Infineon Technologies S26KS512SDPBHB023
- Part No.:
- S26KS512SDPBHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS512SDPBHB023.pdf
- Description:
- IC FLASH 512MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,777
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Product details
Overview
S26KS512SDPBHB023 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used for high-speed boot code storage in automotive ADAS ECUs.
For engineers reviewing the S26KS512SDPBHB023 datasheet, S26KS512SDPBHB023 pinout, S26KS512SDPBHB023 application, or S26KS512SDPBHB023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (8 µA), and AEC-Q100 grade 3 qualification.
Technical Context
This device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with dual-edge sampling referenced to CK/CK#. Read operations use RWDS as an edge-aligned output strobe synchronized to data transitions, while write operations rely on center-aligned clock capture.
The embedded algorithm controller (EAC) manages all non-volatile memory operations-including 512-byte buffer programming (475 µs), 256-KB sector erase (930 ms), and volatile/non-volatile sector protection-without host intervention. DCARS (DDR Center Aligned Read Strobe) ensures precise timing alignment between CK edges and data valid windows during burst reads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full boot image + firmware partitioning for complex microcontrollers |
| Interface Protocol | HYPERTBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read throughput |
| Random Access Time | 96 ns - enables fast instruction fetch from non-volatile storage without cache penalty |
| Operating Voltage | 1.8 V I/O, 3.0 V core - compatible with low-power SoC I/O domains while maintaining robust internal operation |
| Temperature Range | –40°C to +85°C (Industrial) - validated for under-hood automotive control units |
| ECC Support | 1-bit correction / 2-bit detection - mitigates single-event upsets in safety-critical boot memory |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-life requirements for automotive ECU field deployment |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK, CK# | Differential clock input | Provides precise edge-aligned timing reference for DDR data capture; required for 166 MHz operation |
| CS# | Chip select (active-low) | Enables device communication; must be asserted before command/address transfer on DQ bus |
| RWDS | Read data strobe output | Indicates valid read data window; edge-aligned to data transitions during burst reads |
| DQ[7:0] | Bi-directional DDR data bus | Carries command, address, and 16-bit data (two 8-bit transfers per clock cycle) |
| INT# | Interrupt output | Signals busy-to-ready transition or ECC error detection event to host processor |
| RSTO# | Reset output | Generates system-level power-on reset pulse; user-configurable LOW duration |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR interface | Reduces signal count to 12 pins (vs ≥40 for legacy parallel NOR), enabling compact PCB routing and lower EMI |
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction-optimizes sequential code fetch efficiency |
| Low-power modes | Deep power-down draws only 8 µA (typical); active clock stop during read consumes 12 mA-ideal for intermittent boot scenarios |
| Hardware data protection | Volatile and non-volatile sector locking prevents accidental erase/write during firmware updates or voltage transients |
| One-time programmable array | 1024-byte OTP space stores immutable keys, calibration data, or security credentials outside main flash array |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware for radar processing units requiring deterministic startup within 100 ms. IC Role / Device Role / Timing Role: Primary non-volatile code execution memory interfaced directly to ARM Cortex-R5F MCU via HYPERBUS™ controller. Use Value: 96 ns random access and 333 MBps sustained read eliminate wait states during vector table fetch and interrupt handler loading. | Use Scenario: Holds firmware images and configuration parameters for modular I/O controllers deployed in factory automation systems. IC Role / Device Role / Timing Role: Dual-image flash storage enabling A/B firmware update with atomic rollback capability. Use Value: 256-KB uniform sectors and 4-KB parameter sectors allow independent update of runtime config without erasing application code. |
| Medical Imaging System FPGA Configuration | Avionics Display Processor Code Storage |
Use Scenario: Loads bitstream and real-time control firmware into Xilinx Zynq-7000 SoC during cold start in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability configuration memory with ECC and AEC-Q100 grade 3 qualification for Class II medical equipment. Use Value: 20-year data retention and 100,000-cycle endurance ensure field longevity without recalibration or reprogramming. | Use Scenario: Stores display engine firmware and graphics assets for DO-254-compliant cockpit display units operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Secure boot memory with RSTO#-driven hardware reset coordination and INT#-signaled ECC fault reporting. Use Value: Deep power-down mode (8 µA) extends battery-backed operation during aircraft pre-flight standby periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KL512SDPBHB020 | Same density and FBGA package; differs in AEC-Q100 grade (Grade 2: –40°C to +105°C) and RSTO# timing spec | Required for extended-temperature engine control modules where ambient exceeds +85°C | Select when higher junction temperature operation is mandated; otherwise identical interface and timing behavior |
| Winbond W74M256FVQI | Octal SPI interface (not HYPERBUS™); 256 Mb density; no RWDS or differential clock; max 133 MHz x4 DTR = 266 MBps | Suitable for cost-sensitive consumer IoT gateways lacking HYPERBUS™ controller support | Choose only if host lacks HYPERBUS™ PHY; requires software driver rewrite and sacrifices 20% peak bandwidth |
Compared with S26KS512SDPBHB023, the Cypress alternative offers extended thermal range but identical pinout and protocol, whereas Winbond's Octal SPI part requires interface redesign and delivers lower sustained throughput despite comparable density.
