Spansion S26KS256SDGBHI030
- Part No.:
- S26KS256SDGBHI030
- Manufacturer:
- Spansion
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS256SDGBHI030.pdf
- Description:
- PARALLEL NOR HYPERFLASH, 2568MB
- Quantity:
- Payment:

- Shipping:

Inventory:329
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Product details
Overview
S26KS256SDGBHI030 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive-grade AEC-Q100 Grade 2 applications.
For engineers reviewing the S26KS256SDGBHI030 datasheet, S26KS256SDGBHI030 pinout, S26KS256SDGBHI030 application, or S26KS256SDGBHI030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), ECC 1-bit correction/2-bit detection, configurable burst modes (16/32/64-byte wrapped or linear), low-power deep power-down (4 µA), and RSTO#/INT# interrupt signaling for real-time system control.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages DDR signal capture and data transfer timing using CK/CK# and RWDS, while Embedded Algorithm Controller (EAC) executes internal program/erase algorithms without host intervention. All command/address/data transfers occur over the same 8-bit DQ bus in DDR fashion - two 8-bit transfers per clock cycle.
It uses MIRRORBIT™ NOR flash technology with page-aligned 32-byte random reads (two 16-byte half-pages), center-aligned command/address and edge-aligned read-data relative to RWDS transitions. Burst operations support hybrid mode (one wrapped burst followed by linear burst), and initial latency ranges from 5–16 clock cycles depending on configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - fixed capacity for boot code and firmware storage in resource-constrained embedded systems. |
| Interface Standard | HYPERRBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe, reducing pin count vs parallel NOR. |
| Max Read Throughput | 333 MBps - achieved at 166 MHz clock with 2× DDR data rate (1-byte × 2 edges × 166 MHz), enabling fast application loading. |
| Random Access Time | 96 ns - initial latency for first word retrieval, critical for deterministic boot and real-time interrupt response. |
| Operating Temperature | –40°C to +105°C (Industrial Plus) - qualified per AEC-Q100 Grade 2, suitable for under-hood automotive ECUs. |
| Data Retention | 20 years - guaranteed non-volatile data integrity without refresh, essential for long-life industrial firmware storage. |
| ECC Support | 1-bit correction / 2-bit detection - hardware-implemented error handling for robust operation in radiation-prone environments. |
Pinout & Package
Package: 24-ball FBGA (VAA024), 6 mm × 8 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR timing; enables precise sampling of DQ and RWDS signals in high-speed read operations. |
| CS# | Chip select (active-low) | Enables device communication; must be asserted before command initiation and held active during burst transactions. |
| RWDS | Read data strobe output | Indicates valid read data on DQ; edge-aligned to data transitions, used by host to latch incoming bytes. |
| DQ[7:0] | Bi-directional data bus | Carries commands, addresses, and data in DDR mode - 8 bits per edge, 16 bits per full clock cycle. |
| INT# | Interrupt output | Asserted on Busy→Ready transition or ECC error detection, enabling asynchronous host notification without polling. |
| RSTO# | Reset output | Generates system-level power-on reset pulse; duration configurable via internal register for compatibility with diverse SoC reset logic. |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR interface | Reduces signal count to 12 pins (vs ≥40 for legacy parallel NOR), simplifying PCB routing and improving EMI performance. |
| Configurable burst length | Supports 16/32/64-byte wrapped bursts or linear bursts - optimizes bandwidth utilization for both small firmware patches and large image loads. |
| Deep Power-Down mode | 4 µA typical current draw at 85°C - extends battery life in always-on automotive modules during sleep states. |
| Hardware ECC engine | On-the-fly 1-bit correction and 2-bit detection without CPU overhead - ensures data integrity in safety-critical boot paths. |
| Uniform 256-KB sectors | Enables predictable erase timing (930 ms/sector) and deterministic firmware update scheduling in OTA architectures. |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Repository |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware for radar processing units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary non-volatile code execution memory with deterministic 96 ns random access and ECC-protected reads. Use Value: Enables <100 ms cold-boot time and meets ISO 26262 ASIL-B requirements via hardware ECC and 20-year retention. | Use Scenario: Holds field-upgradable control logic and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: High-reliability firmware archive supporting 100,000 program/erase cycles and 256-KB sector granularity for modular updates. Use Value: Reduces maintenance downtime via fast 333 MBps read throughput and deep power-down (4 µA) during idle cycles. |
| Medical Imaging System Configuration Memory | Avionics Display Unit Code Storage |
