Infineon Technologies S26KS256SDPBHA020
- Part No.:
- S26KS256SDPBHA020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS256SDPBHA020.pdf
- Description:
- IC FLASH 256MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,861
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Product details
Overview
S26KS256SDPBHA020 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, RWDS read strobe, and CS# control. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.
For engineers reviewing the S26KS256SDPBHA020 datasheet, S26KS256SDPBHA020 pinout, S26KS256SDPBHA020 application, or S26KS256SDPBHA020 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive infotainment boot storage.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and data transfer timing, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for high-density NOR cell structure and supports both wrapped (16/32/64-byte) and linear burst modes.
HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers; RWDS output is edge-aligned to CK/CK# transitions during reads, enabling precise data capture. Initial latency ranges from 5–16 clock cycles depending on configuration, and DCARS (DDR Center-Aligned Read Strobe) ensures deterministic timing for high-speed sequential access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - provides sufficient space for full firmware images and parameter tables in embedded boot applications. |
| Interface Standard | HYPERTBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read throughput via 2-data-per-clock on 8-bit bus. |
| Max Clock Rate | 166 MHz at 1.8 V - enables 333 MBps sustained read bandwidth (1 byte × 2 edges × 166 MHz). |
| Random Access Time | 96 ns - defines minimum latency for first-word retrieval after address setup, critical for boot code execution speed. |
| Power Modes | Deep Power-Down: 4 µA (typical) - allows ultra-low standby current without wake-up delay penalty in always-on systems. |
| ECC Capability | 1-bit correction / 2-bit detection - mitigates single-event upsets in automotive/industrial environments without external error-handling logic. |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-life requirements for field-deployed industrial controllers. |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides low-jitter, noise-immune timing reference for DDR data capture; required for 166 MHz operation. |
| CS# | Chip select (active low) | Enables device communication; HIGH places device in standby or deep power-down mode. |
| RWDS | Read data strobe output | Edge-aligned to data transitions during reads; used by host to latch valid DQ values, not used for writes. |
| DQ[7:0] | Bi-directional DDR data bus | Carries command, address, and data in time-multiplexed DDR format; 8-bit width reduces PCB routing complexity. |
| INT# | Interrupt output | Signals host on ECC error detection or busy-to-ready transition, enabling asynchronous status monitoring. |
| RSTO# | Reset output | User-configurable active-low reset pulse for system-level power-on initialization sequence coordination. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - enables optimization for cache-line fetch vs streaming media playback. |
| Program buffer | 512-byte write buffer - improves effective programming speed to ~1 MBps, reducing host wait time during firmware updates. |
| Sector protection | Volatile and non-volatile locking per 256-KB sector plus optional 4-KB parameter sectors - prevents accidental overwrite of bootloader or calibration data. |
| Temperature grading | AEC-Q100 Grade 3 (–40°C to +85°C) - qualified for automotive infotainment and ADAS domain controller boot storage. |
| CRC and ECC | On-the-fly CRC generation and 1-bit/2-bit ECC - ensures data integrity across power cycles and radiation-prone environments without software overhead. |
Applications
| Automotive Infotainment Boot Storage | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and OS kernel for head-unit MCU requiring fast, reliable startup within 500 ms after power-on. IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to MCU's HYPERBUS™ master port; provides deterministic 96 ns random access and 333 MBps sequential read. Use Value: Eliminates external SRAM buffering and reduces boot latency by >40% vs legacy parallel NOR, while maintaining AEC-Q100 compliance. | Use Scenario: Holding firmware and configuration data for programmable logic controllers deployed in factory automation cabinets with wide ambient temperature swings. IC Role / Device Role / Timing Role: Standalone firmware repository with hardware-based sector protection; operates continuously across –40°C to +85°C without derating. Use Value: Prevents field failures due to unintended firmware corruption during hot-plug maintenance or ESD events via non-volatile sector lock and ECC. |
| Medical Imaging System Code Storage | 5G Baseband Radio Firmware Cache |