Availability
S26KS512SDPBHB023 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging systems, and avionics display processors requiring stable component supply across multi-year production cycles.
Supply support for S26KS512SDPBHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with ISO/TS 16949 certification and global automotive supply chain integration.
This device belongs to Infineon's HYPERFLASH™ family-designed specifically for replacing parallel NOR flash in bandwidth-constrained, safety-critical embedded systems requiring deterministic boot performance and long-term data integrity.
FAQ
What is the minimum supported clock frequency for S26KS512SDPBHB023?
The device supports clock frequencies down to DC (0 Hz) in standby and deep power-down modes. For active read/write operations, the minimum functional clock rate is 1 MHz, verified per AC characteristics in datasheet Rev. *Q Section 12.2. This allows flexible timing margining during system initialization and low-frequency debug scenarios without violating setup/hold requirements on DQ or RWDS.
Does S26KS512SDPBHB023 support execute-in-place (XIP) operation?
Yes, S26KS512SDPBHB023 supports true XIP operation via its synchronous HYPERBUS™ interface. The DDR protocol enables continuous instruction fetch without CPU wait states at 166 MHz, and the 96 ns random access time ensures immediate vector response. XIP is implemented in hardware with no external glue logic required, as confirmed in Section 1.2 and Figure 1 of the datasheet.
How is the 512-byte program buffer utilized during write operations?
The 512-byte buffer enables burst programming of aligned 512-byte pages in 475 µs (typical), achieving ~1 MBps throughput-2000× faster than single-word programming. Host writes fill the buffer via DQ bus using standard HYPERBUS™ write commands; the embedded algorithm controller then executes internal page programming autonomously, freeing the bus for other transactions during the 475 µs internal cycle.
Can RWDS be disabled or repurposed for general I/O?
No, RWDS is a dedicated, unidirectional output strictly tied to read-data validity timing and cannot be disabled or reassigned. Its edge-aligned relationship to data transitions is fundamental to HYPERBUS™ DDR timing compliance. Attempting to suppress or ignore RWDS violates the protocol specification and results in corrupted read data, as explicitly stated in Section 4.3 and Figure 4-5 of the datasheet.
S26KS512SDPBHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS512SDPBHB023 FAQ
1.How can I place an order for S26KS512SDPBHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS512SDPBHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS512SDPBHB023 reliable?
The price and inventory of S26KS512SDPBHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDPBHB023 is usually 5 days.
3.What payment methods are accepted for S26KS512SDPBHB023?
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4.How is shipping managed for S26KS512SDPBHB023?
S26KS512SDPBHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS512SDPBHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS512SDPBHB023?
For technical support, including S26KS512SDPBHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDPBHB023 requirements.
6.How does Aetrix verify that S26KS512SDPBHB023 is sourced from the original manufacturer or authorized distributors?
All S26KS512SDPBHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDPBHB023 meets industry standards.
7.What is the process for return or replacement of S26KS512SDPBHB023?
All S26KS512SDPBHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDPBHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS512SDPBHB023 part is unused and in its original packaging.
Return procedure for S26KS512SDPBHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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