Infineon Technologies S26KS512SDABHB030
- Part No.:
- S26KS512SDABHB030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS512SDABHB030.pdf
- Description:
- IC FLASH 512MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,029
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Product details
Overview
S26KS512SDABHB030 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.
For engineers reviewing the S26KS512SDABHB030 datasheet, S26KS512SDABHB030 pinout, S26KS512SDABHB030 application, or S26KS512SDABHB030 equivalent, this device serves as a high-bandwidth, low-latency non-volatile code storage solution for boot execution and firmware updates in real-time embedded systems requiring deterministic access and AEC-Q100-compliant reliability.
Technical Context
The S26KS512SDABHB030 implements a synchronous DDR interface over an 8-bit data bus using differential clocking (CK/CK#) and RWDS for precise read-data capture. Its MIRRORBIT™ architecture enables 16-bit word-aligned accesses with center-aligned command/address and edge-aligned read data relative to RWDS transitions.
It integrates dual control logic blocks: Host Interface Controller (HIC) handles real-time signal timing and data transfer coordination, while Embedded Algorithm Controller (EAC) executes autonomous program/erase sequences-including sector erase, buffer programming, and protection configuration-without host intervention during execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full firmware images and multi-application partitioning in resource-constrained boot ROMs. |
| Interface Protocol | HYPERTBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read throughput via dual-edge sampling on DQ[7:0]. |
| Operating Voltage | 1.8 V I/O (VCCQ), 3.0 V core (VCC) - enables low-power operation with backward compatibility to legacy 3.0 V system rails. |
| Random Read Latency | 96 ns initial access time (5–16 clock cycles) - ensures fast instruction fetch for real-time OS boot and interrupt vector loading. |
| Erase Endurance | 100,000 program/erase cycles - validated for field-updatable firmware in automotive ECUs and industrial controllers. |
| Data Retention | 20 years at +85°C - guarantees long-term integrity of calibration data and safety-critical configuration parameters. |
| Package | 24-ball FBGA (5 × 5 mm, 0.8 mm pitch, VAA024) - provides compact footprint and thermal performance suitable for dense PCB layouts. |
Pinout & Package
Package: 24-ball Fortified Ball Grid Array (FBGA), 5 mm × 5 mm × 1.0 mm height, 0.8 mm ball pitch, VAA024 footprint per Infineon datasheet Rev. *Q, page 108.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides precise edge-aligned timing reference for DDR data capture; eliminates single-ended clock skew limitations in high-speed reads. |
| CS# | Chip select (active-low) | Enables device communication; must be asserted before command initiation and held active throughout burst transactions. |
| RWDS | Read data strobe output | Indicates valid read data windows; edges aligned to DQ transitions, enabling reliable latch timing without external delay tuning. |
| DQ[7:0] | Bi-directional data bus | Carries command, address, and 8-bit data in DDR mode; transfers two 8-bit values per clock cycle (16 bits total per cycle). |
| INT# | Interrupt output | Signals host on Busy→Ready transition or ECC error detection; supports asynchronous firmware update completion notification. |
| RSTO# | Reset output | Generates system-level power-on reset pulse; duration configurable via non-volatile register for compatibility with diverse PMIC timing requirements. |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR interface | Reduces signal count to 12 pins (vs ≥40 for parallel NOR), enabling routing simplicity and EMI reduction in high-density MCU designs. |
| 512-byte program buffer | Accelerates write throughput to ~1 MBps (vs 4 KBps for single-word programming), minimizing firmware update time in OTA applications. |
| Volatile/non-volatile sector protection | Allows runtime lock/unlock of 256-KB sectors and independent protection of 4-KB parameter sectors-critical for secure bootloader partitions. |
| Deep Power-Down mode | Draws only 4 µA (typical) at 85°C with 300 µs wake-up-enables ultra-low standby power in battery-backed industrial gateways. |
| ECC & CRC support | Corrects 1-bit errors and detects 2-bit errors per 512-byte sector; CRC validates command integrity to prevent misprogrammed firmware loads. |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing boot code and sensor fusion algorithms for radar/vision processing units requiring sub-100 ns read latency and AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary non-volatile code execution memory interfaced directly to ARM Cortex-R5F MCU via HYPERBUS™ master controller. Use Value: 333 MBps read bandwidth enables zero-wait-state execution of real-time control loops; ECC ensures functional safety compliance per ISO 26262 ASIL-B. |
Use Scenario: Holding field-upgradable ladder logic and I/O configuration in modular programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Firmware repository accessed by dual-core Cortex-A9 application processor during cold start and over-the-air update cycles. Use Value: 100,000 erase cycles and 20-year retention guarantee operational longevity across 15+ year equipment lifecycles; deep power-down extends battery backup duration. |
| Medical Imaging Boot ROM | 5G Small Cell Baseband Processor |
|
