Nexperia USA Inc. S26KS256SDGBHA030
- Part No.:
- S26KS256SDGBHA030
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S26KS256SDGBHA030.pdf
- Description:
- S26KS256S - Parallel NOR HyperFl
- Quantity:
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Inventory:878
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Product details
Overview
S26KS256SDGBHA030 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive-grade AEC-Q100 Grade 2 qualification.
For engineers reviewing the S26KS256SDGBHA030 datasheet, S26KS256SDGBHA030 pinout, S26KS256SDGBHA030 application, or S26KS256SDGBHA030 equivalent, key selection criteria include DDR HYPERBUS™ timing compliance, 1.8 V differential clock interface, ECC 1-bit correction/2-bit detection, 512-byte write buffer, and AEC-Q100 Grade 2 temperature support for ADAS and infotainment boot storage.
Technical Context
This device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and data transfer synchronization with CK/CK#, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. RWDS is edge-aligned to CK transitions during reads, enabling precise DDR data capture.
It uses MIRRORBIT™ NOR flash technology with 16-bit word-wide addressing and page-aligned 32-byte random access. Burst modes-wrapped (16/32/64 bytes) or linear-are configurable per transaction, and initial read latency ranges from 5–16 clock cycles with 96 ns tACC at 166 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB), organized as 16,777,216 × 16-bit words |
| Interface Standard | HYPERRBUS™ DDR: 8-bit DQ bus, differential CK/CK#, RWDS strobe, CS# control |
| Max Read Throughput | 333 MBps sustained (166 MHz × 2 transfers/cycle × 1 byte) |
| Read Access Time | 96 ns tACC; 118 ns CS# to first word at 166 MHz |
| Erase/Program Endurance | 100,000 program/erase cycles per sector |
| Data Retention | 20 years at +85°C, guaranteed over full temperature range |
| Operating Temperature | –40°C to +105°C (AEC-Q100 Grade 2, Industrial Plus) |
| Power Modes | Active clock stop (12 mA), Standby (25 µA typ), Deep Power-Down (4 µA typ) |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential Clock Input | DDR timing reference; CK rising/falling edges sample DQ and RWDS |
| CS# | Chip Select | Active-low enable; controls device entry/exit from low-power modes |
| RWDS | Read Data Strobe Output | Edge-aligned output indicating valid DQ read data; used only during reads |
| DQ[7:0] | Bi-directional Data Bus | 8-bit DDR bus carrying commands, addresses, and 16-bit data on both clock edges |
| INT# | Interrupt Output | Open-drain active-low signal indicating ECC error or busy-to-ready transition |
| RSTO# | Reset Output | User-configurable active-low reset pulse for system power-on initialization |
| VCC / VCCQ | Supply Pins | VCC = 1.7–1.95 V core; VCCQ = 1.7–1.95 V I/O; separate pins for noise isolation |
| PSC / PSC# | Power Supply Control | Optional inputs to manage power sequencing during wake-up from deep power-down |
Key Features
| Feature | Design Value |
|---|---|
| DDR HYPERBUS™ Interface | Reduces pin count vs. parallel NOR: 11–12 signals replace 40+ for equivalent bandwidth |
| Configurable Burst Mode | Per-transaction selection of wrapped (16/32/64 B) or linear burst enables optimal cache-line alignment |
| On-die ECC | 1-bit correction / 2-bit detection implemented in hardware, no host CPU overhead |
| 512-byte Write Buffer | Enables ~1 MBps programming rate (vs. 4 KBps single-word), reducing firmware update time |
| AEC-Q100 Grade 2 Qualification | Validated for automotive applications up to +105°C with full traceability and PPAP support |
| Flexible Sector Protection | Volatile/non-volatile lock bits per 256-KB sector plus eight 4-KB parameter sectors for bootloader safety |
Applications
| ADAS Domain Controller Boot Storage | Automotive Infotainment Application Code Storage |
|---|---|
Use Scenario: Stores boot firmware and safety-critical configuration for radar/EPS domain controllers requiring fast, deterministic startup. IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to SoC HYPERBUS™ master; provides sub-100 ns random access and 333 MBps linear read for image decompression. Use Value: Enables <500 ms cold boot time via linear burst reads and eliminates external level shifters with native 1.8 V I/O compatibility. | Use Scenario: Holds OS kernel, middleware, and UI assets in head-unit systems where code execution-in-place (XIP) reduces DRAM footprint. IC Role / Device Role / Timing Role: XIP-capable NOR flash with DDR timing compliance; supports wrapped bursts aligned to 32-byte cache lines for efficient instruction fetch. Use Value: Delivers 2× read bandwidth vs. legacy parallel NOR, allowing higher-resolution graphics rendering without increasing SoC memory bandwidth pressure. |
| Telematics Control Unit Firmware Storage | Electric Vehicle Battery Management System (BMS) Configuration Memory |
Use Scenario: Stores OTA-updatable modem firmware and secure key partitions in cellular-connected TCUs operating across extended temperature ranges. IC Role / Device Role / Timing Role: Secure, endurance-rated flash with ECC and sector protection; interfaces via HYPERBUS™ to isolate RF-sensitive baseband processors. Use Value: Supports 100K+ field updates with built-in CRC and ECC, eliminating need for external error-handling logic in compact TCU modules. | Use Scenario: Retains calibrated sensor offsets, cell balancing parameters, and safety thresholds in BMS microcontrollers exposed to under-hood thermal stress. IC Role / Device Role / Timing Role: High-reliability configuration store with AEC-Q100 Grade 1 option (–40°C to +125°C); accessed during power-up and fault recovery. Use Value: Guarantees 20-year data retention at +105°C and withstands 100K program/erase cycles-critical for lifetime calibration stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KL256SDHBHA020 | Same 256 Mb density, identical FBGA-24 package, but rated for Industrial (–40°C to +85°C) only; lacks AEC-Q100 certification | Not qualified for automotive safety-critical domains; suitable for industrial HMI or gateway controllers | Select when AEC-Q100 Grade 2 is not required and cost optimization is prioritized |
| Winbond W25Q256JWSIQ | Quad SPI interface (4-wire), 133 MHz max clock, 40-pin SOIC/WSON; no DDR or RWDS; lower bandwidth (~40 MBps) | Limited to non-real-time firmware storage; incompatible with HYPERBUS™-based SoCs | Choose only for legacy SPI-based designs where board space allows larger package and bandwidth requirements are relaxed |
Compared with S26KS256SDGBHA030, the Cypress alternative offers identical pinout and timing but omits automotive qualification, while the Winbond part trades bandwidth and interface complexity for broader ecosystem support-making the Infineon device optimal for new AEC-Q100-compliant HYPERBUS™ designs demanding >300 MBps read performance.
Availability
S26KS256SDGBHA030 is available at Aetrix Electronics and suitable for ADAS domain controllers, automotive infotainment systems, telematics control units, and battery management systems requiring stable component supply with automotive-grade reliability and long-term lifecycle support.
Supply support for S26KS256SDGBHA030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
This device belongs to the HYPERFLASH™ family-designed specifically for high-bandwidth, low-pin-count boot and code storage in automotive and industrial real-time systems using the standardized HYPERBUS™ interface.
FAQ
What is the purpose of the RWDS signal in S26KS256SDGBHA030?
RWDS (Read Data Strobe) is an output-only signal that toggles synchronously with valid read data on DQ[7:0]. It is edge-aligned to CK/CK# transitions during read operations and serves as a timing reference for the host to sample data accurately-eliminating setup/hold timing constraints common in parallel NOR interfaces. RWDS is not used during write operations.
Does S26KS256SDGBHA030 support execute-in-place (XIP) operation?
Yes, S26KS256SDGBHA030 supports XIP via its synchronous DDR interface and deterministic read latency. The HYPERBUS™ protocol enables continuous linear burst reads with predictable timing, allowing SoCs to fetch and execute instructions directly from flash without copying to RAM-reducing system memory footprint and boot latency in automotive applications.
How does the 512-byte write buffer improve programming efficiency?
The 512-byte write buffer allows the device to accept one full buffer load (4096 bits) in a single command sequence, then internally program all 512 bytes in ~475 µs. This achieves ~1 MBps effective programming speed-over 200× faster than single-word programming-and minimizes host CPU intervention during firmware updates or configuration writes.
What is the function of RSTO# and how is it configured?
RSTO# is an open-drain output that generates a system-level power-on reset pulse. Its LOW duration is user-configurable via internal registers (default 100 ms). It asserts after power stabilization and deasserts once internal logic is ready, providing a synchronized reset signal to companion MCUs or PMICs-ensuring deterministic system initialization without external reset supervisors.
S26KS256SDGBHA030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
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- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
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- Mounting Type:
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- Supplier Device Package:
- -
S26KS256SDGBHA030 FAQ
1.How can I place an order for S26KS256SDGBHA030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS256SDGBHA030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS256SDGBHA030 reliable?
The price and inventory of S26KS256SDGBHA030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDGBHA030 is usually 5 days.
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S26KS256SDGBHA030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS256SDGBHA030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS256SDGBHA030?
For technical support, including S26KS256SDGBHA030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDGBHA030 requirements.
6.How does Aetrix verify that S26KS256SDGBHA030 is sourced from the original manufacturer or authorized distributors?
All S26KS256SDGBHA030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDGBHA030 meets industry standards.
7.What is the process for return or replacement of S26KS256SDGBHA030?
All S26KS256SDGBHA030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDGBHA030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS256SDGBHA030 part is unused and in its original packaging.
Return procedure for S26KS256SDGBHA030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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