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Infineon Technologies S27KL0641DABHB023

Part No.:
S27KL0641DABHB023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0641DABHB023.pdf
Description:
IC PSRAM 64MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,890

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Product details

Overview

S27KL0641DABHB023 from Infineon Technologies (formerly Cypress) is a 64 Mb (8 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and bidirectional RWDS strobe/mask. It delivers 333 MBps throughput at 166 MHz DDR, features DCARS timing for read data eye alignment, and integrates on-die refresh control to emulate PSRAM behavior in embedded systems requiring low-pin-count high-bandwidth memory.

For engineers reviewing the S27KL0641DABHB023 datasheet, S27KL0641DABHB023 pinout, S27KL0641DABHB023 application, or S27KL0641DABHB023 equivalent, key selection criteria include HyperBus signal count (12 pins), DCARS-enabled read strobe timing, configurable burst length (16–128 bytes), deep power-down current (20 µA @ 1.8 V), and FBGA-24 package compatibility with space-constrained SoC interfaces.

Technical Context

This device implements a DDR HyperBus interface with center-aligned command/address transfers and edge-aligned read data using RWDS as a source-synchronous strobe. Its internal refresh controller eliminates host-managed refresh cycles, enabling seamless integration with microcontrollers lacking DRAM controllers.

The HyperRAM architecture supports dynamic burst type selection per transaction-wrapped (for cache-line fills) or linear (for graphics/data streaming)-and includes programmable output drive strength and initial latency negotiation via RWDS during CA phase. DCARS functionality shifts RWDS phase relative to CK to center transitions within the read data eye at high speed.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 Mb (8 MB) - fixed capacity for compact embedded memory expansion without external refresh logic
Interface HyperBus DDR - 12-signal low-count interface (CK/CK#, CS#, RWDS, DQ[7:0]) replacing traditional parallel SRAM/SDRAM buses
Max Throughput 333 MBps - achieved at 166 MHz DDR clock with 1.8 V VCCQ, enabling real-time video frame buffering
Burst Config 16/32/64/128-byte wrapped or linear bursts - selectable per transaction to optimize cache fill vs. sequential data transfer
Deep Power Down 20 µA @ 1.8 V - ultra-low standby current for battery-powered IoT endpoints requiring memory retention
Package 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) - surface-mount footprint compatible with automated PCB assembly
Timing Mode DCARS (DDR Center-Aligned Read Strobe) - RWDS phase-shifted to align strobe edges with center of read data eye at 166 MHz

Pinout & Package

Package: 24-ball Fine-Pitch Ball Grid Array (FBGA), 5 mm × 5 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
VCC Core Supply 1.8 V nominal supply for memory core logic; decoupling required per datasheet layout guidelines
VCCQ I/O Supply 1.8 V nominal supply for DQ/RWDS/CK/CK#/CS# buffers; independent from VCC for voltage domain isolation
VSS Digital Ground Primary ground reference for core logic; must be connected to system GND plane with low-inductance path
VSSQ I/O Ground Separate ground for I/O circuitry; improves noise immunity between core and interface domains
CK / CK# Differential Clock Input LV-CMOS differential pair accepting 166 MHz DDR clock; defines all timing windows for CA and data transfers
CS# Chip Select Input Active-low enable for HyperBus transactions; deassertion terminates ongoing burst and enters standby
RWDS Bidirectional Strobe/Mask Output during CA phase (indicates refresh latency); input/output during data phase (read strobe/write mask)
DQ[7:0] Bi-directional Data Bus 8-bit DDR data path carrying command/address and read/write data; requires controlled impedance routing
RESET# Hardware Reset Input Asynchronous active-low reset that clears internal state and forces re-initialization sequence

Key Features

Feature Design Value
Self-Refresh DRAM Core On-die refresh controller eliminates host CPU overhead and external refresh circuitry, simplifying firmware design
DCARS Timing Architecture Phase-shifted RWDS ensures reliable data capture at 166 MHz by centering strobe edges within read data eye
Configurable Burst Length Four wrapped burst options (16–128 bytes) plus linear mode allow runtime optimization for cache vs. streaming workloads
Low-Signal-Count Interface 12-pin HyperBus replaces 30+ pin parallel interfaces, reducing PCB layer count and EMI in high-density designs
Deep Power Down Mode 20 µA quiescent current at 1.8 V enables multi-week battery life in always-on sensor nodes with retained RAM state

Applications

Automotive Instrument Clusters Industrial HMI Displays

Use Scenario: Real-time rendering of animated gauges and warning overlays in digital dashboards with <100 ms UI response.

IC Role / Device Role / Timing Role: High-bandwidth frame buffer memory interfaced directly to MCU's HyperBus port, eliminating external SDRAM controller complexity.

Use Value: 333 MBps throughput sustains 1080p@60fps pixel streaming while DCARS timing ensures robust read integrity across temperature and voltage variation.

Use Scenario: Local storage of vector-based UI assets and touch gesture buffers in factory-floor HMIs exposed to wide ambient temperature swings.

