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Spansion S26KS256SDGBHB030

Part No.:
S26KS256SDGBHB030
Manufacturer:
Spansion
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS256SDGBHB030.pdf
Description:
PARALLEL NOR HYPERFLASH, 2568MB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:323

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Product details

Overview

S26KS256SDGBHB030 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sectors and optional 4-KB parameter sectors, and operates across –40°C to +105°C (Industrial Plus grade).

For engineers reviewing the S26KS256SDGBHB030 datasheet, S26KS256SDGBHB030 pinout, S26KS256SDGBHB030 application, or S26KS256SDGBHB030 equivalent, key selection criteria include DDR burst configuration (wrapped/linear/hybrid), RWDS-synchronized read timing, ECC 1-bit correction/2-bit detection, low-power deep power-down (4 µA), and AEC-Q100 Grade 2 qualification for automotive control modules.

Technical Context

The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with dual-edge sampling referenced to CK/CK#. Read operations use RWDS as an edge-aligned output strobe synchronized to data transitions, while initial access latency ranges from 5–16 clock cycles depending on configuration.

Internally, it separates host interface control (HIC) and embedded algorithm control (EAC): HIC handles real-time signal capture and data transfer, while EAC executes program/erase algorithms-including sector erase, buffer programming, and protection-without host intervention. ECC and CRC support ensure data integrity during boot and firmware updates.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mb (32 MB) - supports full firmware images for mid-tier microcontrollers and boot code for multi-core SoCs.
Interface ProtocolHYPERTBUS™ DDR - 8-bit bidirectional DQ bus with CK/CK# differential clock enables high-speed, low-pin-count memory expansion.
Max Read Throughput333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte = sustained linear burst performance for real-time code execution.
Random Access Time96 ns - initial access latency optimized for fast interrupt vector fetch and small-code hot-path execution.
ECC Capability1-bit correction / 2-bit detection - hardware-accelerated error handling for critical boot ROM and safety-critical firmware storage.
Power ModesDeep Power-Down: 4 µA (typical) - enables ultra-low standby current in always-on automotive ECUs without wake-up delay.
Endurance & Retention100,000 program/erase cycles / 20-year data retention - validated for field-updatable telematics and ADAS control units.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for DDR sampling of DQ and RWDS; enables jitter-immune timing at 166 MHz.
CS#Chip select (active-low)Enables device communication; HIGH places device in standby or deep power-down mode.
RWDSRead data strobe outputEdge-aligned output indicating valid DQ data during reads; not used for writes.
DQ[7:0]Bi-directional data busCarries commands, addresses, and 8-bit data on both clock edges; shared bus reduces PCB routing complexity.
INT#Interrupt outputAsserts on ECC error detection or busy-to-ready transition, enabling host-driven error recovery.
RSTO#Reset outputUser-configurable active-low reset pulse for system-level power-on initialization coordination.

Key Features

FeatureDesign Value
HYPERBUS™ DDR InterfaceReduces signal count to 12 pins (vs. 30+ for parallel NOR), enabling compact routing and lower EMI in space-constrained automotive modules.
Configurable Burst ModeSupports wrapped (16/32/64-byte), linear, or hybrid bursts - allows optimization for cache line fills vs. sequential streaming in MCU boot loaders.
512-byte Program BufferEnables 1 MBps effective write speed (vs. 4 KBps single-word), accelerating firmware patching and OTA update staging.
Advanced Sector ProtectionVolatile and non-volatile lock bits per 256-KB sector - prevents accidental overwrite of bootloader or calibration data in production and field environments.
AEC-Q100 Grade 2Qualified for –40°C to +105°C operation with full traceability - meets functional safety requirements for body control and gateway ECUs.

Applications

Automotive Gateway ModuleIndustrial PLC Firmware Storage

Use Scenario: Stores boot code, secure bootloader, and CAN/FlexRay protocol stacks in a vehicle gateway ECU requiring fast startup and field-upgradable firmware.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with HYPERBUS™ DDR interface providing sub-100 ns random access and 333 MBps linear read for real-time instruction fetch.

Use Value: Enables <100 ms cold-boot time and supports encrypted firmware updates with ECC-protected integrity verification.

Use Scenario: Holds ladder logic runtime, configuration parameters, and firmware for DIN-rail mounted programmable logic controllers operating in factory automation environments.

IC Role / Device Role / Timing Role: High-reliability firmware repository with 100K-cycle endurance and 20-year retention, supporting unattended operation over 15+ years.

Use Value: Eliminates need for external error-checking logic and reduces BOM cost by integrating ECC, CRC, and sector protection in silicon.

