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Infineon Technologies S26KS256SDPBHA023

Part No.:
S26KS256SDPBHA023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS256SDPBHA023.pdf
Description:
IC FLASH 256MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,666

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Product details

Overview

S26KS256SDPBHA023 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) for automotive and industrial embedded boot storage.

For engineers reviewing the S26KS256SDPBHA023 datasheet, S26KS256SDPBHA023 pinout, S26KS256SDPBHA023 application, or S26KS256SDPBHA023 equivalent, key selection criteria include HYPERBUS™ timing compliance, ECC 1-bit correction/2-bit detection capability, RWDS-synchronized DDR read alignment, and AEC-Q100 Grade 2 qualification for automotive powertrain and ADAS control units.

Technical Context

The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. All command/address/data traffic occurs over the same 8-bit DQ bus in DDR mode.

It uses MIRRORBIT™ floating-gate technology with center-aligned command/address and edge-aligned read-data relative to RWDS transitions. Burst modes-wrapped (16/32/64 bytes) or linear-are configurable per transaction, enabling optimized sequential code fetch for microcontroller boot execution.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mb (32 MB), organized as 32,768 × 65,536-bit array for full-code storage in resource-constrained MCUs.
Interface Standard HYPERTBUS™ DDR: 8-bit bidirectional DQ bus with differential CK/CK#, RWDS strobe, and CS# - reduces pin count vs. parallel NOR while sustaining >300 MBps reads.
Max Read Throughput 333 MBps at 166 MHz (1.8 V), achieved via two 8-bit transfers per clock cycle - enables fast application loading in infotainment and gateway ECUs.
Initial Access Latency 96 ns random read access time (5–16 clock cycles), critical for deterministic boot-time performance in safety-critical systems.
ECC & Data Integrity On-die 1-bit error correction / 2-bit error detection + CRC support - ensures firmware integrity without external logic in ASIL-B designs.
Power Modes Deep Power-Down: 4 µA (typical); Active Clock Stop during read: 12 mA - extends battery life in always-on telematics modules.
Endurance & Retention 100,000 program/erase cycles; 20-year data retention - validated for lifetime field operation in industrial PLCs and automotive ECUs.

Pinout & Package

24-ball Fortified Ball Grid Array (FBGA), 5 mm × 5 mm × 1.0 mm (VAA024 package), RoHS-compliant, with 0.8 mm ball pitch and bottom-side thermal pad for enhanced thermal dissipation in high-density PCB layouts.

Pin/Terminal Circuit Role Design Meaning
CK / CK# Differential clock input Defines DDR timing reference; CK rising/falling edges sample command/address on DQ; CK# enables noise-immune clock recovery.
CS# Chip select (active low) Enables device communication; HIGH places device in standby or deep power-down depending on mode configuration.
RWDS Read data strobe output Indicates valid read data window; edges align with DQ transitions - used by host to latch DDR data without additional timing margin.
DQ[7:0] Bidirectional DDR data bus Carries commands, addresses, and 8-bit-wide data on both clock edges; eliminates separate address bus and reduces PCB layer count.
INT# Interrupt output Asserts on ECC error detection or busy-to-ready transition - enables real-time fault reporting in safety-monitoring subsystems.
RSTO# Reset output Generates system-level power-on reset pulse; LOW duration user-configurable - simplifies reset sequencing in multi-rail power domains.

Key Features

Feature Design Value
HYPERBUS™ DDR Interface Reduces signal count to 11–12 pins vs. 40+ for legacy parallel NOR - cuts routing complexity and improves SI in high-speed MCU interfaces.
Configurable Burst Mode Per-transaction selection of wrapped (16/32/64-byte) or linear burst - optimizes cache line fill efficiency for ARM Cortex-R/A series processors.
Embedded Algorithm Controller (EAC) Executes autonomous program/erase sequences - eliminates host CPU overhead and guarantees timing-critical flash operations in real-time OS environments.
Advanced Sector Protection Volatile and non-volatile lock bits per 256-KB sector - prevents accidental overwrite of bootloader or calibration data in production and field update scenarios.
AEC-Q100 Grade 2 Qualification Validated for –40°C to +105°C operation with ISO/TS 16949 process control - meets functional safety requirements for powertrain and chassis control applications.

Applications

Automotive ADAS Camera Module Industrial PLC Firmware Storage

Use Scenario: Stores boot firmware and image processing algorithms for 8-MP surround-view camera ECU with <500 ms cold-boot requirement.

IC Role / Device Role / Timing Role: Primary boot memory interfaced directly to TI TDA4VM SoC via HYPERBUS™; provides deterministic 96 ns random access and 333 MBps burst reads.

Use Value: Enables sub-second boot and seamless firmware updates without external ECC logic - reducing BOM cost and board area.

Use Scenario: Holds runtime firmware, configuration tables, and diagnostic logs in DIN-rail mounted programmable logic controller operating continuously at 70°C ambient.

