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Infineon Technologies S26KS512SDPBHA023

Part No.:
S26KS512SDPBHA023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS512SDPBHA023.pdf
Description:
IC FLASH 512MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,949

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Product details

Overview

S26KS512SDPBHA023 from Infineon Technologies is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used in high-performance embedded boot code storage for automotive ADAS ECUs.

For engineers reviewing the S26KS512SDPBHA023 datasheet, S26KS512SDPBHA023 pinout, S26KS512SDPBHA023 application, or S26KS512SDPBHA023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (8 µA), and AEC-Q100 grade 3 qualification for automotive use.

Technical Context

The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with dual-edge sampling referenced to CK/CK#. Its internal MIRRORBIT™ architecture enables page-aligned 32-byte random reads with 5–16 clock-cycle initial latency and configurable burst modes (wrapped: 16/32/64 bytes; linear; hybrid).

Two dedicated controllers manage operation: Host Interface Controller (HIC) handles real-time signal capture and data transfer coordination, while Embedded Algorithm Controller (EAC) executes non-volatile memory operations-including 512-byte buffer programming (475 µs), 256-KB sector erase (930 ms), and volatile/non-volatile sector protection-without host intervention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - supports full boot image + firmware partitioning for complex microcontrollers
Interface ProtocolHYPERTBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read bandwidth
Max Clock Rate166 MHz at 1.8 V - enables high-speed sequential execution from flash without external cache
Random Access Time96 ns - determines minimum instruction fetch latency in real-time deterministic systems
Program Buffer Size512 bytes - allows single-command multi-word writes, reducing host overhead by ~8× vs byte programming
ECC Capability1-bit correction / 2-bit detection - mitigates soft errors in safety-critical automotive applications
Operating Temp–40°C to +85°C (Industrial) - validated for under-hood ECU deployment without derating
Endurance/Retention100,000 cycles / 20 years - meets long-life requirements for infotainment and gateway modules

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides edge-aligned timing reference for DDR command/data capture; enables jitter-tolerant high-speed operation
CS#Chip select (active low)Enables device communication; must remain asserted throughout burst transactions to avoid termination
RWDSRead data strobe outputIndicates valid read data windows on DQ; synchronized to CK edges during read bursts
DQ[7:0]Bi-directional DDR data busCarries commands, addresses, and 8-bit data on both clock edges; requires matched trace length for signal integrity
INT#Interrupt outputAsserts on ECC error detection or busy-to-ready transition, enabling asynchronous host response
RSTO#Reset outputDrives system-level power-on reset; user-configurable LOW pulse duration ensures reliable SoC initialization
PSC / PSC#Power supply control inputsEnable hardware-based write protection during power transitions to prevent corruption

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 11–12 pins vs 48+ for legacy parallel NOR, simplifying PCB routing and lowering EMI
Configurable burst modeSupports wrapped (cache-friendly) or linear (streaming) bursts per transaction, optimizing for code fetch vs data logging
Active clock stop during readDraws only 12 mA with no wake-up delay-enables dynamic power gating in battery-backed subsystems
One-time programmable (OTP) array1024-byte dedicated region stores immutable keys or calibration data, isolated from main array wear
AEC-Q100 Grade 3 certifiedValidated for automotive use including thermal cycling, vibration, and ESD robustness per ISO/TS16949

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Storing boot code and safety monitor firmware for radar processing units requiring deterministic startup within 100 ms.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with HYPERBUS™-driven XIP (execute-in-place) capability and ECC-protected instruction fetch.

Use Value: 333 MBps read bandwidth eliminates need for external SRAM caching; 96 ns random access ensures sub-millisecond vector table fetch.

Use Scenario: Holding field-upgradable ladder logic and motion control algorithms in modular automation controllers deployed in factory environments.

IC Role / Device Role / Timing Role: High-reliability firmware repository with sector-level write protection and 100,000-cycle endurance for frequent OTA updates.

Use Value: Optional 4-KB parameter sectors allow independent update of calibration tables without erasing full application code.

Medical Imaging System Boot ROMAvionics Display Processor Memory

Use Scenario: Hosting certified boot loader and diagnostic firmware in MRI subsystems where data integrity is mandated by IEC 62304 Class C.

IC Role / Device Role / Timing Role: Safety-certified non-volatile memory providing ECC-protected code execution and CRC-verified firmware validation.

