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Infineon Technologies S27KL0641DABHA023

Part No.:
S27KL0641DABHA023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0641DABHA023.pdf
Description:
IC PSRAM 64MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,364

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Product details

Overview

S27KL0641DABHA023 from Infineon Technologies (formerly Cypress) is a 64 Mb (8 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and bidirectional RWDS strobe/mask. It delivers 333 MBps throughput at 166 MHz DDR, features DCARS timing, configurable burst lengths (16–128 bytes), and deep power-down mode consuming only 20 µA at 1.8 V. Used in embedded graphics buffers and real-time display controllers where low pin count and high bandwidth are critical.

For engineers reviewing the S27KL0641DABHA023 datasheet, S27KL0641DABHA023 pinout, S27KL0641DABHA023 application, or S27KL0641DABHA023 equivalent, key selection criteria include HyperBus interface compatibility, 1.8 V I/O voltage tolerance, DCARS-enabled read strobe alignment, burst configuration flexibility, and deep power-down current specification under 105 °C operation.

Technical Context

This device implements a pseudo-static RAM architecture using internally managed self-refresh DRAM cells, eliminating host-side refresh management while maintaining SRAM-like ease of use. Its HyperBus interface uses center-aligned command/address transfers and edge-aligned DDR data transfers synchronized to CK/CK#.

The RWDS signal serves dual roles: as a latency-indicating output during CA phase and as a source-synchronous read strobe or write mask during data phases. DCARS functionality shifts RWDS phase relative to CK to center it within the read data eye, enabling reliable high-speed sampling at 166 MHz.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 Mb (8 MB) - fixed capacity for compact memory expansion without external address demultiplexing
Interface Standard HyperBus - 12-signal low-count DDR interface (CK/CK#, CS#, DQ[7:0], RWDS) enabling PCB layer reduction
Data Rate 333 MBps at 166 MHz DDR - supports real-time 720p video frame buffering with minimal latency overhead
Supply Voltage 1.8 V VCCQ / 1.8 V VCC - compatible with modern low-voltage SoC I/O domains and reduces switching noise
Burst Length Configurable: 16/32/64/128 bytes - enables cache-line-aligned reads (16-byte) or linear image transfers (128-byte)
Deep Power-Down Current 20 µA at 1.8 V, 105 °C - enables battery-backed standby in portable HMI systems with multi-week retention
Access Time 36 ns tACC at 166 MHz - defines minimum cycle time for consecutive random accesses in register or small-data contexts

Pinout & Package

Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VCC, VCCQ Core & I/O supply Separate 1.8 V supplies allow independent power domain control and reduce cross-talk between logic and I/O paths
VSS, VSSQ Core & I/O ground Dedicated ground pins per supply domain minimize ground bounce and improve signal integrity on DQ/RWDS
CK, CK# Differential clock input LV-CMOS differential pair accepts 166 MHz DDR clock; required for DCARS timing and jitter-tolerant sampling
CS# Chip select Active-low enable controlling transaction initiation and deep power-down entry when held high
RWDS Bidirectional strobe/mask Indicates initial latency during CA phase; acts as read strobe or write mask during data phase
DQ[7:0] 8-bit bidirectional data bus DDR-capable signals transferring two 8-bit words per clock cycle; support byte masking via RWDS
RESET# Hardware reset Asynchronous active-low signal forcing internal state machine reset and clearing pending transactions

Key Features

Feature Design Value
Self-refresh DRAM core Eliminates host refresh overhead while retaining DRAM density advantage-enables SRAM-like interface with 8× capacity
DCARS (DDR Center-Aligned Read Strobe) Phase-shifts RWDS relative to CK to center strobe edge in read data eye-enables robust 166 MHz sampling without external delay tuning
Configurable burst type per transaction Per-command selection of wrapped (cache line) or linear (bulk transfer) bursts-supports mixed workloads without firmware reconfiguration
Low-power deep power-down mode 20 µA quiescent current at 1.8 V/105 °C-extends battery life in always-on industrial HMIs and medical displays
HyperBus interface (12-pin) Reduces PCB routing layers vs. parallel NOR/NAND; eliminates address bus and simplifies timing closure for SoC integration

Applications

Industrial HMI Display Buffer Automotive Digital Cluster Memory

Use Scenario: Real-time rendering of animated gauges and map overlays in factory-floor operator panels with ambient temperature up to 105 °C.

IC Role / Device Role / Timing Role: Frame buffer memory interfaced directly to MCU's HyperBus controller; provides low-latency pixel data access with no refresh arbitration.

Use Value: 333 MBps bandwidth sustains 60 Hz updates of 1280×720 RGB565 frames; deep power-down preserves display state during panel sleep modes.

Use Scenario: Storage of instrument cluster graphics assets and dynamic warning icons in AEC-Q100 qualified automotive ECUs.

