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Infineon Technologies S26KS512SDPBHI020

Part No.:
S26KS512SDPBHI020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS512SDPBHI020.pdf
Description:
IC FLASH 512MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:512

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Product details

Overview

S26KS512SDPBHI020 from Infineon Technologies is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded boot code storage in automotive ADAS controllers.

For engineers reviewing the S26KS512SDPBHI020 datasheet, S26KS512SDPBHI020 pinout, S26KS512SDPBHI020 application, or S26KS512SDPBHI020 equivalent, key selection criteria include DDR HYPERBUS™ timing compliance, RWDS-synchronized read latency (96 ns tACC), sector protection configuration, deep power-down current (8 µA), and AEC-Q100 grade 3 qualification for automotive use.

Technical Context

The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with dual-edge sampling referenced to CK/CK#. Read operations use RWDS as an edge-aligned output strobe synchronized to data transitions, while internal MIRRORBIT™ architecture enables concurrent page fetch and burst output to sustain 333 MBps throughput.

It integrates two independent control units: Host Interface Controller (HIC) handles real-time signal monitoring and data transfer coordination, while Embedded Algorithm Controller (EAC) executes non-volatile memory operations-including 256-KB sector erase and 512-byte buffer programming-without host intervention, using internally managed command sequences.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - supports full firmware image storage for mid-tier microcontrollers
Interface ProtocolHYPERRBUS™ DDR - reduces pin count vs parallel NOR while sustaining 333 MBps read bandwidth
Max Clock Rate166 MHz at 1.8 V - enables 333 MBps sustained read (2 × 8-bit transfers per cycle)
Initial Access Time96 ns tACC - defines minimum latency from CS# assertion to first valid data on DQ
ECC Capability1-bit correction / 2-bit detection - ensures data integrity during long-term storage in automotive environments
Operating Temp–40°C to +85°C (Industrial) - qualified per AEC-Q100 Grade 3 for under-hood ECUs
Endurance100,000 program/erase cycles - sufficient for field firmware updates over 15-year vehicle lifetime
Data Retention20 years - guaranteed retention without refresh at max rated temperature

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides timing reference for DDR sampling; CK# enables noise rejection in high-speed automotive PCB layouts
CS#Chip select (active-low)Enables device communication; must be asserted before address/command launch on DQ bus
RWDSRead data strobe outputEdge-aligned output indicating valid DQ data during reads; used by host to latch sampled data
DQ[7:0]Bi-directional data busCarries commands, addresses, and 8-bit data in DDR mode; shared bus reduces routing complexity
INT#Interrupt outputSignals Busy→Ready transition or ECC error detection to host processor without polling
RSTO#Reset outputGenerates system-level power-on reset pulse; duration configurable via non-volatile register
PSC / PSC#Power supply controlSupports hardware-based data protection during brown-out conditions per ISO 26262 ASIL-B

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 12 pins (vs ≥40 for legacy parallel NOR), enabling compact PCB layout in space-constrained ADAS modules
Configurable burst modeSupports wrapped (16/32/64-byte) or linear bursts per transaction-optimizes cache line fill efficiency for ARM Cortex-R5 boot loaders
Deep power-down modeDraws only 8 µA typical-extends battery life in always-on telematics gateways during vehicle sleep mode
One-time programmable (OTP) array1024-byte dedicated region for secure key storage or calibration constants, isolated from main flash erase cycles
Volatile/non-volatile sector protectionEnables runtime lock/unlock of 256-KB sectors via command set or persistent bit settings-prevents accidental firmware overwrite in production test

Applications

Automotive ADAS Domain Controller Boot MemoryIndustrial PLC Firmware Storage

Use Scenario: Stores boot firmware and safety-critical application code for radar/Ethernet domain controllers requiring AEC-Q100 Grade 3 qualification.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to ARM Cortex-R5F via HYPERBUS™ controller; provides sub-100 ns random access for fast cold start.

Use Value: 333 MBps read bandwidth eliminates wait states during multi-core initialization; ECC ensures ASIL-B compliant code integrity over 15-year vehicle life.

Use Scenario: Holds firmware and configuration data for modular PLCs deployed in factory automation systems with extended temperature operation.

IC Role / Device Role / Timing Role: Standalone NOR flash replacing parallel interface devices; connected to XMC4000 MCU via dedicated HYPERBUS™ peripheral.

Use Value: 256-KB uniform sectors simplify field firmware updates; deep power-down mode (<10 µA) meets energy efficiency requirements for DIN-rail mounted controllers.

Medical Imaging System Code StorageAvionics Display Unit Firmware

Use Scenario: Stores certified boot loader and diagnostic firmware in portable ultrasound machines requiring high reliability and low standby power.

