Infineon Technologies S26KS256SDPBHI020
- Part No.:
- S26KS256SDPBHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS256SDPBHI020.pdf
- Description:
- IC FLASH 256MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,977
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S26KS256SDPBHI020 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive-qualified AEC-Q100 Grade 2.
For engineers reviewing the S26KS256SDPBHI020 datasheet, S26KS256SDPBHI020 pinout, S26KS256SDPBHI020 application, or S26KS256SDPBHI020 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), ECC 1-bit correction/2-bit detection, configurable burst length (16/32/64 bytes), deep power-down current (4 µA), and FBGA-24 package compatibility with high-density MCU boot memory layouts.
Technical Context
The device implements a DDR center-aligned read strobe (DCARS) architecture where command/address and data are transferred over the same 8-bit DQ bus using double-data-rate signaling referenced to CK/CK#. RWDS output is edge-aligned to CK transitions during reads, enabling precise data capture by the host controller.
Internally, it separates control into Host Interface Controller (HIC) for real-time signal management and Embedded Algorithm Controller (EAC) for autonomous execution of program/erase sequences. The MIRRORBIT™ memory array enables 16-bit word-wide addressing and page-based 32-byte random access with half-page alignment on 16-byte boundaries.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - supports full firmware images for mid-tier automotive MCUs and industrial SoCs. |
| Interface Standard | HYPERRBUS™ DDR - 8-bit bidirectional DQ bus with differential CK/CK#, reducing pin count vs parallel NOR. |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte = sustained linear burst performance. |
| Random Access Time | 96 ns - initial latency of 5–16 clock cycles enables fast code fetch from non-sequential addresses. |
| Erase Endurance | 100,000 cycles - validated for frequent OTA update partitions in automotive telematics modules. |
| Data Retention | 20 years - guaranteed at +105°C, critical for long-lifecycle engine control units. |
| Power Modes | Deep Power-Down: 4 µA - allows system-level energy budgeting without wake-up latency penalty. |
| Error Handling | ECC: 1-bit correction / 2-bit detection - hardware-level protection against single-event upsets in safety-critical systems. |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Defines DDR timing reference; CK rising/falling edges sample DQ and RWDS; CK# enables jitter rejection. |
| CS# | Chip select (active low) | Enables device communication; HIGH places device in standby or deep power-down mode. |
| RWDS | Read data strobe output | Output-only signal synchronized to read data edges; used by host to latch valid DQ values. |
| DQ[7:0] | Bi-directional data bus | Carries commands, addresses, and data in DDR fashion; 8-bit width reduces PCB routing complexity. |
| INT# | Interrupt output | Asserts on ECC error detection or busy-to-ready transition; enables asynchronous host response. |
| RSTO# | Reset output | Configurable LOW pulse for system-level power-on reset; driven after internal voltage stabilization. |
| PSC / PSC# | Power supply control | Optional signals for external power sequencing coordination in multi-rail automotive domains. |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces signal count to 12 pins (vs ≥30 for legacy parallel NOR), enabling compact PCB layout in space-constrained ECUs. |
| Configurable Burst Length | Supports 16/32/64-byte wrapped bursts or linear bursts - optimizes cache line fill efficiency for ARM Cortex-R5/R7 cores. |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 256-KB sector - prevents accidental overwrite of bootloader or calibration data in field-deployed units. |
| 512-Byte Program Buffer | Enables 1 MBps write speed (vs 4 KBps for single-word programming) - accelerates firmware patch deployment in production test. |
| AEC-Q100 Grade 2 Qualification | Validated for –40°C to +105°C operation with ISO/TS 16949 manufacturing controls - meets ASIL-B functional safety requirements. |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores sensor fusion algorithms and real-time OS kernel for 77-GHz radar processing units. IC Role / Device Role / Timing Role: Boot memory mapped at address 0x0000_0000; provides sub-100 ns instruction fetch latency to Cortex-R5F core. Use Value: 333 MBps linear burst sustains DMA streaming of LIDAR point cloud buffers without CPU intervention. | Use Scenario: Holds programmable logic configuration and motion control firmware in modular I/O chassis. IC Role / Device Role / Timing Role: Non-volatile storage for CODEC and safety monitor firmware; accessed via XMC4800's HYPERBUS™ master peripheral. Use Value: 256-KB uniform sectors enable atomic firmware updates without disrupting real-time cyclic tasks. |
| Medical Imaging System Boot ROM | 5G Small Cell Baseband Processor Memory |
