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Spansion S26KS512SDGBHI030

Part No.:
S26KS512SDGBHI030
Manufacturer:
Spansion
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS512SDGBHI030.pdf
Description:
IC FLASH 512MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:255

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Product details

Overview

S26KS512SDGBHI030 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and AEC-Q100 Grade 2 qualification (–40°C to +105°C), deployed in automotive ADAS domain controllers for fast boot code execution.

For engineers reviewing the S26KS512SDGBHI030 datasheet, S26KS512SDGBHI030 pinout, S26KS512SDGBHI030 application, or S26KS512SDGBHI030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns tACC), RWDS-synchronized DDR read alignment, sector protection configurability, deep power-down current (8 µA), and FBGA-24 package compatibility with high-density PCB layouts.

Technical Context

This device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with read data edge-aligned to RWDS transitions and clock edges referenced to CK/CK#. The embedded algorithm controller (EAC) autonomously executes program/erase sequences without host intervention after command issuance.

It supports configurable burst modes-wrapped (16/32/64 bytes) or linear-with automatic page prefetch during linear bursts to sustain 333 MBps throughput. Initial random access latency is 5–16 clock cycles, and DCARS (DDR Center Aligned Read Strobe) ensures precise timing capture of read data under varying signal integrity conditions.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - supports full firmware images for automotive microcontrollers with minimal external storage footprint.
Interface ProtocolHYPERTBUS™ DDR - reduces pin count vs. parallel NOR while enabling 2× data transfer per clock cycle on 8-bit DQ bus.
Max Read Throughput333 MBps at 166 MHz - enables sub-200 ms boot time for complex ECUs requiring rapid code fetch from non-volatile memory.
Random Access Time96 ns tACC - guarantees deterministic latency for real-time interrupt vector fetch in safety-critical applications.
ECC Capability1-bit correction / 2-bit detection - mitigates single-event upsets in automotive environments without requiring host-side error handling logic.
Operating Temperature–40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood ECU deployment with no derating required.
Endurance & Retention100,000 program/erase cycles / 20-year data retention - meets ASAM MCD-2 MC requirements for field-updatable control software.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant, thermal pad optional.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides timing reference for DDR data capture; CK# enables jitter rejection and noise immunity in high-speed routing.
CS#Chip select (active low)Enables device communication; HIGH places device in standby (25 µA) or deep power-down (8 µA) mode.
RWDSRead data strobe outputIndicates valid read data windows; edge-aligned to data transitions, not clock edges - critical for setup/hold margining.
DQ[7:0]Bi-directional DDR data busCarries commands, addresses, and 8-bit data on both clock edges; requires matched trace lengths for skew control.
INT#Interrupt outputAsserts on ECC detection or busy-to-ready transition - enables asynchronous host notification without polling.
RSTO#Reset outputGenerates system-level power-on reset pulse; LOW duration user-configurable via internal register.

Key Features

FeatureDesign Value
HYPERBUS™ DDR InterfaceReduces signal count to 12 pins (vs. 40+ for legacy parallel NOR), enabling compact PCB routing and lower EMI in space-constrained modules.
Configurable Burst ModeSupports wrapped (fixed-length) or linear (sequential) bursts per transaction - optimizes bandwidth utilization for both code fetch and data logging workloads.
512-byte Program BufferEnables 1 MBps write speed via buffer programming - cuts firmware update time by >90% vs. single-word programming (4 KBps).
Volatile & Non-Volatile Sector ProtectionAllows runtime lock/unlock of 256-KB sectors and permanent protection of parameter sectors - essential for secure OTA update partitioning.
DCARS Timing ArchitectureCenters read data sampling on RWDS edges rather than CK edges - improves timing margin under voltage/temperature variation in automotive systems.

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Stores boot firmware and real-time perception algorithms for radar/vision fusion ECUs requiring <200 ms cold boot.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with HYPERBUS™-based XIP (execute-in-place) capability and deterministic 96 ns access.

Use Value: Enables deterministic boot timing and ECC-protected code execution without external error-handling overhead.

Use Scenario: Holds firmware and configuration data for modular PLCs operating in harsh factory environments with frequent power cycling.

IC Role / Device Role / Timing Role: High-reliability firmware repository with 100K-cycle endurance and 20-year retention under thermal stress.

Use Value: Eliminates field failures due to bit corruption during brown-out events via integrated ECC and deep power-down stability.

Medical Imaging System Boot MemoryAvionics Display Unit Code Storage

Use Scenario: Hosts boot loader and diagnostic firmware for MRI/CT scanner subsystems requiring ISO 13485-compliant data integrity.

