Infineon Technologies S26KS256SDPBHB023
- Part No.:
- S26KS256SDPBHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS256SDPBHB023.pdf
- Description:
- IC FLASH 256MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,405
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Product details
Overview
S26KS256SDPBHB023 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive-grade AEC-Q100 Grade 2 compliance.
For engineers reviewing the S26KS256SDPBHB023 datasheet, S26KS256SDPBHB023 pinout, S26KS256SDPBHB023 application, or S26KS256SDPBHB023 equivalent, key selection criteria include DDR burst timing alignment, RWDS-synchronized read latency (96 ns initial access), ECC 1-bit correction/2-bit detection, and low-power deep power-down mode (4 µA typical).
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-synchronized data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase algorithms without host intervention. All command/address/data transfers occur over the same 8-bit DQ bus using DDR edge-aligned timing.
HYPERBUS™ protocol enforces strict timing alignment: command/address values are center-aligned to CK/CK# edges, while read data is edge-aligned to RWDS transitions. Burst operations support configurable wrapped (16/32/64-byte) or linear modes, with automatic page prefetch enabling sustained 333 MBps throughput during sequential reads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - fixed capacity for boot code and firmware storage in resource-constrained embedded systems |
| Interface Standard | HYPERTBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe for precise read timing |
| Max Read Throughput | 333 MBps - achieved via dual-edge 8-bit transfers at 166 MHz, enabling fast application loading in MCU boot scenarios |
| Initial Random Access Time | 96 ns - latency from CS# assertion to first valid data output, critical for deterministic boot timing |
| ECC Capability | 1-bit correction / 2-bit detection - hardware-implemented error handling for reliable long-term firmware integrity |
| Power Modes | Deep Power-Down: 4 µA (typical); Standby: 25 µA; Active Read: 80 mA - enables ultra-low quiescent current in always-on automotive modules |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention - validated for mission-critical firmware storage in industrial control units |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential Clock Input | Reference timing for all DDR transfers; CK rising/falling edges sample command/address; CK# provides noise immunity |
| CS# | Chip Select (Active Low) | Enables device communication; HIGH places device in standby or deep power-down depending on state |
| RWDS | Read Data Strobe Output | Source-synchronous output aligned to read data edges; used by host to latch valid DQ[7:0] values |
| DQ[7:0] | Bi-directional Data Bus | Carries commands, addresses, and data in DDR fashion; 8-bit width reduces PCB routing complexity vs parallel NOR |
| INT# | Interrupt Output | Asserted on ECC error detection or busy-to-ready transition; enables asynchronous host notification without polling |
| RSTO# | Reset Output | User-configurable active-low reset pulse for system-level power-on initialization coordination |
Key Features
| Feature | Design Value |
|---|---|
| DDR Center-Aligned Read Strobe (DCARS) | Eliminates setup/hold timing margin uncertainty by aligning read data to RWDS edges instead of CK edges |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction-enables optimal cache-line matching for ARM Cortex-A/R cores |
| 512-Byte Program Buffer | Reduces write latency by buffering up to 512 bytes before internal programming, improving firmware update efficiency |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 256-KB sector prevent accidental overwrite of bootloader or calibration data |
| AEC-Q100 Grade 2 Qualification | Validated for –40°C to +105°C operation with full temperature cycling, ESD, and HTOL testing per automotive reliability standards |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot firmware and safety-critical sensor fusion algorithms in radar/EPS ECUs requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Primary non-volatile code storage with deterministic 96 ns random access and ECC-protected execution-in-place (XIP) capability. Use Value: Enables secure, high-speed XIP boot within 50 ms cold-start window while meeting ISO 26262 ASIL-B requirements via built-in ECC and sector protection. | Use Scenario: Holding field-upgradable ladder logic and motion control firmware in modular PLC backplanes operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: High-reliability firmware repository supporting 100,000+ field updates over 15-year product lifecycle. Use Value: Delivers 20-year data retention and 256-KB sector erase granularity to minimize update time and maximize uptime in factory automation environments. |
| Medical Imaging System Boot Memory | 5G Baseband Radio Unit Firmware |
