Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Nexperia USA Inc. S26KS512SDABHN030

Part No.:
S26KS512SDABHN030
Manufacturer:
Nexperia USA Inc.
Category:
Memory
Package:
-
Datasheet:
AetrixS26KS512SDABHN030.pdf
Description:
S26KS512S - Parallel NOR HyperFl
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,418

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S26KS512SDABHN030 from Infineon Technologies is a 512 Mb (64 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, 100,000 program/erase cycles, and operates from –40°C to +105°C (Industrial Plus grade). Used in automotive ADAS domain controllers for fast boot code execution.

For engineers reviewing the S26KS512SDABHN030 datasheet, S26KS512SDABHN030 pinout, S26KS512SDABHN030 application, or S26KS512SDABHN030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns tACC), RWDS-synchronized DDR read alignment, ECC 1-bit correction/2-bit detection, and FBGA-24 package compatibility with high-density PCB layouts.

Technical Context

This device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes autonomous program/erase sequences without host intervention. It uses MIRRORBIT™ floating-gate technology for non-volatile storage and supports both wrapped (16/32/64-byte) and linear burst modes.

The HYPERBUS™ protocol transfers command, address, and data over the same 8-bit DQ bus in DDR fashion-two 16-bit words per clock cycle-with CK/CK# differential clocking enabling precise edge-aligned sampling. RWDS output is edge-aligned to CK transitions during reads, ensuring deterministic timing for high-speed host synchronization.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - supports full firmware images for complex automotive ECUs without external compression or paging.
Interface StandardHYPERTBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe, reducing pin count vs. parallel NOR.
Max Read Throughput333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte, enabling sub-200 ms boot time for 64 MB firmware.
Initial Access Latency96 ns tACC - defines minimum time from CS# assertion to first valid data on DQ, critical for deterministic boot timing.
Erase Granularity256 KB uniform sectors + optional 4 KB parameter sectors - enables independent firmware partitioning and secure OTA update staging.
Data IntegrityECC 1-bit correction / 2-bit detection + CRC - detects and corrects single-bit errors in read path, preventing silent corruption in safety-critical code fetch.
Operating Temp Range–40°C to +105°C (Industrial Plus) - qualified for under-hood automotive applications without derating.
Endurance & Retention100,000 program/erase cycles / 20-year data retention - meets AEC-Q100 Grade 2 requirements for long-life vehicle platforms.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for DDR sampling of DQ and RWDS; enables jitter-tolerant 166 MHz operation with matched trace routing.
CS#Chip select (active low)Enables device communication; must be asserted ≥118 ns before first data word at 166 MHz for valid access.
RWDSRead data strobe outputEdge-aligned to CK transitions during reads; used by host to latch DQ data-no internal delay compensation needed.
DQ[7:0]Bi-directional data busCarries commands, addresses, and data in DDR mode; 8-bit width reduces PCB layer count vs. x16 parallel NOR.
INT#Interrupt outputAsserted on ECC error detection or busy-to-ready transition-enables host firmware to handle errors without polling.
RSTO#Reset outputUser-configurable active-low reset pulse for system power-on initialization; eliminates need for external reset IC.
VCC / VCCQCore & I/O supply1.8 V ±0.15 V for both core and I/O-single supply simplifies power design; supports low-power deep power-down (8 µA).

Key Features

FeatureDesign Value
DDR center-aligned read strobe (DCARS)Eliminates setup/hold timing margin uncertainty at 166 MHz by aligning DQ sampling to RWDS edges-not CK edges.
512-byte program bufferEnables 1 MBps write throughput (vs. 4 KBps for single-word programming), accelerating firmware updates and log writes.
Volatile/non-volatile sector protectionAllows runtime lock/unlock of 256 KB sectors via command register or hardware fuse-prevents accidental overwrite of boot loader.
Active clock stop during readReduces active read current to 12 mA with zero wake-up latency-ideal for intermittent firmware fetch in low-power ECU sleep modes.
One-time programmable (OTP) array1024-byte dedicated OTP space stores cryptographic keys or calibration data that cannot be erased or reprogrammed.

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Stores boot firmware and real-time perception algorithms for radar/vision fusion ECUs requiring <200 ms cold boot.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with HYPERBUS™-direct CPU interface; provides deterministic 96 ns tACC and RWDS-synchronized DDR reads.

Use Value: Enables direct XIP (execute-in-place) execution without external cache, reducing BOM cost and boot latency versus eMMC or QSPI NAND.

Use Scenario: Holds field-upgradable control logic and safety-certified firmware for modular PLC backplanes operating in harsh factory environments.

IC Role / Device Role / Timing Role: High-reliability firmware repository with ECC and 100K-cycle endurance; supports hot-swappable module replacement without firmware reload.

Use Value: Eliminates need for external error-checking logic; 20-year retention ensures firmware integrity across 15+ year PLC service life.

Medical Imaging System Boot MemoryAvionics Display Unit Code Storage

Use Scenario: Stores certified boot loader and DICOM image processing firmware in portable ultrasound devices requiring rapid power-on readiness.