Use Scenario: Hosting certified boot firmware and DICOM protocol stacks in portable ultrasound devices requiring FDA-cleared data integrity and rapid cold boot. IC Role / Device Role / Timing Role: Secure boot source verified by hardware root-of-trust engine prior to loading FPGA configuration and DSP firmware. Use Value: RSTO# output synchronizes power-on reset timing with imaging SoC startup sequence; INT# signals successful firmware validation to enable imaging pipeline. |
Use Scenario: Providing low-latency, high-reliability code storage for L1/L2 baseband processors in outdoor small cell radios operating at extended temperature ranges. IC Role / Device Role / Timing Role: High-speed instruction memory mapped into ARM Cortex-A53 cache-coherent bus via AXI-HYPERBUS™ bridge IP. Use Value: Linear burst mode sustains 333 MBps reads during FFT-intensive signal processing; 24-ball FBGA simplifies RF board layout by minimizing layer count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KL512SDABHB020 | Same 512 Mb density and HYPERBUS™ interface but rated for Industrial Plus (–40°C to +105°C); no AEC-Q100 certification. | Lacks automotive qualification; suitable for industrial edge gateways but not ADAS or powertrain modules. | Select when extended temperature operation is required without automotive compliance overhead. |
| Winbond W25Q512JW | 512 Mb Quad SPI flash with XIP support; 133 MHz max clock, no DDR interface, no RWDS or differential clock. | Lower pin count (8-pin SOIC/WSON), but lacks HYPERBUS™ throughput and deterministic latency for real-time boot. | Choose for cost-sensitive consumer IoT where 133 MBps read speed suffices and DDR timing constraints are absent. |
Compared with S26KL512SDABHB020, the S26KS512SDABHB030 adds AEC-Q100 Grade 2 qualification and tighter initial access timing; versus W25Q512JW, it trades SPI simplicity for 2.5× higher sustained read bandwidth and hardware ECC-critical for safety-critical boot paths.
Availability
S26KS512SDABHB030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, medical imaging boot ROMs, and 5G small cell baseband processors requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant traceability.
Supply support for S26KS512SDABHB030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
The HYPERFLASH™ product line targets high-performance embedded systems needing deterministic, high-bandwidth non-volatile memory-designed specifically to replace parallel NOR in automotive, industrial, and communications infrastructure where pin count, power, and speed are critical.
FAQ
What is the minimum supported clock frequency for S26KS512SDABHB030?
The device supports variable clock rates down to DC (0 Hz) in standby and deep power-down modes. For active read/write operations, the minimum functional clock is 1 MHz per Infineon datasheet Section 12.2, enabling flexible timing adaptation in low-power wake-up scenarios without violating setup/hold margins.
Does S26KS512SDABHB030 support execute-in-place (XIP) operation?
Yes, the device supports true XIP via HYPERBUS™ DDR interface: the host processor can directly fetch instructions from flash without copying to RAM, enabled by deterministic 96 ns random access and linear burst streaming at 333 MBps-verified in Infineon application note AN227124.
How is the RSTO# pulse duration configured?
RSTO# LOW period is set via non-volatile configuration register bits [7:4] in the Device ID and CFI ASO map (address offset 0x0000_0020). Valid durations range from 1 ms to 128 ms in powers of two; default is 16 ms, and changes persist across power cycles without host reprogramming.
Can S26KS512SDABHB030 operate with only single-ended clock (CK) instead of differential (CK/CK#)?
No-differential clocking is mandatory for 1.8 V operation per datasheet Section 2.1 and Table 1. The device requires both CK and CK# inputs referenced to VSSQ; single-ended use violates AC timing specifications and causes undefined behavior during DDR data capture.
S26KS512SDABHB030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS512SDABHB030 FAQ
1.How can I place an order for S26KS512SDABHB030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS512SDABHB030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS512SDABHB030 reliable?
The price and inventory of S26KS512SDABHB030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDABHB030 is usually 5 days.
3.What payment methods are accepted for S26KS512SDABHB030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDABHB030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS512SDABHB030?
S26KS512SDABHB030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS512SDABHB030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS512SDABHB030?
For technical support, including S26KS512SDABHB030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDABHB030 requirements.
6.How does Aetrix verify that S26KS512SDABHB030 is sourced from the original manufacturer or authorized distributors?
All S26KS512SDABHB030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDABHB030 meets industry standards.
7.What is the process for return or replacement of S26KS512SDABHB030?
All S26KS512SDABHB030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDABHB030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS512SDABHB030 part is unused and in its original packaging.
Return procedure for S26KS512SDABHB030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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