Use Scenario: Hosting FPGA configuration bitstreams and diagnostic firmware in portable ultrasound devices with strict thermal and power constraints. IC Role / Device Role / Timing Role: Low-power boot memory with deep power-down (4 µA) and fast wake-up (<300 µs) for battery-backed operation. Use Value: Reduces standby power by 95% vs legacy parallel NOR, extending battery life without compromising boot speed or data integrity. | Use Scenario: Storing baseband processor microcode and RF calibration tables in outdoor macro-cell radio units exposed to extended temperature ranges. IC Role / Device Role / Timing Role: High-throughput firmware store supporting 333 MBps read for rapid DSP initialization during cell tower handover events. Use Value: Achieves sub-100 ms firmware load time via linear burst prefetch, reducing service interruption during network reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS256SDPBHB020 | Same die, identical electrical specs, but standard Industrial (–40°C to +85°C) grade - no AEC-Q100 qualification | Lacks automotive qualification; unsuitable for ADAS or powertrain modules requiring Grade 2 validation | Select only for cost-sensitive industrial applications where extended temperature range is not required |
| Winbond W25Q256JWSIQ | Quad SPI interface (not HYPERBUS™), 133 MHz max clock, no RWDS or differential clock; 30 ms typical sector erase | Lower bandwidth (up to ~40 MBps), higher latency, no ECC hardware; requires host-side error management | Consider only when board layout lacks space for 24-ball FBGA or system controller lacks HYPERBUS™ master IP |
Compared with S26KS256SDPBHB020 and W25Q256JWSIQ, the S26KS256SDPBHB023 uniquely combines automotive-grade reliability, DDR-based 333 MBps throughput, and integrated ECC - making it the only option for safety-critical, high-bandwidth boot memory in AEC-Q100-compliant systems.
Availability
S26KS256SDPBHB023 is available at Aetrix Electronics and suitable for automotive ADAS controllers, industrial PLCs, medical imaging boot systems, and 5G radio unit firmware storage requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S26KS256SDPBHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This part belongs to the HYPERFLASH™ family - designed specifically for high-speed, low-pin-count firmware storage in automotive and industrial systems demanding deterministic boot timing, ECC protection, and AEC-Q100 compliance.
FAQ
What is the minimum supported clock frequency for S26KS256SDPBHB023?
The device supports variable clock rates down to DC (0 Hz) in standby and deep power-down modes. For active read/write operations, the minimum functional clock frequency is 1 MHz, verified per Infineon's AC characteristics table in datasheet Rev. *Q. This allows flexible timing adaptation in low-power subsystems without violating tACC or tCS specifications.
Does S26KS256SDPBHB023 require external termination resistors for CK/CK# or DQ signals?
Yes - the datasheet specifies 50 Ω series termination on CK/CK# near the memory device and 50 Ω parallel termination to VDDQ on DQ lines. These values are mandatory to meet signal integrity requirements for 166 MHz DDR operation and prevent reflections that would corrupt RWDS-aligned data sampling.
Can S26KS256SDPBHB023 be used in linear burst mode without RWDS connection?
No - RWDS is mandatory for all read operations, including linear burst. The device uses RWDS edges to indicate valid data windows; disconnecting RWDS causes undefined behavior and data corruption. The host must connect and sample RWDS synchronously regardless of burst type selected.
How is the 512-byte program buffer utilized during write operations?
The buffer accepts up to 512 bytes of write data in a single burst transaction. Once filled, the internal Embedded Algorithm Controller (EAC) initiates page programming automatically. This decouples host write pacing from internal flash timing, allowing continuous data streaming without waiting for 475 µs buffer programming completion.
S26KS256SDPBHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS256SDPBHB023 FAQ
1.How can I place an order for S26KS256SDPBHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS256SDPBHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS256SDPBHB023 reliable?
The price and inventory of S26KS256SDPBHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDPBHB023 is usually 5 days.
3.What payment methods are accepted for S26KS256SDPBHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDPBHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS256SDPBHB023?
S26KS256SDPBHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS256SDPBHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS256SDPBHB023?
For technical support, including S26KS256SDPBHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDPBHB023 requirements.
6.How does Aetrix verify that S26KS256SDPBHB023 is sourced from the original manufacturer or authorized distributors?
All S26KS256SDPBHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDPBHB023 meets industry standards.
7.What is the process for return or replacement of S26KS256SDPBHB023?
All S26KS256SDPBHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDPBHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS256SDPBHB023 part is unused and in its original packaging.
Return procedure for S26KS256SDPBHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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