Nexperia USA Inc. S26KS512SDABHN030
- Part No.:
- S26KS512SDABHN030
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S26KS512SDABHN030.pdf
- Description:
- S26KS512S - Parallel NOR HyperFl
- Quantity:
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Product details
Overview
S26KS512SDABHN030 from Infineon Technologies is a 512 Mb (64 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, 100,000 program/erase cycles, and operates from –40°C to +105°C (Industrial Plus grade). Used in automotive ADAS domain controllers for fast boot code execution.
For engineers reviewing the S26KS512SDABHN030 datasheet, S26KS512SDABHN030 pinout, S26KS512SDABHN030 application, or S26KS512SDABHN030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns tACC), RWDS-synchronized DDR read alignment, ECC 1-bit correction/2-bit detection, and FBGA-24 package compatibility with high-density PCB layouts.
Technical Context
This device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes autonomous program/erase sequences without host intervention. It uses MIRRORBIT™ floating-gate technology for non-volatile storage and supports both wrapped (16/32/64-byte) and linear burst modes.
The HYPERBUS™ protocol transfers command, address, and data over the same 8-bit DQ bus in DDR fashion-two 16-bit words per clock cycle-with CK/CK# differential clocking enabling precise edge-aligned sampling. RWDS output is edge-aligned to CK transitions during reads, ensuring deterministic timing for high-speed host synchronization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full firmware images for complex automotive ECUs without external compression or paging. |
| Interface Standard | HYPERTBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe, reducing pin count vs. parallel NOR. |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte, enabling sub-200 ms boot time for 64 MB firmware. |
| Initial Access Latency | 96 ns tACC - defines minimum time from CS# assertion to first valid data on DQ, critical for deterministic boot timing. |
| Erase Granularity | 256 KB uniform sectors + optional 4 KB parameter sectors - enables independent firmware partitioning and secure OTA update staging. |
| Data Integrity | ECC 1-bit correction / 2-bit detection + CRC - detects and corrects single-bit errors in read path, preventing silent corruption in safety-critical code fetch. |
| Operating Temp Range | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive applications without derating. |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets AEC-Q100 Grade 2 requirements for long-life vehicle platforms. |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR sampling of DQ and RWDS; enables jitter-tolerant 166 MHz operation with matched trace routing. |
| CS# | Chip select (active low) | Enables device communication; must be asserted ≥118 ns before first data word at 166 MHz for valid access. |
| RWDS | Read data strobe output | Edge-aligned to CK transitions during reads; used by host to latch DQ data-no internal delay compensation needed. |
| DQ[7:0] | Bi-directional data bus | Carries commands, addresses, and data in DDR mode; 8-bit width reduces PCB layer count vs. x16 parallel NOR. |
| INT# | Interrupt output | Asserted on ECC error detection or busy-to-ready transition-enables host firmware to handle errors without polling. |
| RSTO# | Reset output | User-configurable active-low reset pulse for system power-on initialization; eliminates need for external reset IC. |
| VCC / VCCQ | Core & I/O supply | 1.8 V ±0.15 V for both core and I/O-single supply simplifies power design; supports low-power deep power-down (8 µA). |
Key Features
| Feature | Design Value |
|---|---|
| DDR center-aligned read strobe (DCARS) | Eliminates setup/hold timing margin uncertainty at 166 MHz by aligning DQ sampling to RWDS edges-not CK edges. |
| 512-byte program buffer | Enables 1 MBps write throughput (vs. 4 KBps for single-word programming), accelerating firmware updates and log writes. |
| Volatile/non-volatile sector protection | Allows runtime lock/unlock of 256 KB sectors via command register or hardware fuse-prevents accidental overwrite of boot loader. |
| Active clock stop during read | Reduces active read current to 12 mA with zero wake-up latency-ideal for intermittent firmware fetch in low-power ECU sleep modes. |
| One-time programmable (OTP) array | 1024-byte dedicated OTP space stores cryptographic keys or calibration data that cannot be erased or reprogrammed. |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot firmware and real-time perception algorithms for radar/vision fusion ECUs requiring <200 ms cold boot. IC Role / Device Role / Timing Role: Primary non-volatile code storage with HYPERBUS™-direct CPU interface; provides deterministic 96 ns tACC and RWDS-synchronized DDR reads. Use Value: Enables direct XIP (execute-in-place) execution without external cache, reducing BOM cost and boot latency versus eMMC or QSPI NAND. | Use Scenario: Holds field-upgradable control logic and safety-certified firmware for modular PLC backplanes operating in harsh factory environments. IC Role / Device Role / Timing Role: High-reliability firmware repository with ECC and 100K-cycle endurance; supports hot-swappable module replacement without firmware reload. Use Value: Eliminates need for external error-checking logic; 20-year retention ensures firmware integrity across 15+ year PLC service life. |
