Nexperia USA Inc. S26KS512SDGBHA030
- Part No.:
- S26KS512SDGBHA030
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S26KS512SDGBHA030.pdf
- Description:
- S26KS512S - Parallel NOR HyperFl
- Quantity:
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Inventory:1,148
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Product details
Overview
S26KS512SDGBHA030 from Infineon Technologies is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used in high-performance embedded boot code storage for automotive ADAS ECUs.
For engineers reviewing the S26KS512SDGBHA030 datasheet, S26KS512SDGBHA030 pinout, S26KS512SDGBHA030 application, or S26KS512SDGBHA030 equivalent, key selection criteria include DDR HYPERBUS™ timing compliance, RWDS-synchronized read latency (96 ns initial access), sector protection configurability, deep power-down current (8 µA typ), and AEC-Q100 grade 3 qualification for automotive use.
Technical Context
This device implements a synchronous DDR interface using differential CK/CK# for precise timing capture and RWDS as a read-data-aligned strobe referenced to CK edges. Its internal MIRRORBIT™ architecture enables 16-bit word-wide accesses aligned to 16-byte boundaries, with dual half-page fetch logic enabling linear burst streaming at full 333 MBps.
The embedded algorithm controller (EAC) fully manages program/erase sequences-including 512-byte buffer programming (475 µs), 256-KB sector erase (930 ms), and volatile/non-volatile sector protection-without host intervention. ECC and CRC support ensure data integrity during reads and writes across 20-year retention and 100,000-cycle endurance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full OS image or multi-application firmware storage in space-constrained designs |
| Interface Protocol | HYPERTBUS™ DDR - reduces signal count vs parallel NOR while sustaining 333 MBps read throughput |
| Max Clock Rate | 166 MHz at 1.8 V - enables high-speed boot loading with minimal latency in real-time systems |
| Initial Read Access | 96 ns - defines minimum time from CS# assertion to first valid data on DQ bus |
| Power Modes | Deep Power-Down: 8 µA (typ) - allows ultra-low standby current without wake-up delay in always-on modules |
| ECC Support | 1-bit correction / 2-bit detection - corrects single-bit errors and flags double-bit errors in real time |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-life requirements for automotive and industrial control |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides precise edge-aligned timing reference for DDR data capture; eliminates single-ended clock skew |
| CS# | Chip select (active low) | Enables device communication; must be asserted before command/address transfer begins |
| RWDS | Read data strobe output | Indicates valid read data windows; synchronized to rising/falling edges of CK during read bursts |
| DQ[7:0] | Bi-directional data bus | Transfers 8-bit DDR data and command/address information; operates at 166 MHz with center-aligned writes |
| INT# | Interrupt output | Signals Busy-to-Ready transition or ECC error detection; used for asynchronous host notification |
| RSTO# | Reset output | Generates system-level power-on reset pulse; user-configurable LOW duration ensures reliable SoC initialization |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces pin count to 12 signals (vs 40+ for legacy parallel NOR) while maintaining 333 MBps read bandwidth |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction-enables optimal cache-line alignment for ARM Cortex-A/R cores |
| Advanced Sector Protection | Volatile (lock bits) and non-volatile (OTP fuses) methods per 256-KB sector-prevents accidental firmware overwrite in field-deployed units |
| 512-Byte Program Buffer | Enables 1 MBps effective write speed via buffered programming-reduces host CPU overhead during firmware updates |
| AEC-Q100 Grade 3 | Qualified for –40°C to +85°C operation with ISO/TS16949 manufacturing-meets automotive functional safety baseline requirements |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware for radar processing units requiring fast, deterministic startup. IC Role / Device Role / Timing Role: High-reliability NOR flash providing secure, ECC-protected boot code execution with <96 ns random access. Use Value: Enables sub-100 ms cold-boot time and AEC-Q100-compliant operation in vibration-prone vehicle environments. | Use Scenario: Holds firmware and configuration data for programmable logic controllers deployed in factory automation systems. IC Role / Device Role / Timing Role: Non-volatile storage with sector-level write protection and 20-year data retention under thermal cycling. Use Value: Eliminates need for battery-backed SRAM and prevents unauthorized firmware modification via hardware-based OTP lock bits. |
| Medical Imaging System Code Storage | Avionics Display Controller Memory |
Use Scenario: Hosts real-time image processing algorithms and calibration tables in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-power, high-throughput flash supporting rapid firmware updates over CAN FD without system interruption. Use Value: Achieves 333 MBps read speed for zero-latency image rendering and deep power-down mode (<8 µA) during idle periods. | Use Scenario: Stores display firmware and graphics assets for cockpit multifunction displays requiring DO-160 environmental compliance. IC Role / Device Role / Timing Role: Radiation-tolerant, AEC-Q100-grade memory with CRC and ECC for fault-detection-critical avionics subsystems. Use Value: Ensures bit-error-free operation during high-altitude electromagnetic interference events and supports certified software update workflows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KL512SDHBHA020 | Same 512 Mb density and HYPERBUS™ interface but rated for 3.0 V I/O only (no differential clock); max 100 MHz clock rate (200 MBps) | Limited to cost-sensitive industrial systems where 333 MBps read speed is not required | Select when lower power supply complexity (single 3.0 V rail) outweighs performance loss |