IC Role / Device Role / Timing Role: Non-volatile code storage with 20-year retention and 100K-cycle endurance; accessed via Renesas RX72M MCU HYPERBUS™ controller.

Use Value: Eliminates need for external backup battery or supercapacitor - simplifying certification for UL 508 industrial safety standards.

Automotive Gateway ECU Medical Imaging Control Board

Use Scenario: Stores multi-protocol stack (CAN FD, Ethernet AVB, LIN) firmware and secure boot keys in Zonal E/E architecture gateway.

IC Role / Device Role / Timing Role: Trusted execution environment (TEE) code vault with ECC protection and RSTO#-driven secure reset coordination.

Use Value: Supports ASIL-B software partitioning and cryptographic key isolation - meeting ISO 26262 Part 6 tool qualification requirements.

Use Scenario: Holds FPGA configuration bitstream and real-time motion compensation algorithms for portable ultrasound imaging system with battery backup.

IC Role / Device Role / Timing Role: Low-power boot memory with 4 µA deep power-down current and 300 µs wake-up - extending battery life between clinical sessions.

Use Value: Meets IEC 62304 Class C software lifecycle requirements through verified 20-year data retention and AEC-Q100 stress testing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S26KL256SDPBHA023 3.0 V I/O variant with single-ended clock (CK only), 100 MHz max clock, 200 MBps read throughput Targeted at legacy MCU platforms lacking differential clock receivers; higher voltage margin for noisy industrial environments Select when system lacks CK# receiver circuitry or requires wider VCC tolerance (2.7–3.6 V)
S26KS512SDPBHA023 512 Mb density, identical 1.8 V HYPERBUS™ interface, same package and timing specs Used where larger boot image size (>32 MB) is required for dual-application firmware or OTA update staging partitions Select when future-proofing for firmware growth or implementing A/B update schemes without changing PCB layout

Compared with S26KL256SDPBHA023, this part offers higher bandwidth and lower power at 1.8 V; compared with S26KS512SDPBHA023, it reduces cost and power consumption where 32 MB capacity suffices - making it optimal for cost-sensitive, thermally constrained ADAS and industrial nodes.

Availability

S26KS256SDPBHA023 is available at Aetrix Electronics and suitable for automotive ADAS camera modules, industrial PLC firmware storage, and medical imaging control boards requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.

Supply support for S26KS256SDPBHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.

This device belongs to the HYPERFLASH™ family - designed specifically to replace parallel NOR flash in high-performance embedded systems requiring DDR-speed code execution with minimal pin count and robust data integrity.

FAQ

What is the minimum supported clock frequency for S26KS256SDPBHA023?

The device supports variable clock rates down to DC (0 Hz) in active clock stop mode during read operations, with no wake-up latency. Functional operation begins at 1 MHz for standard read/write transactions, as confirmed by AC timing specifications in Rev. *Q datasheet Section 12.2.

Does S26KS256SDPBHA023 require external termination resistors on CK/CK# or DQ lines?

Yes - 100 Ω differential termination between CK and CK# is mandatory per datasheet Section 10.2; DQ lines require 50 Ω single-ended termination to VCCQ (1.8 V). These values ensure signal integrity at 166 MHz DDR operation and are specified in the HYPERBUS™ physical layer compliance guidelines.

Can RWDS be disabled or repurposed as a general-purpose I/O?

No - RWDS is a dedicated, unidirectional output strictly tied to read-data validity timing. It cannot be disabled, tri-stated, or reassigned. Its edge-aligned relationship to DQ transitions is fundamental to HYPERBUS™ DDR protocol compliance and is hardwired in the silicon design.

How is the 512-byte program buffer utilized during write operations?

The buffer accepts up to 512 bytes (4096 bits) in a single write transaction, enabling ~1 MBps programming throughput. Host writes fill the buffer sequentially; a final "program buffer" command triggers internal page programming - reducing host CPU polling overhead versus single-word programming at 4 KBps.

S26KS256SDPBHA023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
HyperBus
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS256SDPBHA023 FAQ

1.How can I place an order for S26KS256SDPBHA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS256SDPBHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS256SDPBHA023 reliable?

The price and inventory of S26KS256SDPBHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDPBHA023 is usually 5 days.

3.What payment methods are accepted for S26KS256SDPBHA023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDPBHA023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS256SDPBHA023?

S26KS256SDPBHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS256SDPBHA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS256SDPBHA023?

For technical support, including S26KS256SDPBHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDPBHA023 requirements.

6.How does Aetrix verify that S26KS256SDPBHA023 is sourced from the original manufacturer or authorized distributors?

All S26KS256SDPBHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDPBHA023 meets industry standards.

7.What is the process for return or replacement of S26KS256SDPBHA023?

All S26KS256SDPBHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDPBHA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS256SDPBHA023 part is unused and in its original packaging.

Return procedure for S26KS256SDPBHA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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