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Spansion S26KS256SDGBHN030
- Part No.:
- S26KS256SDGBHN030
- Manufacturer:
- Spansion
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS256SDGBHN030.pdf
- Description:
- PARALLEL NOR HYPERFLASH, 2568MB
- Quantity:
- Payment:
- Shipping:
Inventory:358
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Product details
Overview
S26KS256SDGBHN030 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across industrial temperature range (–40°C to +85°C) in a 24-ball FBGA package. Used in automotive ADAS ECUs for fast boot code execution.
For engineers reviewing the S26KS256SDGBHN030 datasheet, S26KS256SDGBHN030 pinout, S26KS256SDGBHN030 application, or S26KS256SDGBHN030 equivalent, key selection criteria include HYPERBUS™ timing compliance, ECC 1-bit correction capability, RWDS-synchronized DDR read latency (96 ns tACC), and AEC-Q100 Grade 3 qualification for automotive embedded systems.
Technical Context
The device implements a synchronous DDR interface using differential CK/CK# for precise timing capture and RWDS as a read-data strobe referenced to CK edges. Its internal MIRRORBIT™ architecture enables 16-bit word-aligned addressing and page-based access with 32-byte pages composed of two 16-byte half-pages.
Control logic splits into Host Interface Controller (HIC) for signal monitoring and data transfer coordination, and Embedded Algorithm Controller (EAC) for autonomous execution of program/erase sequences. Burst modes-wrapped (16/32/64 bytes) or linear-are configurable per transaction, with hybrid burst support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - fixed capacity for boot firmware storage in resource-constrained ECUs |
| Interface Protocol | HYPERTBUS™ DDR - low-pin-count 12-signal interface enabling high-speed read without parallel address bus |
| Max Read Throughput | 333 MBps - achieved via dual-edge 8-bit DQ transfers at 166 MHz, eliminating wait states for sequential code fetch |
| Initial Access Latency | 96 ns tACC - deterministic random read delay critical for real-time interrupt response in safety-critical systems |
| ECC Capability | 1-bit correction / 2-bit detection - hardware-implemented error handling reduces host CPU overhead for memory integrity checks |
| Operating Temperature | –40°C to +85°C (Industrial) - validated for under-hood ECU deployment without thermal derating |
| Endurance & Retention | 100,000 P/E cycles / 20-year data retention - meets automotive firmware update and calibration storage requirements |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK, CK# | Differential clock input | Reference for DDR timing capture; enables jitter-tolerant 166 MHz operation without external PLL |
| CS# | Chip select (active-low) | Enables device communication; HIGH places device in standby (25 µA) or deep power-down (4 µA) |
| RWDS | Read data strobe output | Edge-aligned output indicating valid DQ data during reads; eliminates need for separate RD# signal |
| DQ[7:0] | Bi-directional data bus | Transfers command/address/write-data on rising/falling edges; carries 16-bit words across two consecutive half-cycles |
| INT# | Interrupt output | Asserts on ECC detection or busy-to-ready transition, enabling asynchronous host notification without polling |
| RSTO# | Reset output | User-configurable LOW pulse for system-level power-on reset; decouples memory reset from SoC POR sequencing |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR interface | Reduces signal count to 12 pins vs. traditional parallel NOR, simplifying PCB routing and lowering EMI in dense automotive modules |
| Configurable burst mode | Supports wrapped (16/32/64 byte) or linear bursts per transaction, optimizing bandwidth for both small ISR fetches and large image loads |
| 512-byte program buffer | Enables 1 MBps write speed via buffered programming, cutting firmware update time by >90% vs. single-word writes |
| Hardware ECC engine | Performs real-time 1-bit correction without CPU intervention, meeting ASIL-B fault containment requirements |
| AEC-Q100 Grade 3 | Qualified for automotive applications up to +85°C ambient, with full traceability and PPAP documentation support |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware for radar processing units requiring sub-100 ms cold start. IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed via HYPERBUS™ DDR interface during power-up initialization sequence. Use Value: 96 ns tACC and 333 MBps read throughput enable full boot image load within 100 ms, satisfying ISO 26262 ASIL-D startup timing constraints. | Use Scenario: Holds field-upgradable control logic and configuration data in modular automation controllers operating in factory environments. IC Role / Device Role / Timing Role: Persistent firmware repository supporting over-the-air updates and runtime parameter persistence with ECC protection. Use Value: 100,000 P/E cycles and 20-year retention ensure reliable operation over 15+ year product lifecycle without field replacement. |
| Medical Imaging System Configuration | Avionics Display Module Code Storage |