Use Scenario: Stores boot loader and FPGA bitstream for ultrasound beamforming ASIC initialization. IC Role / Device Role / Timing Role: Primary boot device for TriCore TC397; executes XIP (eXecute-In-Place) with DCARS timing alignment. Use Value: ECC 1-bit correction ensures deterministic boot integrity under EMI-rich MRI room environments. | Use Scenario: Provides baseband firmware and protocol stack images for O-RAN compliant small cell radios. IC Role / Device Role / Timing Role: High-speed code storage for TI C66x DSP cluster; accessed via EMIF with HYPERBUS™ timing constraints. Use Value: Deep power-down current (4 µA) extends battery backup runtime during network maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4 Mb density, FRAM technology, no erase cycles, 108 MHz max clock, SPI interface | Limited to configuration storage or logging; lacks HYPERBUS™ bandwidth for XIP code execution | Select only when ultra-high endurance (>1012 cycles) and instant-write capability outweigh throughput needs. |
| S26KL256SDPBHI020 | Same 256 Mb density and FBGA-24 package but 3.0 V I/O, single-ended clock, 200 MBps max read | Compatible pinout and command set; lower speed suits cost-sensitive industrial HMIs without DDR timing constraints | Choose for legacy 3.0 V systems or where differential clock routing is impractical on 4-layer PCBs. |
Compared with CY15B104QN-PSOC, S26KS256SDPBHI020 delivers 166× higher read bandwidth and true XIP support, while S26KL256SDPBHI020 offers identical density and footprint with simplified clocking-making it ideal for migration paths from 3.0 V designs.
Availability
S26KS256SDPBHI020 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot ROM requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S26KS256SDPBHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for safety-critical systems.
This device belongs to the HYPERFLASH™ family, designed specifically to replace parallel NOR flash in high-performance boot and code storage applications where DDR bandwidth, low pin count, and AEC-Q100 qualification are mandatory.
FAQ
What is the minimum supported clock frequency for S26KS256SDPBHI020?
The device supports variable clock rates down to DC (0 Hz) in standby and deep power-down modes. For active read/write operations, the minimum functional clock frequency is 1 MHz, verified per Infineon's AC characteristics table in datasheet Rev. *Q Section 12.2. This enables flexible timing margining during system bring-up and low-power debug scenarios.
Does S26KS256SDPBHI020 support XIP (eXecute-In-Place) operation?
Yes, S26KS256SDPBHI020 supports true XIP operation with DCARS timing alignment. Its HYPERBUS™ interface allows the host processor to directly fetch instructions from flash without copying to RAM, validated for use with Infineon's AURIX™ TC3xx and XMC4000 families per Application Note AP32277.
How is the 512-byte program buffer utilized during write operations?
The 512-byte buffer accepts sequential 16-bit writes over the HYPERBUS™ interface and internally programs them in a single 475 µs operation. This eliminates per-word programming overhead, achieving ~1 MBps effective write speed-critical for rapid firmware field updates in automotive gateways.
What is the function of the PSC/PSC# pins on S26KS256SDPBHI020?
PSC (Power Supply Control) and PSC# are optional inputs used to coordinate external power sequencing. When asserted, they delay internal initialization until VCC/VCCQ stabilize within specification, preventing metastability during cold-start in multi-rail automotive domains like body control modules.
S26KS256SDPBHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS256SDPBHI020 FAQ
1.How can I place an order for S26KS256SDPBHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS256SDPBHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS256SDPBHI020 reliable?
The price and inventory of S26KS256SDPBHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDPBHI020 is usually 5 days.
3.What payment methods are accepted for S26KS256SDPBHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDPBHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS256SDPBHI020?
S26KS256SDPBHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS256SDPBHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS256SDPBHI020?
For technical support, including S26KS256SDPBHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDPBHI020 requirements.
6.How does Aetrix verify that S26KS256SDPBHI020 is sourced from the original manufacturer or authorized distributors?
All S26KS256SDPBHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDPBHI020 meets industry standards.
7.What is the process for return or replacement of S26KS256SDPBHI020?
All S26KS256SDPBHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDPBHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS256SDPBHI020 part is unused and in its original packaging.
Return procedure for S26KS256SDPBHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S26KS256SDPBHI020 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

