Infineon Technologies S26KS512SDPBHM023
- Part No.:
- S26KS512SDPBHM023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS512SDPBHM023.pdf
- Description:
- IC FLASH 512MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,677
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S26KS512SDPBHM023 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, 100,000 program/erase cycles, and operates from –40°C to +105°C (Industrial Plus grade). Used in high-performance boot code storage for automotive ADAS controllers.
For engineers reviewing the S26KS512SDPBHM023 datasheet, S26KS512SDPBHM023 pinout, S26KS512SDPBHM023 application, or S26KS512SDPBHM023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), RWDS-synchronized DDR read alignment, ECC 1-bit correction/2-bit detection, and FBGA-24 package compatibility with board-level signal integrity constraints.
Technical Context
This device implements a DDR center-aligned read strobe (DCARS) architecture where command/address and data are transferred over the same 8-bit DQ bus using double-data-rate signaling referenced to CK/CK#. RWDS output is edge-aligned to CK transitions during reads, enabling precise data capture by the host controller.
The embedded algorithm controller (EAC) manages all non-volatile operations-including 512-byte buffer programming and 256-KB sector erase-without host intervention. Sector protection supports both volatile (lock bits) and non-volatile (OTP configuration) methods, and the 1024-byte one-time-programmable array stores critical calibration or security keys.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full boot image + firmware partitioning for real-time OS execution |
| Interface Standard | HYPERTBUS™ DDR - 8-bit bidirectional DQ bus with differential CK/CK#, eliminating parallel address bus overhead |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte per transfer, enabling sub-200 ms boot time |
| Random Access Time | 96 ns - initial latency of 5–16 clock cycles enables deterministic interrupt vector fetch timing |
| ECC Capability | 1-bit correction / 2-bit detection - hardware-accelerated error handling without CPU intervention |
| Operating Temperature | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive ECUs without derating |
| Endurance & Retention | 100,000 cycles / 20 years - meets AEC-Q100 Grade 2 requirements for field-updatable firmware |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Defines DDR sampling edges; CK# must be inverted and phase-matched to CK for jitter tolerance ≤ 50 ps |
| CS# | Chip select (active low) | Enables device communication; HIGH places device in standby (25 µA) or deep power-down (8 µA) |
| RWDS | Read data strobe output | Edge-aligned to CK transitions during reads; used by host to latch DQ[7:0] valid data windows |
| DQ[7:0] | Bi-directional data bus | Carries commands, addresses, and 8-bit data on both clock edges; requires controlled impedance (50 Ω) routing |
| INT# | Interrupt output | Asserts on ECC detection or busy-to-ready transition; level-sensitive, open-drain, requires external pull-up |
| RSTO# | Reset output | Configurable LOW pulse for system power-on reset; duration programmable via status register |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces pin count by 40% vs. legacy parallel NOR; eliminates separate address bus and simplifies PCB layout |
| 512-byte Program Buffer | Enables 1 MBps write speed (vs. 4 KBps single-word), cutting firmware update time by >95% in OTA applications |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction-optimizes cache line fill for ARM Cortex-R5/R7 cores |
| Hardware ECC Engine | Corrects single-bit errors on-the-fly during read; detects double-bit errors without software overhead or latency penalty |
| Automotive Qualification | AEC-Q100 Grade 2 certified (–40°C to +105°C); ISO/TS 16949 manufacturing flow ensures zero-defect supply chain traceability |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, safety-critical RTOS kernel, and sensor fusion algorithms in centralized ADAS ECU. IC Role / Device Role / Timing Role: Primary non-volatile code storage with deterministic <96 ns random access for hard real-time interrupt response. Use Value: HYPERBUS™ 333 MBps read throughput enables sub-150 ms cold boot, meeting ISO 26262 ASIL-B timing constraints. | Use Scenario: Holds field-upgradable ladder logic, motion control firmware, and HMI assets in modular PLC backplane systems. IC Role / Device Role / Timing Role: High-reliability firmware repository supporting 100,000+ field updates over 15-year product lifecycle. Use Value: Hardware ECC and 20-year data retention eliminate uncorrectable bit errors in factory-floor environments with EMI exposure. |
| Medical Imaging System Boot Memory | 5G Baseband Radio Unit Firmware |