Use Value: 1-bit ECC correction prevents silent data corruption; 20-year retention guarantees firmware validity over equipment lifetime.

Use Scenario: Supplying graphics assets and flight-critical display logic to ARINC 661-compliant cockpit displays operating in extended temperature ranges.

IC Role / Device Role / Timing Role: High-speed flash memory supporting real-time rendering pipelines with zero-latency instruction fetch via XIP.

Use Value: Deep power-down mode (8 µA) extends backup battery life during aircraft ground maintenance periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KL512SDPBHA020Same density and FBGA package but rated for Industrial Plus (–40°C to +105°C); identical HYPERBUS™ timing and ECCRequired for under-hood engine control modules exceeding 85°C ambientSelect when extended temperature operation is mandatory and AEC-Q100 grade 2 certification is needed
Infineon S26KS256SDPBHA020256 Mb density, same 24-ball FBGA, 1.8 V I/O, and HYPERBUS™ interface; 50% lower capacity, otherwise functionally identicalUsed where boot image size fits within 32 MB and BOM cost reduction is prioritizedChoose for cost-sensitive designs with smaller firmware footprints and identical timing/power behavior

Compared with S26KS512SDPBHA023, the S26KL512SDPBHA020 offers higher temperature resilience without performance trade-offs, while the S26KS256SDPBHA020 reduces cost and footprint at the expense of storage headroom-both retain identical HYPERBUS™ protocol implementation and ECC architecture.

Availability

S26KS512SDPBHA023 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot ROMs requiring stable component supply across extended product lifecycles.

Supply support for S26KS512SDPBHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS16949.

This device belongs to the HYPERFLASH™ family-designed specifically for high-bandwidth, low-pin-count boot memory in safety-critical embedded systems where DDR NOR performance and AEC-Q100 compliance are mandatory.

FAQ

What is the purpose of the RWDS signal in S26KS512SDPBHA023?

RWDS (Read Data Strobe) is an output signal synchronized to CK/CK# edges that indicates valid data windows on the DQ bus during read operations. It enables precise timing capture of DDR-read data by the host controller, eliminating setup/hold margin concerns. RWDS is not used during write operations and remains inactive when CS# is deasserted.

Does S26KS512SDPBHA023 support execute-in-place (XIP) operation?

Yes, S26KS512SDPBHA023 supports XIP via its HYPERBUS™ DDR interface, allowing microcontrollers to fetch and execute instructions directly from flash without loading into RAM. This is enabled by deterministic 96 ns random access time and continuous burst read capability up to 333 MBps, verified in Infineon's application note AN229224.

How does the 512-byte program buffer improve write efficiency?

The 512-byte buffer allows the host to issue a single program command followed by up to 512 bytes of data, completing the entire write in 475 µs. This reduces host CPU overhead by ~8× compared to single-word programming (500 µs per 2-byte word), significantly accelerating firmware updates and configuration writes in production test environments.

What protection mechanisms prevent unintended writes during power transitions?

S26KS512SDPBHA023 uses hardware-based Power Supply Control (PSC/PSC#) inputs to detect voltage ramp conditions. When active, they disable internal write logic and lock sector protection registers until stable VCC is confirmed-preventing corruption during brown-out or hot-plug events, as specified in Section 11.7 of the datasheet.

S26KS512SDPBHA023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
HyperBus
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS512SDPBHA023 FAQ

1.How can I place an order for S26KS512SDPBHA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS512SDPBHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS512SDPBHA023 reliable?

The price and inventory of S26KS512SDPBHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDPBHA023 is usually 5 days.

3.What payment methods are accepted for S26KS512SDPBHA023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDPBHA023 transactions.

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4.How is shipping managed for S26KS512SDPBHA023?

S26KS512SDPBHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS512SDPBHA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS512SDPBHA023?

For technical support, including S26KS512SDPBHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDPBHA023 requirements.

6.How does Aetrix verify that S26KS512SDPBHA023 is sourced from the original manufacturer or authorized distributors?

All S26KS512SDPBHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDPBHA023 meets industry standards.

7.What is the process for return or replacement of S26KS512SDPBHA023?

All S26KS512SDPBHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDPBHA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS512SDPBHA023 part is unused and in its original packaging.

Return procedure for S26KS512SDPBHA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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