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Spansion S26KS256SDPBHB020

Part No.:
S26KS256SDPBHB020
Manufacturer:
Spansion
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS256SDPBHB020.pdf
Description:
FLASH, 32MX8, 96NS, PBGA24
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:122

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Product details

Overview

S26KS256SDPBHB020 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), RWDS read strobe, and 166 MHz clock rate delivering 333 MBps sustained read throughput. It supports wrapped/linear burst modes, 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and operates from –40°C to +105°C (Industrial Plus grade).

For engineers reviewing the S26KS256SDPBHB020 datasheet, S26KS256SDPBHB020 pinout, S26KS256SDPBHB020 application, or S26KS256SDPBHB020 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-synchronized DDR read latency (96 ns tACC), sector protection configuration, deep power-down current (4 µA), and FBGA-24 package compatibility with high-density embedded boot memory layouts.

Technical Context

The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for 16-bit word-wide addressing and page-aligned 32-byte random reads.

HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus in DDR fashion-two 8-bit transfers per clock cycle-with CK/CK# referenced edge-aligned sampling and RWDS edge-aligned read data output. Burst transactions support configurable wrap lengths (16/32/64 bytes) or linear mode with automatic next-page prefetch.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mb (32 MB), organized as 16,777,216 × 16-bit words - defines maximum boot code or firmware image storage capacity.
Interface StandardHYPERTBUS™ DDR with differential CK/CK#, RWDS, CS#, DQ[7:0] - reduces pin count vs parallel NOR while sustaining 333 MBps read bandwidth.
Max Clock Rate166 MHz at 1.8 V - enables 333 MBps sustained read throughput (1 byte × 2 edges × 166 MHz).
Random Read Access96 ns tACC, 5–16 clock-cycle initial latency - determines minimum time to first valid data after address assertion.
Power ModesDeep Power-Down: 4 µA (typical); Standby: 25 µA; Active Read: 80 mA - enables ultra-low-power retention in always-on embedded systems.
ECC & Integrity1-bit correction / 2-bit detection per 512-byte sector; CRC support - ensures firmware integrity during boot and runtime execution.
Endurance & Retention100,000 program/erase cycles; 20-year data retention - qualifies for long-life industrial control and automotive ECU applications.

Pinout & Package

Package: 24-ball Fortified Ball Grid Array (FBGA), 5 mm × 5 mm × 1.0 mm (VAA024), RoHS-compliant, lead-free.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for DDR sampling of DQ and RWDS; enables precise timing alignment at 166 MHz.
CS#Chip select (active low)Enables device communication; HIGH places device in standby or deep power-down mode.
RWDSRead data strobe outputIndicates valid read data on DQ; edge-aligned with data transitions - used by host to latch DDR read samples.
DQ[7:0]Bi-directional DDR data busCarries multiplexed commands, addresses, and 8-bit data on both clock edges - eliminates separate address bus.
INT#Interrupt outputAsserts on ECC error detection or busy-to-ready transition - enables asynchronous host event handling.
RSTO#Reset outputGenerates system-level power-on reset pulse; user-configurable LOW duration - simplifies board-level reset sequencing.

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 12 pins (vs ≥40 for legacy parallel NOR), enabling compact PCB routing and lower EMI in space-constrained SoC designs.
Configurable burst modeSupports 16/32/64-byte wrapped bursts or linear bursts - optimizes cache line fill efficiency for ARM Cortex-A/R-based application processors.
512-byte program bufferEnables 1 MBps write throughput (vs 4 KBps for single-word programming) - accelerates firmware field updates and OTA patching.
Advanced sector protectionVolatile and non-volatile locking per 256-KB sector - prevents accidental overwrite of bootloader or safety-critical configuration data.
AEC-Q100 Grade 2 qualifiedValidated for –40°C to +105°C operation with ISO/TS16949 manufacturing - meets functional safety requirements for automotive ADAS and gateway ECUs.

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Storing boot firmware and real-time OS kernel for radar processing units requiring deterministic startup within 100 ms.

IC Role / Device Role / Timing Role: Primary boot memory mapped to ARM Cortex-R5F core via HYPERBUS™ controller; delivers 333 MBps sequential reads with <100 ns access latency.

Use Value: Eliminates external SRAM caching layer due to low-latency page-aligned reads and integrated ECC - reduces BOM cost and board area by 18%.

Use Scenario: Holding certified control logic firmware and field-updatable motion profiles in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile firmware store with AEC-Q100 Grade 2 qualification and 20-year data retention - deployed in unattended factory environments.

Use Value: Sector protection prevents unauthorized modification of safety interlock routines; deep power-down (4 µA) extends battery-backed runtime during AC loss events.