IC Role / Device Role / Timing Role: Secure, low-latency boot source with OTP key storage and AEC-Q100 Grade 2 qualification for medical-grade thermal cycling.

Use Value: Meets IEC 62304 Class C software safety requirements via built-in ECC, CRC, and sector-level write protection.

Use Scenario: Holds DO-254-compliant display rendering firmware and font assets for cockpit multifunction displays with strict EMI constraints.

IC Role / Device Role / Timing Role: Low-pin-count, high-throughput memory interfaced directly to FPGA-based graphics controller via HYPERBUS™ PHY.

Use Value: Reduces board area by 40% vs. x16 parallel NOR; differential CK/CK# minimizes radiated emissions in safety-critical avionics zones.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KL512SDABHN020Same 512 Mb density and FBGA-24 package, but rated for Industrial (–40°C to +85°C) only; no INT# or RSTO# outputs.Lacks interrupt and reset outputs-requires external GPIO monitoring and reset generation in host system.Select when temperature range ≤85°C and host has spare GPIOs for status monitoring.
Macronix MX25L51245GZCQuad SPI interface (not HYPERBUS™), 133 MHz max clock, 40 MBps read speed, SOIC-8 package.Lower bandwidth and pin count; incompatible protocol-requires host driver rewrite and PCB redesign.Select only for cost-sensitive, non-automotive designs where 333 MBps throughput is unnecessary.

Compared with S26KL512SDABHN020, this part adds INT#/RSTO# and extends temp range to +105°C-critical for under-hood ADAS. Versus MX25L51245GZC, it delivers 8.3× higher read bandwidth and native DDR timing control, eliminating host-side data alignment logic.

Availability

S26KS512SDABHN030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot applications requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.

Supply support for S26KS512SDABHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This device belongs to Infineon's HYPERFLASH™ family-designed specifically for high-speed, low-pin-count code storage in automotive and industrial systems where deterministic boot timing and functional safety compliance are mandatory.

FAQ

What is the purpose of the RWDS signal in S26KS512SDABHN030?

RWDS (Read Data Strobe) is an output signal synchronized to the rising and falling edges of CK during read operations. It indicates when valid data is present on DQ[7:0], allowing the host to latch data without relying on fixed clock-phase relationships. This eliminates timing skew between clock and data paths, enabling reliable 166 MHz DDR operation on dense PCBs.

Does S26KS512SDABHN030 support execute-in-place (XIP) operation?

Yes-S26KS512SDABHN030 supports true XIP via its HYPERBUS™ interface. The DDR protocol allows the host processor to fetch instructions directly from flash without buffering, provided the memory controller implements RWDS-synchronized read capture. This is confirmed in Section 4.3 of the datasheet (HYPERFLASH™ Read with DCARS timing).

How does the 512-byte program buffer improve write performance?

The 512-byte buffer enables burst programming: instead of writing one 16-bit word at a time (500 µs/word), the device accepts 32 consecutive 16-bit words in one command and programs them internally in 475 µs-achieving ~1 MBps throughput. This reduces firmware update time by 250× compared to single-word writes, critical for OTA deployments.

What is the function of the RSTO# output pin?

RSTO# is a user-configurable open-drain reset output that asserts a LOW pulse during power-on reset. Its duration is programmable via internal registers (Section 6.3), allowing system designers to meet specific SoC or FPGA reset timing requirements without external RC networks or dedicated reset ICs-reducing component count and board space.

S26KS512SDABHN030 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

S26KS512SDABHN030 FAQ

1.How can I place an order for S26KS512SDABHN030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS512SDABHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS512SDABHN030 reliable?

The price and inventory of S26KS512SDABHN030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDABHN030 is usually 5 days.

3.What payment methods are accepted for S26KS512SDABHN030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDABHN030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS512SDABHN030?

S26KS512SDABHN030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS512SDABHN030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS512SDABHN030?

For technical support, including S26KS512SDABHN030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDABHN030 requirements.

6.How does Aetrix verify that S26KS512SDABHN030 is sourced from the original manufacturer or authorized distributors?

All S26KS512SDABHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDABHN030 meets industry standards.

7.What is the process for return or replacement of S26KS512SDABHN030?

All S26KS512SDABHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDABHN030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS512SDABHN030 part is unused and in its original packaging.

Return procedure for S26KS512SDABHN030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S26KS512SDABHN030 Tags

  • S26KS512SDABHN030
  • S26KS512SDABHN030 PDF
  • S26KS512SDABHN030 Datasheet
  • S26KS512SDABHN030 Specifications
  • S26KS512SDABHN030 Images
  • Nexperia USA Inc.
  • Nexperia USA Inc. S26KS512SDABHN030
  • Buy S26KS512SDABHN030
  • S26KS512SDABHN030 Price
  • S26KS512SDABHN030 Distributor
  • S26KS512SDABHN030 Supplier
  • S26KS512SDABHN030 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER