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Nexperia USA Inc. S26KS512SDGBHN030

Part No.:
S26KS512SDGBHN030
Manufacturer:
Nexperia USA Inc.
Category:
Memory
Package:
-
Datasheet:
AetrixS26KS512SDGBHN030.pdf
Description:
S26KS512S - Parallel NOR HyperFl
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,008

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Product details

Overview

S26KS512SDGBHN030 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.

For engineers reviewing the S26KS512SDGBHN030 datasheet, S26KS512SDGBHN030 pinout, S26KS512SDGBHN030 application, or S26KS512SDGBHN030 equivalent, this device serves as a high-bandwidth, low-latency non-volatile code storage solution for boot memory in automotive ADAS controllers, industrial PLCs, and real-time embedded systems requiring deterministic read access and AEC-Q100 grade 3 compliance.

Technical Context

The device implements a DDR center-aligned read strobe (DCARS) architecture where command/address and data are transferred over the same 8-bit DQ bus using double-data-rate timing referenced to CK/CK#. Read operations use RWDS as an edge-aligned output strobe synchronized to data transitions, enabling precise capture at the host controller.

Internally, it separates control into Host Interface Controller (HIC) for signal-level protocol handling and Embedded Algorithm Controller (EAC) for autonomous execution of program/erase sequences. Sector protection includes volatile and non-volatile lock bits per 256-KB sector, plus optional 4-KB parameter sectors and a 1024-byte one-time-programmable array.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - sufficient for full firmware image + configuration storage in automotive ECUs
Interface StandardHYPERTBUS™ DDR - 8-bit bus with differential clock enables 333 MBps read without increasing pin count
Max Clock Rate166 MHz at 1.8 V - enables deterministic 96 ns random access latency with 5–16 cycle initial latency
ECC Support1-bit correction / 2-bit detection - ensures data integrity during long-term storage in safety-critical applications
Operating Temp–40°C to +85°C (Industrial) - validated for under-hood automotive and factory-floor industrial environments
Endurance100,000 program/erase cycles - supports field firmware updates over product lifetime
Data Retention20 years - meets automotive and industrial long-life deployment requirements
Package24-ball FBGA (VAA024, 5 × 5 mm, 0.8 mm pitch) - compact footprint for space-constrained PCB layouts

Pinout & Package

24-ball Fortified Ball Grid Array (FBGA) package, VAA024 footprint (5 mm × 5 mm, 0.8 mm ball pitch), compliant with JEDEC MO-270AB. Package supports automated optical inspection and high-reliability reflow profiles for automotive-grade assembly.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for DDR sampling; enables jitter-tolerant timing at 166 MHz
CS#Chip select (active-low)Enables device communication; HIGH places device in standby (25 µA)
RWDSRead data strobe outputEdge-aligned output indicating valid DQ data during read bursts
DQ[7:0]Bi-directional data busCarries commands, addresses, and 8-bit DDR data; shared bus reduces interconnect complexity
INT#Interrupt outputSignals Busy→Ready transition or ECC error detection to host processor
RSTO#Reset outputUser-configurable active-low reset pulse for system power-on initialization
PSC / PSC#Power supply control inputsEnable hardware-based data protection during brown-out or power loss

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count vs. parallel NOR while sustaining 333 MBps read - ideal for bandwidth-constrained SoC interfaces
Configurable burst modeSupports wrapped (16/32/64-byte) or linear bursts - optimizes cache line fill and DMA efficiency
Deep Power-Down mode8 µA typical current draw with 300 µs wake-up - extends battery life in always-on automotive modules
Advanced sector protectionVolatile/non-volatile lock bits per 256-KB sector - prevents accidental overwrite of boot code or calibration data
512-byte program bufferEnables 1 MBps write throughput via buffer programming - accelerates firmware update time by ~20× vs. single-word writes

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Storing boot firmware and real-time sensor fusion algorithms in radar/EPS ECUs requiring AEC-Q100 Grade 3 qualification.

IC Role / Device Role / Timing Role: Primary boot memory accessed via SoC's HYPERBUS™ master interface during cold start and OTA updates.

Use Value: 96 ns random access and 333 MBps sustained read ensure deterministic boot timing and low-latency code execution.

Use Scenario: Holding ladder logic runtime, configuration tables, and HMI assets in modular automation controllers deployed in harsh factory environments.