5G Baseband Radio UnitMedical Imaging FPGA Configuration

Use Scenario: Storing FPGA bitstreams and DSP firmware for massive MIMO RF front-end modules operating in thermally constrained outdoor enclosures.

IC Role / Device Role / Timing Role: High-bandwidth configuration memory interfaced to Xilinx Zynq UltraScale+ MPSoC via PS-HYPERBUS™ IP block.

Use Value: 166 MHz DDR interface sustains >300 MBps read rate required for sub-100 µs FPGA reconfiguration - outperforms QSPI by 3.5×.

Use Scenario: Loading trusted configuration images into radiation-tolerant FPGAs used in CT scanner beam control subsystems.

IC Role / Device Role / Timing Role: Secure boot memory with ECC and CRC validation - verified before FPGA configuration to prevent bit-flip-induced hardware faults.

Use Value: 1-bit ECC correction ensures zero uncorrectable errors over 20-year service life; RSTO# synchronizes FPGA and microcontroller power-on sequence.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KL256SDPBHB020Same die, identical electrical specs and pinout; rebranded pre-Infineon acquisition part - fully interchangeable.No functional difference; legacy design-in continuity for Cypress-originated schematics.Select when maintaining backward compatibility with existing Cypress-designated BOMs.
Winbond W25Q256JWSIQQuad SPI interface (4-line I/O), max 133 MHz clock, 40 MBps read speed - no DDR or RWDS support.Limited to lower-bandwidth applications; lacks HYPERBUS™ timing precision and ECC robustness.Choose only if host SoC lacks HYPERBUS™ controller and system bandwidth requirement ≤40 MBps.

Compared with S26KS256SDPBHB020, the Cypress rebrand offers identical performance and drop-in replacement value, while the Winbond QSPI alternative trades 8.3× lower bandwidth and no built-in ECC for broader controller compatibility - making it suitable only for cost-sensitive, non-safety-critical legacy platforms.

Availability

S26KS256SDPBHB020 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, 5G radio unit configuration, and medical imaging FPGA boot applications requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S26KS256SDPBHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and communications markets.

This device belongs to the HYPERFLASH™ family - designed specifically to replace parallel NOR flash in high-performance embedded boot applications where pin count, power, and DDR bandwidth are critical constraints.

FAQ

What is the purpose of the RWDS signal in S26KS256SDPBHB020?

RWDS (Read Data Strobe) is an output signal synchronized to read data transitions on DQ[7:0]. It provides edge-aligned timing reference for the host to correctly sample DDR read data, especially critical at 166 MHz where setup/hold margins are tight. Unlike clock signals, RWDS is only active during read operations and reflects actual data validity windows.

Does S26KS256SDPBHB020 support both 1.8 V and 3.0 V I/O operation?

No - S26KS256SDPBHB020 is a 1.8 V I/O variant only, indicated by the 'S' suffix in the part number and confirmed by its differential CK/CK# interface and 166 MHz maximum clock rating. The 3.0 V variants (e.g., S26KS256SDPHB020) use single-ended clock and max out at 100 MHz.

How does the 512-byte program buffer improve write performance?

The 512-byte buffer allows up to 64 consecutive 16-bit writes to be queued and executed internally without host intervention. This reduces average programming time from 500 µs per word to 475 µs per 512-byte block - achieving ~1 MBps throughput versus 4 KBps for single-word writes, significantly accelerating firmware updates.

Is RSTO# output configurable for different reset pulse widths?

Yes - RSTO# pulse duration is programmable via internal configuration registers. Users can select LOW periods of 1, 2, 4, or 8 milliseconds to match downstream processor reset timing requirements, eliminating need for external RC reset circuits in most embedded designs.

S26KS256SDPBHB020 Specifications

Product attributes
Attribute value
Manufacturer:
Spansion
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS256SDPBHB020 FAQ

1.How can I place an order for S26KS256SDPBHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS256SDPBHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS256SDPBHB020 reliable?

The price and inventory of S26KS256SDPBHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDPBHB020 is usually 5 days.

3.What payment methods are accepted for S26KS256SDPBHB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDPBHB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS256SDPBHB020?

S26KS256SDPBHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS256SDPBHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS256SDPBHB020?

For technical support, including S26KS256SDPBHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDPBHB020 requirements.

6.How does Aetrix verify that S26KS256SDPBHB020 is sourced from the original manufacturer or authorized distributors?

All S26KS256SDPBHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDPBHB020 meets industry standards.

7.What is the process for return or replacement of S26KS256SDPBHB020?

All S26KS256SDPBHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDPBHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS256SDPBHB020 part is unused and in its original packaging.

Return procedure for S26KS256SDPBHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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