IC Role / Device Role / Timing Role: Safety-certified code storage with AEC-Q100 Grade 2 qualification and CRC/ECC dual-layer data protection.

Use Value: Meets IEC 62304 SOUP requirements for Class C medical devices without additional external checksum logic.

Use Scenario: Stores display firmware and graphics assets for cockpit multifunction displays subject to DO-160 lightning-induced transient testing.

IC Role / Device Role / Timing Role: Radiation-tolerant NOR flash with latch-up immunity and 8 µA deep power-down for battery-backed operation.

Use Value: Ensures firmware persistence during 100 ms power interruptions and meets RTCA DO-254 design assurance level DAL-B.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KL512SDHBHI020Same 512 Mb density and HYPERBUS™ interface but rated for Industrial (–40°C to +85°C) only; lacks AEC-Q100 certification.Not suitable for automotive under-hood use; acceptable for industrial HMIs or telecom baseband cards.Select when AEC-Q100 qualification is unnecessary and cost sensitivity outweighs temperature range needs.
Winbond W25Q512JWBYIQQuad SPI interface (not HYPERBUS™), 512 Mb density, 133 MHz max clock, no differential clock or RWDS; no built-in ECC.Requires host-side ECC implementation; limited to non-safety-critical firmware storage with lower bandwidth demands.Choose for cost-sensitive consumer or IoT applications where 333 MBps throughput and automotive qualification are not required.

Compared with S26KS512SDGBHI030, the Cypress alternative trades automotive qualification for broader industrial availability, while the Winbond part replaces HYPERBUS™ complexity with simpler QSPI but sacrifices deterministic timing, ECC, and throughput - making it unsuitable for ADAS or avionics boot paths.

Availability

S26KS512SDGBHI030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot memory requiring stable component supply across extended lifecycle programs.

Supply support for S26KS512SDGBHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This device belongs to Infineon's HYPERFLASH™ family, designed specifically for high-bandwidth, low-pin-count firmware storage in automotive and industrial systems demanding AEC-Q100 compliance and deterministic DDR timing.

FAQ

What is the minimum supported VCCQ voltage for S26KS512SDGBHI030?

The device operates exclusively at 1.8 V for I/O (VCCQ); it does not support 3.0 V I/O mode. This is confirmed by the "DGB" suffix in the part number, which denotes 1.8 V I/O operation per Infineon's ordering matrix. Using 3.0 V on VCCQ violates absolute maximum ratings and may cause permanent damage.

Does S26KS512SDGBHI030 require external termination resistors for CK/CK#?

Yes - the datasheet specifies 100 Ω differential termination between CK and CK# near the device ball, and 49.9 Ω single-ended termination from each clock line to VDDQ. These values are mandatory to meet AC timing specifications and prevent signal integrity issues at 166 MHz DDR operation.

Can RWDS be used for write-data capture in this device?

No - RWDS is read-only and functions solely as a read data strobe. Write operations use CK/CK# edges for data capture on DQ[7:0]; RWDS remains inactive during writes. This unidirectional role is defined in Section 4.3 of the datasheet and enforced by internal logic.

How is the RSTO# pulse width configured?

RSTO# LOW duration is set via the Configuration Register (CR) bits [11:8], with programmable values from 1 ms to 128 ms in powers of two. Default is 16 ms. Configuration occurs during initialization via standard HYPERBUS™ command sequence (0x05 followed by 0x01), and persists across power cycles.

S26KS512SDGBHI030 Specifications

Product attributes
Attribute value
Manufacturer:
Spansion
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS512SDGBHI030 FAQ

1.How can I place an order for S26KS512SDGBHI030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS512SDGBHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS512SDGBHI030 reliable?

The price and inventory of S26KS512SDGBHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDGBHI030 is usually 5 days.

3.What payment methods are accepted for S26KS512SDGBHI030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDGBHI030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS512SDGBHI030?

S26KS512SDGBHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS512SDGBHI030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS512SDGBHI030?

For technical support, including S26KS512SDGBHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDGBHI030 requirements.

6.How does Aetrix verify that S26KS512SDGBHI030 is sourced from the original manufacturer or authorized distributors?

All S26KS512SDGBHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDGBHI030 meets industry standards.

7.What is the process for return or replacement of S26KS512SDGBHI030?

All S26KS512SDGBHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDGBHI030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS512SDGBHI030 part is unused and in its original packaging.

Return procedure for S26KS512SDGBHI030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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