IC Role / Device Role / Timing Role: PSRAM-emulating memory providing static-like access semantics to ARM Cortex-M7 with integrated HyperBus.

Use Value: Self-refresh capability maintains display state during MCU sleep modes; 20 µA deep power down extends uptime in energy-harvested edge devices.

Smart Home Gateway UI Medical Portable Monitor

Use Scenario: Concurrent handling of Zigbee/Z-Wave protocol stacks and responsive touchscreen UI on resource-constrained gateways.

IC Role / Device Role / Timing Role: Shared memory resource for RTOS task stacks and GUI bitmap cache, accessed via deterministic HyperBus timing.

Use Value: Wrapped burst mode accelerates cache-line fetches for GUI rendering; 12-pin interface reduces BOM cost versus QSPI Flash + SRAM combo.

Use Scenario: Buffering of real-time ECG waveform samples and annotation metadata in handheld diagnostic tools with strict EMC requirements.

IC Role / Device Role / Timing Role: Low-EMI memory subsystem using differential CK/CK# and single-ended RWDS to meet IEC 60601-1 emissions limits.

Use Value: FBGA-24 package enables compact 4-layer PCB layout; DCARS eliminates setup/hold violations in noisy medical environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus-compatible memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S27KS0641DABHI020 Same 64 Mb density and HyperBus interface, but rated for industrial temperature range (−40 °C to +85 °C) vs. commercial (0 °C to +70 °C) Required for extended-temperature deployments where ambient exceeds 70 °C, e.g., under-hood automotive or outdoor kiosks Select when thermal environment exceeds commercial spec; identical pinout and timing, no firmware changes needed
S70KL1281DABHI020 128 Mb (16 MB) dual-die stack in same FBGA-24 package; doubles capacity while retaining HyperBus compatibility and DCARS Used when application demands >8 MB contiguous memory, such as high-resolution medical imaging buffers or multi-language UI asset storage Choose for capacity scaling; shares layout footprint but requires updated memory map and initialization code for larger address space

Compared with S27KS0641DABHI020, this part trades extended temperature support for lower cost in commercial environments; compared with S70KL1281DABHI020, it offers half the capacity at reduced power and cost-ideal for cost-sensitive, thermally benign embedded UIs.

Availability

S27KL0641DABHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI displays, smart home gateway UIs, and medical portable monitors requiring stable component supply and long-term lifecycle assurance.

Supply support for S27KL0641DABHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for automotive, industrial, and IoT markets.

This device belongs to Infineon's HyperRAM™ product line, engineered to replace parallel SRAM and low-density SDRAM in MCU-based systems where pin count, power, and ease of integration are critical constraints.

FAQ

Is S27KL0641DABHB023 pin-compatible with other HyperRAM devices in the S27K/S70K family?

Yes, all S27KL/S27KS and S70KL/S70KS devices share identical 24-ball FBGA pinouts and HyperBus signal assignments. Mechanical and electrical compatibility is maintained across densities and voltage grades, enabling drop-in replacement for capacity or voltage scaling without PCB redesign.

Does this device require external refresh circuitry or host software intervention for memory maintenance?

No. The S27KL0641DABHB023 integrates autonomous self-refresh logic that executes internal refresh cycles without host involvement. The HyperBus interface presents it as a pseudo-static RAM, eliminating refresh registers, timers, or periodic interrupt servicing in the MCU firmware.

What is the role of RWDS during write transactions, and how does it differ from its function in read mode?

During writes, RWDS acts as a byte mask: HIGH disables writing to the corresponding DQ byte, LOW enables it. During reads, RWDS serves as an edge-aligned strobe synchronized to read data. In both cases, RWDS originates from the device during command/address phase to signal initial latency requirements.

Can DCARS timing be disabled or configured differently for legacy system compatibility?

No. DCARS is a fixed hardware feature of the HyperRAM architecture and cannot be disabled. However, the device supports standard HyperBus timing modes without DCARS in earlier revisions; this part implements DCARS as a mandatory enhancement for reliable 166 MHz operation and requires matching host controller support.

S27KL0641DABHB023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
40 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0641DABHB023 FAQ

1.How can I place an order for S27KL0641DABHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0641DABHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0641DABHB023 reliable?

The price and inventory of S27KL0641DABHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0641DABHB023 is usually 5 days.

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4.How is shipping managed for S27KL0641DABHB023?

S27KL0641DABHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0641DABHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0641DABHB023?

For technical support, including S27KL0641DABHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0641DABHB023 requirements.

6.How does Aetrix verify that S27KL0641DABHB023 is sourced from the original manufacturer or authorized distributors?

All S27KL0641DABHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0641DABHB023 meets industry standards.

7.What is the process for return or replacement of S27KL0641DABHB023?

All S27KL0641DABHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0641DABHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0641DABHB023 part is unused and in its original packaging.

Return procedure for S27KL0641DABHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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