Use Scenario: Hosts FPGA configuration bitstream and diagnostic firmware in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for FDA-regulated code with OTP key storage for cryptographic signing. Use Value: 1024-byte one-time-programmable array isolates root-of-trust keys from field reprogramming risks. | Use Scenario: Stores baseband processor microcode and RF calibration tables in outdoor macrocell radio units. IC Role / Device Role / Timing Role: High-speed, thermally robust firmware storage operating continuously at +105°C ambient. Use Value: Industrial Plus temperature rating eliminates thermal throttling or derating in sealed outdoor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-SXIT | 4 Mb Quad SPI FRAM; no erase latency, unlimited endurance, but 40 MBps max read speed | Best for frequent small writes (e.g., logging), not high-throughput boot code | Select only when write-cycle endurance >1012 cycles is mandatory and bandwidth <50 MBps is acceptable |
| S26KL512SDPBHM020 | Same density and pinout, but 3.0 V I/O (not 1.8 V); uses single-ended CK, not differential CK/CK# | Compatible with legacy 3.0 V host PHYs; lacks differential clock noise immunity for high-speed routing | Choose for cost-sensitive industrial designs where 200 MBps (100 MHz) read speed suffices and board layout lacks CK/CK# routing capability |
Compared with CY15B104QN-SXIT and S26KL512SDPBHM020, S26KS512SDPBHM023 uniquely balances 333 MBps DDR throughput, automotive-grade reliability, and differential clock noise immunity-making it optimal for next-generation ADAS and 5G infrastructure where boot latency and signal integrity are co-constrained.
Availability
S26KS512SDPBHM023 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, medical imaging boot systems, and 5G baseband radio units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S26KS512SDPBHM023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing facilities.
This part belongs to the HYPERFLASH™ family-designed specifically for high-bandwidth, low-pin-count boot memory in safety-critical automotive and industrial systems requiring deterministic timing and AEC-Q100 qualification.
FAQ
What is the purpose of the RWDS signal in S26KS512SDPBHM023?
RWDS (Read Data Strobe) is an output signal synchronized to CK/CK# transitions during read operations. It indicates valid data windows on DQ[7:0], allowing the host controller to accurately sample DDR data without relying solely on clock edge timing. RWDS is not used during write operations and is essential for achieving reliable 333 MBps read throughput under signal integrity constraints.
Does S26KS512SDPBHM023 support linear burst mode, and how does it improve performance?
Yes, it supports configurable linear burst mode. In this mode, while bursting out one 32-byte page, the device simultaneously fetches the next sequential page from the MIRRORBIT™ array. This pipelining eliminates inter-page latency, enabling sustained 333 MBps throughput-critical for streaming boot code into CPU instruction caches without stalls.
How is ECC implemented, and what error conditions does it handle?
ECC is implemented in hardware with dedicated circuitry that computes and checks Hamming codes on every read. It corrects any single-bit error within a 512-bit word and detects any double-bit error. No software driver or CPU cycle overhead is required-the correction occurs transparently during data output, preserving deterministic timing for safety-critical applications.
What are the wake-up requirements from Deep Power-Down mode?
Deep Power-Down mode draws only 8 µA (typical) at +85°C and requires a 300 µs wake-up time before the device accepts commands. During wake-up, CS# must remain asserted (LOW), and CK must be stable. No initialization sequence is needed-after 300 µs, the device responds to standard commands, making it suitable for ultra-low-power always-on subsystems.
S26KS512SDPBHM023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS512SDPBHM023 FAQ
1.How can I place an order for S26KS512SDPBHM023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS512SDPBHM023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS512SDPBHM023 reliable?
The price and inventory of S26KS512SDPBHM023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDPBHM023 is usually 5 days.
3.What payment methods are accepted for S26KS512SDPBHM023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDPBHM023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS512SDPBHM023?
S26KS512SDPBHM023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS512SDPBHM023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS512SDPBHM023?
For technical support, including S26KS512SDPBHM023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDPBHM023 requirements.
6.How does Aetrix verify that S26KS512SDPBHM023 is sourced from the original manufacturer or authorized distributors?
All S26KS512SDPBHM023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDPBHM023 meets industry standards.
7.What is the process for return or replacement of S26KS512SDPBHM023?
All S26KS512SDPBHM023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDPBHM023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS512SDPBHM023 part is unused and in its original packaging.
Return procedure for S26KS512SDPBHM023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S26KS512SDPBHM023 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

