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Infineon Technologies S26KS512SDPBHV020

Part No.:
S26KS512SDPBHV020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS512SDPBHV020.pdf
Description:
IC FLASH 512MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:157

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Product details

Overview

S26KS512SDPBHV020 from Infineon Technologies is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial-plus temperature range (–40°C to +105°C). It is used in automotive ADAS domain controllers for fast boot code execution.

For engineers reviewing the S26KS512SDPBHV020 datasheet, S26KS512SDPBHV020 pinout, S26KS512SDPBHV020 application, or S26KS512SDPBHV020 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns tACC), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (8 µA), and AEC-Q100 Grade 2 qualification for automotive embedded systems.

Technical Context

The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for high-density NOR storage with word-wide (16-bit) addressing and page-aligned 32-byte random reads.

HYPERBUS™ protocol enables burst-oriented operations with configurable wrapped (16/32/64-byte) or linear bursts, and supports DCARS (DDR Center-Aligned Read Strobe) timing where read data edges align with RWDS transitions-not CK edges. Command/address and data share the same 8-bit DQ bus in DDR mode, reducing pin count versus legacy parallel NOR.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512 Mb (64 MB) - supports full OS image or multi-application firmware storage in space-constrained automotive ECUs.
Interface Standard HYPERTBUS™ DDR - 8-bit bidirectional DQ bus with differential CK/CK#, eliminating separate address bus and reducing PCB layer count.
Max Read Throughput 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte per transfer, enabling sub-200 ms boot time for 64 MB images.
Random Access Time 96 ns tACC - initial latency for first word access; enables deterministic timing for real-time safety-critical boot sequences.
Operating Temperature –40°C to +105°C (Industrial Plus) - qualified per AEC-Q100 Grade 2, suitable for under-hood ADAS camera modules and radar processors.
ECC & Data Integrity 1-bit correction / 2-bit detection + CRC - protects against single-event upsets in automotive radiation environments without software overhead.
Power Modes Deep Power-Down: 8 µA (typical); Active Clock Stop during read: 12 mA - enables low-quiescent-power firmware storage in always-on vehicle domains.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CK / CK# Differential clock input Reference for DDR sampling of command/address/data; enables jitter-tolerant timing at 166 MHz.
CS# Chip select (active-low) Enables device communication; must be asserted before any transaction; controls entry into Deep Power-Down when held HIGH.
RWDS Read data strobe output Source-synchronous strobe aligned to read data edges; used by host to latch DQ[7:0] during burst reads.
DQ[7:0] Bi-directional data bus Carries commands, addresses, and data in DDR mode; 8-bit width reduces routing complexity vs. 16/32-bit parallel NOR.
INT# Interrupt output Asserted on Busy→Ready transition or ECC error detection; enables asynchronous host notification without polling.
RSTO# Reset output Configurable LOW pulse after power-on reset; drives system-level POR for companion MCUs or SoCs.

Key Features

Feature Design Value
HYPERBUS™ DDR Interface Reduces signal count to 11–12 pins (vs. >40 for QSPI or parallel NOR), enabling compact PCB layout in ECU modules.
Configurable Burst Mode Supports wrapped (16/32/64-byte) or linear bursts per transaction-optimizes cache line fetches for ARM Cortex-R5/R7 boot ROM access patterns.
Advanced Sector Protection Volatile and non-volatile lock bits per 256-KB sector-prevents accidental overwrite of critical bootloader or calibration data in field-programmed units.
512-byte Program Buffer Enables 1 MBps effective write speed (vs. 4 KBps for single-word programming)-reduces firmware update time by >99% in OTA scenarios.
AEC-Q100 Grade 2 Qualification Validated for –40°C to +105°C operation with 100,000 program/erase cycles and 20-year data retention-meets ASIL-B functional safety requirements.

Applications

Automotive ADAS Domain Controller Industrial PLC Firmware Storage

Use Scenario: Boot code and safety monitor firmware storage in centralized ADAS domain controller requiring <200 ms cold start.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with HYPERBUS™-aligned DDR read interface; provides deterministic 96 ns tACC and RWDS-synchronized data delivery.

Use Value: Enables direct XIP (eXecute-In-Place) from flash at 333 MBps, eliminating need for external RAM copy and reducing BOM cost and power.

Use Scenario: Field-upgradable firmware storage in modular industrial PLCs operating in harsh factory environments.

IC Role / Device Role / Timing Role: High-reliability NOR flash with ECC and sector protection; operates continuously at 85°C ambient with 25 µA standby current.

Use Value: Supports secure remote updates via 512-byte buffer programming (1 MBps), cutting update time from minutes to seconds without system downtime.

