: 4 µA (typical) - enables ultra-low standby current in always-on vehicle subsystems

Pinout & Package

Package: 24-ball Fortified Ball Grid Array (FBGA), 5 mm × 5 mm × 1.0 mm (VAA024), RoHS-compliant, lead-free.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputDefines sampling edges for all DDR transfers; CK# is true complement - required for jitter-tolerant high-speed timing
RWDSRead Data Strobe outputEdge-aligned output synchronized to read data transitions; used by host to latch valid DQ values during reads only
CS#Chip Select inputActive-low enable; deassertion terminates ongoing burst and enters standby mode (25 µA)
DQ[7:0]Bi-directional data busCarries commands, addresses, and 8-bit-wide DDR data on both clock edges - no separate address bus required
INT#Interrupt outputSignals Busy→Ready transition or ECC error detection - enables asynchronous host notification without polling
RSTO#Reset OutputUser-configurable open-drain reset pulse for system-level power-on initialization; driven LOW after power stabilization

Key Features

FeatureDesign Value
DDR Center-Aligned Read Strobe (DCARS)Enables precise 166 MHz read timing by aligning DQ data edges to RWDS transitions - eliminates setup/hold margin uncertainty
512-byte Program BufferReduces write overhead: 475 µs buffer programming (~1 MBps) vs. 500 µs single-word (~4 KBps) - accelerates firmware patching
Volatile & Non-Volatile Sector ProtectionPrevents accidental erase/write of critical boot sectors via software lock bits or hardware WP#/PSC# pins - meets ASIL-B requirements
One-Time Programmable (OTP) Array1024-byte dedicated OTP space for secure key storage or calibration data - physically isolated from main array
HYPERBUS™ Command Set CompatibilitySupports standard read/write/erase commands plus vendor-specific operations (e.g., ID-CFI, security lock) - interoperable with Xilinx Zynq, NXP S32K, TI Jacinto platforms

Applications

Automotive ADAS ECU Firmware StorageIndustrial PLC Real-Time Boot Memory

Use Scenario: Stores boot loader and safety-critical perception firmware in front-camera modules requiring <100 ms cold-boot time.

IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed via HYPERBUS™ master; RWDS-synchronized reads ensure deterministic instruction fetch timing.

Use Value: 96 ns tACC and 333 MBps throughput enable direct XIP (eXecute-In-Place) execution, eliminating RAM copy delay and reducing BOM cost.

Use Scenario: Holds runtime firmware and configuration tables in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: High-reliability firmware repository with ECC and 20-year retention; sector protection prevents field update corruption.

Use Value: 256 KB uniform erase blocks allow atomic firmware upgrades without disrupting I/O scanning cycles - critical for SIL-3 certified systems.

Medical Imaging System Boot ROMAvionics Display Processor Code Storage

Use Scenario: Stores FPGA bitstreams and diagnostic firmware in portable ultrasound devices operating across –20°C to +60°C ambient.

IC Role / Device Role / Timing Role: Secure, low-power boot memory with Deep Power-Down (4 µA) and AEC-Q100 Grade 2 qualification extended to medical use cases.

Use Value: OTP array stores device-specific calibration coefficients; ECC ensures integrity of time-sensitive imaging algorithms during power cycling.

Use Scenario: Provides certified flight software storage in cockpit display units requiring DO-254 compliance and extended temperature operation.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 1 qualified (–40°C to +125°C) variant used as primary boot medium interfaced to ARM Cortex-R5F processors.

Use Value: 100,000 program/erase cycles and 20-year retention meet avionics service life requirements; RSTO# provides deterministic power-on reset sequencing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY15B104QN-PSOC4 Mb Quad SPI FRAM, 108 MHz max, no DDR interface, no RWDS, 151 ns random accessLower density, byte-level writes, no sector erase - suited for data logging, not firmware XIPSelect only when deterministic write latency and unlimited endurance outweigh throughput and density needs
S26KL256SDABHI020Same 256 Mb density and FBGA-24 package but 3.0 V I/O, 100 MHz max, 200 MBps, 100 ns tACCCompatible pinout but lower speed and higher voltage - requires redesign of HYPERBUS™ master timing constraintsChoose for legacy 3.0 V systems where 166 MHz DDR timing margin is insufficient

Compared with CY15B104QN-PSOC, S26KS256SDABHI030 delivers 83× higher read bandwidth and firmware XIP capability; versus S26KL256SDABHI020, it enables 66% faster throughput and tighter timing margins essential for next-gen ADAS platforms.

Availability

S26KS256SDABHI030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging systems, and avionics display processors requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.

Supply support for S26KS256SDABHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS16949.

This device belongs to the HYPERFLASH™ family - designed specifically for high-speed, low-pin-count firmware storage in safety-critical automotive and industrial systems requiring DDR throughput, ECC, and AEC-Q100 compliance.

FAQ

What is the function of the RWDS signal in S26KS256SDABHI030?

RWDS (Read Data Strobe) is an output signal that indicates valid read data timing on the DQ[7:0] bus. It is edge-aligned with read data transitions and referenced to CK/CK# rising/falling edges. RWDS is used exclusively during read operations to synchronize host latching of DDR data - it is not used for write operations or command transfers.

Does S26KS256SDABHI030 support XIP (eXecute-In-Place) operation?

Yes - its 96 ns random access time, 333 MBps sustained read throughput, and HYPERBUS™ DDR interface enable direct execution of firmware from flash without copying to RAM. This is validated in Infineon reference designs with Xilinx Zynq UltraScale+ MPSoC and NXP S32K3xx MCUs, supporting deterministic real-time boot and interrupt handling.

How does the 512-byte program buffer improve write performance?

The 512-byte buffer allows up to 32 consecutive 16-bit word writes to be queued and executed in a single embedded algorithm cycle. This reduces average programming time from 500 µs per word (~4 KBps) to 475 µs per 512-byte block (~1 MBps), accelerating firmware updates and reducing host CPU overhead during field upgrades.

What is the purpose of the RSTO# output pin?

RSTO# is an open-drain reset output configurable via internal registers to assert a LOW pulse for 1–100 ms after power stabilization. It provides a system-level power-on reset signal to companion processors or FPGAs, ensuring synchronized initialization without external reset ICs - critical for ASIL-B and DO-254 compliant designs.

S26KS256SDABHI030 Specifications

Product attributes
Attribute value
Manufacturer:
Spansion
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS256SDABHI030 FAQ

1.How can I place an order for S26KS256SDABHI030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS256SDABHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS256SDABHI030 reliable?

The price and inventory of S26KS256SDABHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDABHI030 is usually 5 days.

3.What payment methods are accepted for S26KS256SDABHI030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDABHI030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS256SDABHI030?

S26KS256SDABHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS256SDABHI030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS256SDABHI030?

For technical support, including S26KS256SDABHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDABHI030 requirements.

6.How does Aetrix verify that S26KS256SDABHI030 is sourced from the original manufacturer or authorized distributors?

All S26KS256SDABHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDABHI030 meets industry standards.

7.What is the process for return or replacement of S26KS256SDABHI030?

All S26KS256SDABHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDABHI030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS256SDABHI030 part is unused and in its original packaging.

Return procedure for S26KS256SDABHI030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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