IC Role / Device Role / Timing Role: Non-volatile code and data store interfaced to ARM Cortex-M7 MCU with HYPERBUS™ peripheral.

Use Value: 256-KB uniform sectors and 100K-cycle endurance support frequent field updates without wear leveling overhead.

Medical Imaging System Boot Memory5G Baseband Unit Configuration Storage

Use Scenario: Hosting FPGA bitstreams and safety-critical boot loaders in portable ultrasound and MRI subsystems requiring 20-year data retention.

IC Role / Device Role / Timing Role: Secure, ECC-protected boot source for Xilinx Zynq MPSoC with hardware CRC validation on startup.

Use Value: ECC 1-bit correction and CRC ensure bit-error-free loading of critical imaging firmware across product lifecycle.

Use Scenario: Storing RF calibration coefficients, beamforming parameters, and protocol stack images in massive MIMO radio units operating at extended temperature.

IC Role / Device Role / Timing Role: High-speed configuration memory accessed by ASIC during power-up and dynamic reconfiguration events.

Use Value: Differential clock interface rejects EMI in dense RF environments; 125°C extended temp option supports outdoor macro cell deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S26KL512SDGBHN0303.0 V I/O, 100 MHz max clock, single-ended CK, identical density and FBGA packageLower power supply flexibility; suited for legacy 3.0 V designs without differential clock routingSelect when board uses 3.0 V I/O rails and lacks CK# trace capability
S26KS512SDGBHN020Same 1.8 V I/O and differential clock, but rated for –40°C to +105°C (Industrial Plus)Higher thermal margin for under-hood or enclosed industrial enclosuresSelect when ambient operating temperature exceeds +85°C

Compared with S26KL512SDGBHN030 and S26KS512SDGBHN020, the S26KS512SDGBHN030 offers optimal balance of 166 MHz performance, industrial temperature range, and AEC-Q100 Grade 3 qualification - making it the preferred choice for new ADAS and industrial control designs requiring both speed and automotive reliability.

Availability

S26KS512SDGBHN030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLCs, medical imaging boot systems, and 5G baseband units requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for S26KS512SDGBHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This part belongs to the HYPERFLASH™ family - designed specifically for high-speed, low-pin-count boot memory in automotive, industrial, and communications systems demanding deterministic read performance and long-term data integrity.

FAQ

What is the minimum wake-up time from Deep Power-Down mode?

The S26KS512SDGBHN030 requires 300 µs to exit Deep Power-Down mode and resume normal operation. During this period, CS# must remain HIGH and CK must be stable; no commands are accepted until the device signals readiness via INT# or internal status register polling.

Does this device support linear burst reads across page boundaries?

Yes - in linear burst mode, the device automatically fetches the next sequential 32-byte page from the MIRRORBIT™ array while bursting out the current page, enabling continuous 333 MBps throughput without host intervention or address incrementing.

How is ECC handled during read operations?

ECC is applied per 512-byte sector during read; detected 2-bit errors trigger the INT# pin and set the status register's ECC error flag. Correctable 1-bit errors are fixed transparently in hardware without CPU intervention or latency penalty.

Can RSTO# be disabled or configured for open-drain operation?

RSTO# is user-configurable via non-volatile mode register bits: it can be set to active-low push-pull with programmable pulse width (1–255 ms), or disabled entirely. Open-drain operation is not supported; external pull-up is required if interfacing to voltage domains differing from VCCQ.

S26KS512SDGBHN030 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

S26KS512SDGBHN030 FAQ

1.How can I place an order for S26KS512SDGBHN030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS512SDGBHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS512SDGBHN030 reliable?

The price and inventory of S26KS512SDGBHN030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDGBHN030 is usually 5 days.

3.What payment methods are accepted for S26KS512SDGBHN030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDGBHN030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS512SDGBHN030?

S26KS512SDGBHN030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS512SDGBHN030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS512SDGBHN030?

For technical support, including S26KS512SDGBHN030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDGBHN030 requirements.

6.How does Aetrix verify that S26KS512SDGBHN030 is sourced from the original manufacturer or authorized distributors?

All S26KS512SDGBHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDGBHN030 meets industry standards.

7.What is the process for return or replacement of S26KS512SDGBHN030?

All S26KS512SDGBHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDGBHN030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS512SDGBHN030 part is unused and in its original packaging.

Return procedure for S26KS512SDGBHN030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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