IC Role / Device Role / Timing Role: Pseudo-static memory mapped into MCU address space; handles burst reads for icon animation sequences with deterministic tACC ≤ 36 ns.

Use Value: Wrapped 16-byte bursts align with cache lines of ARM Cortex-R5 cores; DCARS ensures reliable read strobing despite ECU board-level jitter.

Smart Home Gateway UI Cache Medical Imaging Preview Buffer

Use Scenario: Local caching of web-based UI assets (SVG, fonts, bitmaps) in Wi-Fi-connected smart home hubs with intermittent power.

IC Role / Device Role / Timing Role: Non-volatile-adjacent memory holding decompressed UI resources; accessed via burst reads initiated by application processor.

Use Value: Linear 128-byte bursts efficiently load compressed glyph tables; 20 µA deep power-down extends backup capacitor hold-up time by >40%.

Use Scenario: Temporary storage of DICOM preview thumbnails and histogram data during ultrasound probe calibration sequences.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory for real-time image processing pipelines; synchronized to imaging SoC's HyperBus master clock.

Use Value: 166 MHz DDR clock supports 10-bit grayscale preview at 30 fps; separate VCCQ/VCC rails isolate analog front-end noise from memory I/O.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus-compatible memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S27KL0641DABHI020 Same die, -40 °C to +85 °C industrial temp grade (vs. -40 °C to +105 °C in DABHA023) Lacks extended temperature support for under-hood or high-ambient industrial enclosures Select for cost-sensitive non-extended-temp designs where 85 °C max ambient suffices
S70KL1281DABHA020 128 Mb (16 MB) dual-die stack, same package and interface; higher density but 72 mA burst current (vs. 60 mA) Requires higher power delivery and thermal margin; not drop-in due to different memory map size Choose when >8 MB frame buffer is needed and system power budget allows +20% peak current

Compared with S27KL0641DABHA023, the DABHI020 offers identical performance at lower temperature grade and cost, while the S70KL1281DABHA020 doubles capacity at the expense of higher current and thermal footprint-making the original part optimal for thermally constrained 8 MB applications requiring full industrial temperature range.

Availability

S27KL0641DABHA023 is available at Aetrix Electronics and suitable for industrial HMI display buffers, automotive digital cluster memory, and medical imaging preview buffers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S27KL0641DABHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions derived from its acquisition of Cypress Semiconductor.

This part belongs to Infineon's HyperRAM™ product line, designed specifically to replace parallel NOR/NAND and legacy PSRAM in bandwidth-constrained embedded systems needing DRAM density with SRAM simplicity.

FAQ

Is S27KL0641DABHA023 pin-compatible with other HyperRAM devices in the S27KL/S27KS family?

Yes, all S27KL0641 variants share identical 24-ball FBGA pinout and HyperBus interface signaling. Differences are limited to temperature grade, voltage option (1.8 V only in this variant), and internal configuration fuses-no PCB redesign is needed when migrating between DABHA023, DABHI020, or DAHAI020 packages.

Does S27KL0641DABHA023 require external refresh circuitry or host-managed refresh cycles?

No. The device integrates autonomous self-refresh logic that maintains DRAM cell charge without host intervention. The HyperBus interface presents it as a pseudo-static RAM-only standard read/write commands are required, and refresh operations occur transparently during idle periods or controlled latency windows.

What is the functional impact of the RWDS signal's dual role in read versus write transactions?

In reads, RWDS acts as a source-synchronous strobe edge-aligned with DQ transitions, enabling precise data capture. In writes, it functions as a byte mask: HIGH disables the corresponding DQ byte from being written, allowing partial-word updates without read-modify-write cycles-critical for efficient GUI text rendering and overlay composition.

Can S27KL0641DABHA023 operate with single-ended clock instead of differential CK/CK#?

No. This variant (DABHA023) is specified exclusively for 1.8 V operation with differential clock inputs. Single-ended clock support is only available in 3.0 V variants (e.g., S27KS0641), which use CK-only and have different timing parameters and maximum frequency (100 MHz).

S27KL0641DABHA023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
40 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0641DABHA023 FAQ

1.How can I place an order for S27KL0641DABHA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0641DABHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0641DABHA023 reliable?

The price and inventory of S27KL0641DABHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0641DABHA023 is usually 5 days.

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Once your S27KL0641DABHA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0641DABHA023?

For technical support, including S27KL0641DABHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0641DABHA023 requirements.

6.How does Aetrix verify that S27KL0641DABHA023 is sourced from the original manufacturer or authorized distributors?

All S27KL0641DABHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0641DABHA023 meets industry standards.

7.What is the process for return or replacement of S27KL0641DABHA023?

All S27KL0641DABHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0641DABHA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0641DABHA023 part is unused and in its original packaging.

Return procedure for S27KL0641DABHA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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