Use Scenario: Stores calibrated sensor profiles and UI assets in portable ultrasound devices requiring rapid power-cycle recovery. IC Role / Device Role / Timing Role: Non-volatile configuration store accessed during warm boot; leverages deep power-down (4 µA) between sessions. Use Value: Deep power-down current and 300 µs wake-up time minimize battery drain while maintaining instant-on responsiveness for clinical use. | Use Scenario: Hosts certified display firmware in DO-178C Level C avionics displays where data integrity and deterministic timing are mandatory. IC Role / Device Role / Timing Role: Safety-certified code memory with hardware ECC and AEC-Q100 alignment for DO-254 hardware assurance. Use Value: Built-in CRC and ECC meet RTCA/DO-160 lightning-induced transient immunity requirements for airborne electronics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-SXIT | 4 Mb Quad SPI FRAM; no erase latency, unlimited endurance, but max 40 MBps read speed | Best for frequent small-write logging; unsuitable for high-bandwidth boot code fetch | Select only when write cycle count dominates over read throughput requirements |
| S26KL256SDHBHI020 | Same density and HYPERBUS™ interface but 3.0 V I/O; lower max clock (100 MHz / 200 MBps); no AEC-Q100 grade | Targeted at industrial non-automotive systems with legacy 3.0 V supply rails | Choose only if 3.0 V compatibility is mandatory and 200 MBps read speed suffices |
Compared with CY15B104QN-SXIT and S26KL256SDHBHI020, S26KS256SDGBHN030 uniquely balances automotive-grade reliability, 333 MBps DDR read performance, and hardware ECC-making it the sole option for ASIL-B/C boot memory where both speed and safety certification are non-negotiable.
Availability
S26KS256SDGBHN030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and avionics display modules requiring stable component supply across extended product lifecycles.
Supply support for S26KS256SDGBHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
This part belongs to the HYPERFLASH™ family-designed specifically for automotive and industrial systems needing high-speed, low-pin-count, safety-certified NOR flash with deterministic read latency and embedded ECC.
FAQ
What is the minimum supported clock frequency for S26KS256SDGBHN030?
The device supports variable clock rates down to DC (0 Hz) in active mode, with functional operation confirmed from 1 MHz to 166 MHz. At frequencies below 10 MHz, RWDS timing margins increase but remain within specification; no minimum clock is enforced by the embedded algorithm controller.
Does S26KS256SDGBHN030 require external voltage regulators for VCC and VCCQ?
Yes-it requires separate 1.8 V supplies for core (VCC) and I/O (VCCQ), each with dedicated decoupling capacitors. The datasheet specifies ±5% tolerance for both rails; deviation beyond this range risks timing violation or ECC failure during high-speed bursts.
How is the 512-byte program buffer utilized during write operations?
The buffer accepts up to 512 bytes of write data in a single command sequence, then executes internal page programming in ~475 µs. Host software must align addresses to 16-byte boundaries and avoid crossing 256-KB sector boundaries during buffered writes to prevent abort.
Can S26KS256SDGBHN030 operate in linear burst mode without pre-fetching adjacent pages?
No-linear burst mode automatically initiates pre-fetch of the next sequential 32-byte page during current page output. This concurrent fetch/output mechanism is hardwired in the EAC and cannot be disabled; it is essential to achieving sustained 333 MBps throughput.
S26KS256SDGBHN030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Spansion
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS256SDGBHN030 FAQ
1.How can I place an order for S26KS256SDGBHN030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS256SDGBHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS256SDGBHN030 reliable?
The price and inventory of S26KS256SDGBHN030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDGBHN030 is usually 5 days.
3.What payment methods are accepted for S26KS256SDGBHN030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDGBHN030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS256SDGBHN030?
S26KS256SDGBHN030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS256SDGBHN030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS256SDGBHN030?
For technical support, including S26KS256SDGBHN030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDGBHN030 requirements.
6.How does Aetrix verify that S26KS256SDGBHN030 is sourced from the original manufacturer or authorized distributors?
All S26KS256SDGBHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDGBHN030 meets industry standards.
7.What is the process for return or replacement of S26KS256SDGBHN030?
All S26KS256SDGBHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDGBHN030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS256SDGBHN030 part is unused and in its original packaging.
Return procedure for S26KS256SDGBHN030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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