IC Role / Device Role / Timing Role: Secure boot memory with OTP key storage; interfaces to Infineon TriCore TC3xx via HYPERBUS™ with CRC-enabled read verification.

Use Value: 20-year data retention guarantees firmware validity across device lifecycle; RSTO# output synchronizes system reset with flash power-up sequence.

Use Scenario: Provides certified flight software storage in DO-254 compliant display units where deterministic read latency is mandatory.

IC Role / Device Role / Timing Role: High-integrity code memory with ECC and CRC; operates in –40°C to +105°C Industrial Plus grade variant (S26KS512SDPBHI10).

Use Value: 96 ns tACC and RWDS-synchronized timing ensure predictable instruction fetch timing for ARINC 653 partitioned OS execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KL512SDPBHI020Same die, identical electrical specs and pinout; rebranded pre-acquisition part - functionally identicalNo difference; supported by same Infineon tools and documentationSelect when sourcing legacy Cypress-designated BOMs or requiring continuity with prior design registrations
Macronix MX66UM1G45GXDIO1 Gb density, octal DDR interface (x8 DTR), 400 MBps read; no RWDS, uses DQS insteadRequires different controller IP and PCB layout; lacks AEC-Q100 Grade 1/2/3 certificationChoose for higher density and bandwidth where HYPERBUS™ ecosystem compatibility is not required

Compared with S26KS512SDPBHI020, the Cypress-branded variant offers identical functionality and drop-in compatibility, while the Macronix alternative trades HYPERBUS™ simplicity and automotive qualification for higher bandwidth and density at the cost of controller redesign and qualification effort.

Availability

S26KS512SDPBHI020 is available at Aetrix Electronics and suitable for automotive ADAS controllers, industrial PLCs, medical imaging systems, and avionics display units requiring stable component supply, AEC-Q100 qualification, and long-term data retention.

Supply support for S26KS512SDPBHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This device belongs to the HYPERFLASH™ family-designed specifically for high-bandwidth, low-pin-count boot memory in safety-critical automotive and industrial systems requiring deterministic timing and long-term reliability.

FAQ

What is the purpose of the RWDS signal in S26KS512SDPBHI020?

RWDS (Read Data Strobe) is an output signal that indicates valid data presence on the DQ[7:0] bus during read operations. It is edge-aligned with data transitions and referenced to CK/CK# edges, allowing the host controller to accurately sample DDR data without relying solely on clock phase alignment. This eliminates setup/hold timing margin concerns in high-speed layouts.

Does S26KS512SDPBHI020 support both 1.8 V and 3.0 V I/O operation?

No-S26KS512SDPBHI020 is specified for 1.8 V I/O operation only, with differential clock inputs (CK/CK#) and 12-signal HYPERBUS™ interface. The 3.0 V I/O variant is designated separately (e.g., S26KL512SDPBHI020 with single-ended clock). Mixing voltage domains violates absolute maximum ratings and risks permanent damage.

How does the 512-byte program buffer improve write performance?

The 512-byte buffer enables burst programming at ~1 MBps-over 200× faster than single-word programming (~4 KBps). By loading one buffer full of data before issuing the program command, the device executes internal write algorithms without host intervention, reducing CPU overhead and improving firmware update efficiency in resource-constrained systems.

Is RSTO# output configurable, and what is its default behavior?

Yes-RSTO# pulse duration is user-configurable via non-volatile register bits. By default, it asserts LOW for 100 ms after power stabilization to meet typical SoC reset timing requirements. Configuration is performed through standard command sequences and persists across power cycles, enabling adaptation to diverse host processor reset specifications.

S26KS512SDPBHI020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
HyperBus
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS512SDPBHI020 FAQ

1.How can I place an order for S26KS512SDPBHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS512SDPBHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS512SDPBHI020 reliable?

The price and inventory of S26KS512SDPBHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDPBHI020 is usually 5 days.

3.What payment methods are accepted for S26KS512SDPBHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDPBHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS512SDPBHI020?

S26KS512SDPBHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS512SDPBHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS512SDPBHI020?

For technical support, including S26KS512SDPBHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDPBHI020 requirements.

6.How does Aetrix verify that S26KS512SDPBHI020 is sourced from the original manufacturer or authorized distributors?

All S26KS512SDPBHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDPBHI020 meets industry standards.

7.What is the process for return or replacement of S26KS512SDPBHI020?

All S26KS512SDPBHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDPBHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS512SDPBHI020 part is unused and in its original packaging.

Return procedure for S26KS512SDPBHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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