Use Scenario: Stores calibration tables and UI assets in portable ultrasound devices requiring extended temperature operation and data integrity. IC Role / Device Role / Timing Role: Non-volatile parameter store with –40°C to +105°C rating and CRC-verified read operations. Use Value: Ensures consistent image rendering across thermal cycles and prevents corruption during power-loss events via RSTO#-triggered safe reboot. | Use Scenario: Hosts display firmware and font libraries in certified cockpit displays where DO-160 environmental resilience is mandatory. IC Role / Device Role / Timing Role: Certified code storage with AEC-Q100 Grade 2 equivalence and 25 µA standby current for low-power avionics busses. Use Value: Meets RTCA DO-160 Section 22 lightning-induced transient immunity via robust HYPERBUS™ signal integrity and low-noise 1.8 V I/O. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S26KS256SDABHI020 | Same density and package, but 3.0 V I/O (not 1.8 V); max clock 100 MHz (200 MBps), no differential clock. | Targeted at legacy 3.0 V systems with simpler single-ended clocking; lacks HYPERBUS™ high-speed capability. | Select when interfacing with older microcontrollers lacking differential clock receivers or 1.8 V I/O support. |
| S26KL256SDGBHI030 | Identical pinout and timing, but 3.0 V core (VCC) instead of 1.8 V; shares same 1.8 V I/O and HYPERBUS™ interface. | Designed for mixed-voltage systems where core voltage regulation differs; retains full 333 MBps performance. | Choose when board-level power architecture supplies separate 3.0 V core rail but maintains 1.8 V I/O domain. |
Compared with S26KS256SDABHI020, this part enables higher bandwidth and lower EMI via differential clocking; compared with S26KL256SDGBHI030, it reduces total system power by eliminating the need for a 3.0 V core supply while maintaining identical interface performance.
Availability
S26KS256SDGBHI030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and avionics display units requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for S26KS256SDGBHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
This device belongs to the HYPERFLASH™ family - engineered specifically for high-bandwidth, low-pin-count code storage in safety-critical embedded systems demanding deterministic timing and long-term reliability.
FAQ
What is the minimum wake-up time from Deep Power-Down mode?
The S26KS256SDGBHI030 requires 300 µs to exit Deep Power-Down mode and resume normal operation. During this period, CS# must remain HIGH and no commands may be issued. The device automatically initializes internal circuitry and validates memory state before accepting new commands, ensuring reliable recovery without external reset assertion.
Does this device support linear burst reads across page boundaries?
Yes - in Linear Burst mode, the device automatically fetches the next sequential 32-byte page from the MIRRORBIT™ array while bursting out the current page. This pipelined operation sustains 333 MBps throughput without host intervention and eliminates boundary stalls, making it ideal for streaming firmware images or large lookup tables.
How is ECC handled during read operations?
ECC is applied transparently during every read: 1-bit errors are corrected in hardware and delivered error-free to the host; 2-bit errors trigger the INT# pin and set an internal status flag. No software overhead is required for correction, and uncorrectable errors are reported before data is latched, preventing corrupted values from entering the processor pipeline.
Can RSTO# pulse width be modified after power-up?
Yes - RSTO# LOW duration is user-configurable via the Device Configuration Register (DCR), accessible through standard HYPERBUS™ command sequences. Valid settings range from 1 ms to 128 ms in powers of two, allowing alignment with diverse SoC reset timing requirements without hardware changes.
S26KS256SDGBHI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Spansion
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS256SDGBHI030 FAQ
1.How can I place an order for S26KS256SDGBHI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS256SDGBHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS256SDGBHI030 reliable?
The price and inventory of S26KS256SDGBHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDGBHI030 is usually 5 days.
3.What payment methods are accepted for S26KS256SDGBHI030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDGBHI030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS256SDGBHI030?
S26KS256SDGBHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS256SDGBHI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS256SDGBHI030?
For technical support, including S26KS256SDGBHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDGBHI030 requirements.
6.How does Aetrix verify that S26KS256SDGBHI030 is sourced from the original manufacturer or authorized distributors?
All S26KS256SDGBHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDGBHI030 meets industry standards.
7.What is the process for return or replacement of S26KS256SDGBHI030?
All S26KS256SDGBHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDGBHI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS256SDGBHI030 part is unused and in its original packaging.
Return procedure for S26KS256SDGBHI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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