Medical Imaging System Boot ROM Avionics Display Processor Memory

Use Scenario: Storing certified boot firmware and diagnostic routines in FDA-regulated medical imaging equipment with strict data integrity requirements.

IC Role / Device Role / Timing Role: Safety-critical boot memory with 1-bit ECC correction and CRC validation; retains data for 20 years at 85°C.

Use Value: Eliminates need for external error-checking logic or redundant memory, simplifying certification evidence for IEC 62304 Class C software.

Use Scenario: Firmware and graphics asset storage in DO-178C-certified avionics display processors requiring extended temperature operation.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 1 qualified (–40°C to +125°C) HYPERFLASH™ device used as primary boot memory with RSTO#-driven system reset coordination.

Use Value: Provides guaranteed power-on reset signaling and deep power-down (4 µA) for battery-backed display subsystems during aircraft ground maintenance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress S26KL512SDPBHV020 Same die, identical electrical specs and pinout; rebranded part pre-Infineon acquisition; no functional difference. No change in design-in or qualification path; fully interchangeable in existing schematics and layouts. Select when sourcing legacy Cypress-designated inventory or for cross-supply chain continuity.
Macronix MX25L51245G Quad SPI interface (4-wire), max 133 MHz clock, 40 MBps read speed; no RWDS or differential clock; lacks ECC and AEC-Q100 grade. Suitable only for cost-sensitive non-automotive applications where 333 MBps throughput and safety certification are not required. Choose only for non-safety-critical consumer or prototyping use; not drop-in compatible due to interface and timing differences.

Compared with S26KS512SDPBHV020, the Cypress rebrand offers zero technical trade-off but limited long-term supply visibility, while the Macronix QSPI alternative sacrifices >8× read bandwidth, safety qualification, and ECC-making it unsuitable for automotive or industrial real-time boot applications.

Availability

S26KS512SDPBHV020 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, medical imaging boot ROMs, and avionics display processors requiring stable component supply across extended product lifecycles.

Supply support for S26KS512SDPBHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This device belongs to Infineon's HYPERFLASH™ family-designed specifically for high-speed, low-pin-count boot memory in automotive and industrial systems requiring deterministic timing, ECC protection, and AEC-Q100 qualification.

FAQ

What is the minimum supported clock frequency for S26KS512SDPBHV020?

The device supports variable clock rates down to DC (0 Hz) in active modes, with no specified minimum frequency. Its HYPERBUS™ interface operates reliably across the full range from idle (clock stopped) to 166 MHz, and clock-stop during read consumes only 12 mA with no wake-up delay-enabling dynamic frequency scaling in power-aware systems.

Does S26KS512SDPBHV020 require external termination resistors for CK/CK#?

Yes. Per Infineon's layout guidelines (Datasheet Rev. *Q, Section 15.1), 50 Ω series termination is required on both CK and CK# lines near the device package, and a 100 Ω differential termination resistor must be placed close to the memory device between CK and CK# to ensure signal integrity at 166 MHz DDR operation.

How is the 512-byte program buffer utilized in practice?

The buffer accepts up to 512 bytes of write data in a single burst, then internally programs all data in ~475 µs. This enables 1 MBps effective write speed-ideal for firmware patching or configuration updates. Host must issue a "Buffer Write" command followed by "Program Buffer to Array" command; no intermediate polling is needed during internal programming.

Can S26KS512SDPBHV020 operate in 3.0 V I/O mode?

No. The "S" suffix in S26KS512S denotes 1.8 V I/O operation only. This part has fixed 1.8 V VCCQ and requires differential CK/CK#; it is not compatible with 3.0 V VCCQ systems. The 3.0 V variant is the S26KL512S (single-ended clock, 100 MHz max), which uses different pinout and timing.

S26KS512SDPBHV020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
HyperBus
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS512SDPBHV020 FAQ

1.How can I place an order for S26KS512SDPBHV020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS512SDPBHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS512SDPBHV020 reliable?

The price and inventory of S26KS512SDPBHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDPBHV020 is usually 5 days.

3.What payment methods are accepted for S26KS512SDPBHV020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDPBHV020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS512SDPBHV020?

S26KS512SDPBHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS512SDPBHV020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS512SDPBHV020?

For technical support, including S26KS512SDPBHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDPBHV020 requirements.

6.How does Aetrix verify that S26KS512SDPBHV020 is sourced from the original manufacturer or authorized distributors?

All S26KS512SDPBHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDPBHV020 meets industry standards.

7.What is the process for return or replacement of S26KS512SDPBHV020?

All S26KS512SDPBHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDPBHV020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS512SDPBHV020 part is unused and in its original packaging.

Return procedure for S26KS512SDPBHV020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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