| Winbond W25Q512JW | Quad SPI interface (not HYPERBUS™), 512 Mb density, 133 MHz clock, no RWDS or differential clock; lacks ECC and AEC-Q100 certification | Suitable for consumer IoT gateways but not automotive or safety-critical industrial use | Choose only for non-safety applications needing simpler interface and lower BOM cost |
Compared with S26KS512SDGBHA030, the Cypress alternative trades DDR performance and differential timing for simpler 3.0 V I/O compatibility, while the Winbond part abandons HYPERBUS™ entirely for QSPI-making it unsuitable for systems requiring deterministic low-latency boot or automotive qualification.
Availability
S26KS512SDGBHA030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging systems, and avionics display controllers requiring stable component supply, AEC-Q100 compliance, and guaranteed 20-year data retention.
Supply support for S26KS512SDGBHA030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS16949.
This device belongs to Infineon's HYPERFLASH™ family-designed specifically for high-speed, low-pin-count boot memory in automotive and industrial systems demanding deterministic timing, ECC protection, and extended temperature operation.
FAQ
What is the difference between RWDS and standard read strobes like RDY or BUSY?
RWDS is a DDR-aligned read data strobe output that toggles synchronously with valid data on DQ[7:0] during read bursts, referenced to CK/CK# edges. Unlike RDY/BUSY signals-which indicate device readiness or ongoing operations-RWDS directly gates data sampling, enabling precise timing capture without additional setup/hold margins.
Does S26KS512SDGBHA030 support both 1.8 V and 3.0 V I/O simultaneously?
No. This variant is specified for 1.8 V I/O operation only, with differential CK/CK# and 12-signal HYPERBUS™ interface. The 3.0 V I/O variants (e.g., S26KS512SDGBHA020) use single-ended CK and 11-signal interface. Mixing voltage domains is not supported and may damage the device.
How is ECC implemented and what happens on uncorrectable errors?
ECC uses dedicated on-die logic to compute and verify Hamming codes on every 512-byte page. Single-bit errors are corrected transparently; double-bit errors trigger the INT# pin and set status bits in the device's error register. No automatic retry occurs-the host must handle the error condition via software interrupt service.
Can the RSTO# output be disabled or reconfigured for other functions?
RSTO# is a dedicated open-drain output with fixed functionality: it asserts LOW during power-on reset and releases after a user-configurable delay (set via configuration register). It cannot be disabled or reassigned to alternate functions-it is hardwired to provide system-level reset coordination independent of host processor state.
S26KS512SDGBHA030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
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- Memory Organization:
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- Memory Interface:
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- Clock Frequency:
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- Write Cycle Time - Word, Page:
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- Access Time:
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- Voltage - Supply:
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- Operating Temperature:
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- Grade:
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- Qualification:
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- Mounting Type:
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- Supplier Device Package:
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S26KS512SDGBHA030 FAQ
1.How can I place an order for S26KS512SDGBHA030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS512SDGBHA030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS512SDGBHA030 reliable?
The price and inventory of S26KS512SDGBHA030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDGBHA030 is usually 5 days.
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Once your S26KS512SDGBHA030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS512SDGBHA030?
For technical support, including S26KS512SDGBHA030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDGBHA030 requirements.
6.How does Aetrix verify that S26KS512SDGBHA030 is sourced from the original manufacturer or authorized distributors?
All S26KS512SDGBHA030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDGBHA030 meets industry standards.
7.What is the process for return or replacement of S26KS512SDGBHA030?
All S26KS512SDGBHA030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDGBHA030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS512SDGBHA030 part is unused and in its original packaging.
Return procedure for S26KS512SDGBHA030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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