Medical Imaging Boot MemoryAvionics Display Controller

Use Scenario: Stores FPGA configuration bitstreams and safety-critical boot firmware in portable ultrasound or MRI subsystems requiring radiation-tolerant, long-life storage.

IC Role / Device Role / Timing Role: Secure, high-integrity boot memory with AEC-Q100 Grade 2 qualification and deep power-down (4 µA) for battery-backed operation.

Use Value: Meets IEC 62304 Class C software requirements through hardware ECC, CRC, and write-protection enforcement.

Use Scenario: Provides certified firmware storage for DO-254-compliant display processors in commercial aircraft cockpit systems.

IC Role / Device Role / Timing Role: Certified non-volatile memory with traceable manufacturing, extended temperature support (–40°C to +105°C), and deterministic 96 ns access for ARINC 661 GUI rendering pipelines.

Use Value: Reduces certification effort by delivering pre-validated AEC-Q100 Grade 2 qualification and ISO/TS16949 process compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S26KS256SDABHB020Same density and package, but 3.0 V I/O (not 1.8 V); max clock 100 MHz (200 MBps); single-ended CK only.Targeted at legacy industrial designs using 3.0 V supply rails and simpler clocking; lacks differential noise immunity.Select when system uses 3.0 V VCCQ and does not require >200 MBps throughput or EMI-sensitive environments.
S26KL256SDGBHB030Same 1.8 V I/O, FBGA24, and HYPERBUS™ interface, but 3.0 V core voltage (VCC); different power sequencing requirements.Used where higher VCC tolerance is needed for mixed-voltage SoC interfaces; shares identical timing and feature set otherwise.Select when host controller requires 3.0 V core compatibility while retaining 1.8 V I/O and 333 MBps performance.

Compared with S26KS256SDGBHB030, the S26KS256SDABHB020 trades speed and noise immunity for 3.0 V compatibility, while S26KL256SDGBHB030 maintains identical I/O performance but shifts core voltage to 3.0 V-requiring revised power rail design but preserving all timing and feature parity.

Availability

S26KS256SDGBHB030 is available at Aetrix Electronics and suitable for automotive gateway modules, industrial PLC firmware storage, medical imaging boot memory, and avionics display controllers requiring stable component supply across extended temperature and long lifecycle programs.

Supply support for S26KS256SDGBHB030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This part belongs to the HYPERFLASH™ family-designed specifically for high-speed, low-pin-count code storage in automotive, industrial, and aerospace systems requiring deterministic boot performance and long-term data integrity.

FAQ

What is the difference between RWDS and CK/CK# in HYPERBUS™ timing?

RWDS is an output strobe synchronized to read data edges and used solely to indicate valid DQ values during reads; CK/CK# are differential inputs that serve as the master timing reference for all DDR sampling events. RWDS does not drive write operations and is inactive during programming or erase cycles.

Does S26KS256SDGBHB030 support linear burst reads across page boundaries?

Yes-it automatically prefetches the next sequential page during linear burst mode, enabling continuous 333 MBps throughput without host intervention. This behavior is enabled by internal MIRRORBIT™ array architecture and is independent of address wrap-around constraints.

How is ECC applied to data stored in this device?

ECC is applied per 512-byte sector with dedicated hardware logic: 1-bit errors are corrected transparently during read, and 2-bit errors trigger INT# assertion for host-level handling. ECC coverage includes main array, parameter sectors, and one-time-programmable (OTP) regions.

Can RSTO# be disabled or reconfigured after power-up?

Yes-RSTO# pulse duration is user-configurable via non-volatile register settings. The default LOW period is factory-set but can be modified using standard command sequences; configuration persists across power cycles and does not require external pull-up/down components.

S26KS256SDGBHB030 Specifications

Product attributes
Attribute value
Manufacturer:
Spansion
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS256SDGBHB030 FAQ

1.How can I place an order for S26KS256SDGBHB030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS256SDGBHB030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS256SDGBHB030 reliable?

The price and inventory of S26KS256SDGBHB030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDGBHB030 is usually 5 days.

3.What payment methods are accepted for S26KS256SDGBHB030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDGBHB030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS256SDGBHB030?

S26KS256SDGBHB030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS256SDGBHB030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS256SDGBHB030?

For technical support, including S26KS256SDGBHB030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDGBHB030 requirements.

6.How does Aetrix verify that S26KS256SDGBHB030 is sourced from the original manufacturer or authorized distributors?

All S26KS256SDGBHB030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDGBHB030 meets industry standards.

7.What is the process for return or replacement of S26KS256SDGBHB030?

All S26KS256SDGBHB030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDGBHB030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS256SDGBHB030 part is unused and in its original packaging.

Return procedure for S26KS256SDGBHB030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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