| Medical Imaging System Boot Memory | Avionics Display Unit Code Storage |
Use Scenario: Stores certified boot loader and DICOM image processing firmware in portable ultrasound devices requiring rapid power-on readiness. IC Role / Device Role / Timing Role: Secure, low-latency boot source with OTP key storage and AEC-Q100 Grade 2 qualification for medical-grade thermal cycling. Use Value: Meets IEC 62304 Class C software safety requirements via built-in ECC, CRC, and sector-level write protection. | Use Scenario: Holds DO-254-compliant display rendering firmware and font assets for cockpit multifunction displays with strict EMI constraints. IC Role / Device Role / Timing Role: Low-pin-count, high-throughput memory interfaced directly to FPGA-based graphics controller via HYPERBUS™ PHY. Use Value: Reduces board area by 40% vs. x16 parallel NOR; differential CK/CK# minimizes radiated emissions in safety-critical avionics zones. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KL512SDABHN020 | Same 512 Mb density and FBGA-24 package, but rated for Industrial (–40°C to +85°C) only; no INT# or RSTO# outputs. | Lacks interrupt and reset outputs-requires external GPIO monitoring and reset generation in host system. | Select when temperature range ≤85°C and host has spare GPIOs for status monitoring. |
| Macronix MX25L51245GZC | Quad SPI interface (not HYPERBUS™), 133 MHz max clock, 40 MBps read speed, SOIC-8 package. | Lower bandwidth and pin count; incompatible protocol-requires host driver rewrite and PCB redesign. | Select only for cost-sensitive, non-automotive designs where 333 MBps throughput is unnecessary. |
Compared with S26KL512SDABHN020, this part adds INT#/RSTO# and extends temp range to +105°C-critical for under-hood ADAS. Versus MX25L51245GZC, it delivers 8.3× higher read bandwidth and native DDR timing control, eliminating host-side data alignment logic.
Availability
S26KS512SDABHN030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot applications requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for S26KS512SDABHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
This device belongs to Infineon's HYPERFLASH™ family-designed specifically for high-speed, low-pin-count code storage in automotive and industrial systems where deterministic boot timing and functional safety compliance are mandatory.
FAQ
What is the purpose of the RWDS signal in S26KS512SDABHN030?
RWDS (Read Data Strobe) is an output signal synchronized to the rising and falling edges of CK during read operations. It indicates when valid data is present on DQ[7:0], allowing the host to latch data without relying on fixed clock-phase relationships. This eliminates timing skew between clock and data paths, enabling reliable 166 MHz DDR operation on dense PCBs.
Does S26KS512SDABHN030 support execute-in-place (XIP) operation?
Yes-S26KS512SDABHN030 supports true XIP via its HYPERBUS™ interface. The DDR protocol allows the host processor to fetch instructions directly from flash without buffering, provided the memory controller implements RWDS-synchronized read capture. This is confirmed in Section 4.3 of the datasheet (HYPERFLASH™ Read with DCARS timing).
How does the 512-byte program buffer improve write performance?
The 512-byte buffer enables burst programming: instead of writing one 16-bit word at a time (500 µs/word), the device accepts 32 consecutive 16-bit words in one command and programs them internally in 475 µs-achieving ~1 MBps throughput. This reduces firmware update time by 250× compared to single-word writes, critical for OTA deployments.
What is the function of the RSTO# output pin?
RSTO# is a user-configurable open-drain reset output that asserts a LOW pulse during power-on reset. Its duration is programmable via internal registers (Section 6.3), allowing system designers to meet specific SoC or FPGA reset timing requirements without external RC networks or dedicated reset ICs-reducing component count and board space.
S26KS512SDABHN030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
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- Clock Frequency:
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- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
S26KS512SDABHN030 FAQ
1.How can I place an order for S26KS512SDABHN030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS512SDABHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that S26KS512SDABHN030 is sourced from the original manufacturer or authorized distributors?
All S26KS512SDABHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDABHN030 meets industry standards.
7.What is the process for return or replacement of S26KS512SDABHN030?
All S26KS512SDABHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDABHN030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS512SDABHN030 part is unused and in its original packaging.
Return procedure for S26KS512SDABHN030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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