Use Scenario: Hosting diagnostic application binaries and calibration tables in portable ultrasound devices where data integrity is safety-critical. IC Role / Device Role / Timing Role: Secure, ECC-protected code store accessed via HYPERBUS™; supports CRC verification on load and runtime ECC scrubbing. Use Value: Meets IEC 62304 Class C software requirements through hardware-enforced error detection and 20-year retention guarantee. | Use Scenario: Caching FPGA bitstreams and DSP firmware in remote radio units requiring rapid reconfiguration during network handover. IC Role / Device Role / Timing Role: High-bandwidth firmware cache connected to SoC's HYPERBUS™ interface; leverages linear burst mode for continuous 333 MBps streaming. Use Value: Enables sub-100 ms radio reconfiguration by eliminating PCIe or SPI bottlenecks, improving spectral efficiency in dynamic TDD networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS256SDPBHA020 (now Infineon) | Same part number, identical electrical and timing specs - legacy branding pre-acquisition. | No functional difference; identical qualification and packaging. | Select for continuity in existing BOMs with legacy design documentation referencing Cypress. |
| Macronix MX25L25645G | Quad SPI interface, 133 MHz max clock, no differential clock or RWDS; 80 MBps max read throughput. | Lacks HYPERBUS™ timing precision and DDR bandwidth; suitable only where MCU lacks HYPERBUS™ master support. | Choose only when migrating from SPI-based designs and bandwidth < 100 MBps is acceptable. |
Compared with S26KS256SDPBHA020, the Cypress-branded variant offers identical performance and qualification, while the Macronix MX25L25645G trades bandwidth and timing determinism for broader MCU compatibility - making it viable only in cost-sensitive, lower-throughput applications without strict boot latency requirements.
Availability
S26KS256SDPBHA020 is available at Aetrix Electronics and suitable for automotive infotainment, industrial PLC firmware, medical imaging boot storage, and 5G radio reconfiguration requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for S26KS256SDPBHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification under ISO/TS 16949.
This device belongs to the HYPERFLASH™ family - designed specifically for high-bandwidth, low-pin-count boot and code storage in automotive, industrial, and communications systems requiring deterministic DDR flash access and robust data integrity.
FAQ
What is the minimum supported VCCQ voltage for S26KS256SDPBHA020?
The device supports 1.8 V ±0.15 V for VCCQ (I/O supply) in high-speed mode; operation below 1.65 V is not guaranteed and may cause timing violations or RWDS synchronization failure. The 3.0 V variant (S26KS256SDP**BHA020**) uses separate VCC/VCCQ rails but this specific part number is 1.8 V I/O only, per ordering code suffix 'D' and datasheet Table 14.1.
Does S26KS256SDPBHA020 require external termination resistors on CK/CK# or DQ lines?
Yes - the datasheet specifies 50 Ω series termination on CK/CK# near the memory device and 50 Ω parallel termination to VCCQ on DQ lines for impedance matching. Failure to implement these results in signal integrity degradation above 100 MHz and unreliable 166 MHz operation.
Can RWDS be disabled or repurposed as a general-purpose I/O?
No - RWDS is a dedicated, unidirectional output strictly tied to read data strobe timing and cannot be disabled or reassigned. Its behavior is fixed per HYPERBUS™ specification: active during read data windows, inactive otherwise, and required for proper DDR data capture by the host controller.
How does the 512-byte program buffer improve firmware update performance?
The buffer enables burst programming of up to 512 bytes per command, achieving ~1 MBps effective write speed versus 4 KBps for single-word writes. This reduces total update time for a 2 MB firmware image from ~500 seconds to ~2 seconds, minimizing system downtime during field upgrades.
S26KS256SDPBHA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS256SDPBHA020 FAQ
1.How can I place an order for S26KS256SDPBHA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS256SDPBHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS256SDPBHA020 reliable?
The price and inventory of S26KS256SDPBHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDPBHA020 is usually 5 days.
3.What payment methods are accepted for S26KS256SDPBHA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDPBHA020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS256SDPBHA020?
S26KS256SDPBHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS256SDPBHA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS256SDPBHA020?
For technical support, including S26KS256SDPBHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDPBHA020 requirements.
6.How does Aetrix verify that S26KS256SDPBHA020 is sourced from the original manufacturer or authorized distributors?
All S26KS256SDPBHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDPBHA020 meets industry standards.
7.What is the process for return or replacement of S26KS256SDPBHA020?
All S26KS256SDPBHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDPBHA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS256SDPBHA020 part is unused and in its original packaging.
Return procedure for S26KS256SDPBHA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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