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Infineon Technologies S27KL0641DABHI023

Part No.:
S27KL0641DABHI023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0641DABHI023.pdf
Description:
IC PSRAM 64MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,719

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Product details

Overview

S27KL0641DABHI023 from Infineon Technologies (formerly Cypress) is a 64 Mb (8 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, operating at 1.8 V or 3.0 V I/O supply. It delivers up to 333 MBps throughput via DDR interface with 166 MHz clock (1.8 V), features 8-bit DQ bus, bidirectional RWDS strobe/mask, and integrated refresh control - enabling PSRAM-like ease of use in embedded graphics and application processors.

For engineers reviewing the S27KL0641DABHI023 datasheet, S27KL0641DABHI023 pinout, S27KL0641DABHI023 application, or S27KL0641DABHI023 equivalent, key selection criteria include DCARS timing compliance, RWDS phase-shifted read strobe behavior, configurable burst length (16–128 bytes), deep power-down current (20 µA @ 1.8 V), and FBGA-24 package compatibility with HyperBus host controllers.

Technical Context

This device implements a low-signal-count DDR interface with only 11 signals (3.0 V mode) or 12 signals (1.8 V mode), including differential clock (CK/CK#), chip select (CS#), 8-bit data bus (DQ[7:0]), and bidirectional RWDS. Its internal refresh logic eliminates host-managed refresh cycles, presenting as pseudo-static RAM while retaining DRAM density and cost advantages.

The DDR Center-Aligned Read Strobe (DCARS) function uses a phase-shifted clock derived from CK to align RWDS transitions within the read data eye, ensuring reliable source-synchronous capture. Burst transactions support wrapped (cache-line fill) or linear (graphics buffer) modes, selected per transaction, with initial latency dynamically indicated by RWDS during command-address transfer.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mb (8 MB) - supports mid-tier display buffers and firmware overlay storage without external memory controller complexity
Interface TypeHyperBus DDR - 11–12 signal count enables compact PCB routing vs. parallel NOR/NAND or LPDDR
Max Throughput333 MBps at 166 MHz / 1.8 V - sufficient for 1080p UI frame buffering with sub-100 ns effective access latency
Burst Config16/32/64/128-byte wrapped or linear bursts - matches cache line sizes and streaming DMA requirements
Deep Power Down20 µA @ 1.8 V - enables ultra-low standby in battery-backed HMI and IoT edge nodes
Package24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) - compatible with standard SMT assembly and thermal pad-less layout
Supply OptionsVCC/VCCQ = 1.8 V or 3.0 V - allows direct interfacing with 1.8 V SoCs or legacy 3.0 V microcontrollers

Pinout & Package

24-ball FBGA package (5 mm × 5 mm, 0.8 mm pitch) with exposed thermal pad not required; RoHS-compliant, lead-free finish.

Pin/TerminalCircuit RoleDesign Meaning
CK, CK#Differential clock inputSource-synchronous timing reference for all DDR transfers; CK# enables skew-insensitive capture
CS#Chip selectActive-low enable for command/address/data transactions; deassertion terminates burst and enters standby
RWDSBidirectional read/write data strobe/maskOutputs initial latency indicator and read strobe; inputs write mask - eliminates separate DQM signal
DQ[7:0]8-bit bidirectional data busCarries command, address, and data in time-multiplexed DDR fashion; LV-CMOS compatible
VCC, VCCQCore and I/O suppliesSeparate 1.8 V or 3.0 V rails allow independent voltage scaling for core logic and interface drivers
VSS, VSSQGround returnsDedicated analog/digital ground pins reduce switching noise coupling into RWDS and clock paths
RESET#Hardware reset inputAsynchronous active-low reset that clears internal state and forces power-on initialization sequence

Key Features

FeatureDesign Value
Self-refresh DRAM architectureEliminates host refresh overhead - appears as PSRAM to system software while retaining DRAM density/cost
DCARS timing implementationPhase-shifted RWDS ensures optimal setup/hold margins for read data capture at 166 MHz DDR
Configurable output drive strengthReduces signal integrity issues on long traces or high-capacitance buses without external termination
Dynamic burst type selectionPer-transaction wrapped/linear burst choice enables mixed workloads: cache fills + sequential streaming
Low-power Deep Power Down mode20 µA quiescent current at 1.8 V enables >1-year battery life in always-on sensor hubs

Applications

Automotive Instrument ClustersIndustrial HMI Panels

Use Scenario: Real-time rendering of animated gauges and ADAS alerts on 7–10 inch TFT displays.

IC Role / Device Role / Timing Role: Frame buffer memory interfaced directly to MCU's HyperBus controller, providing low-latency pixel data access.

Use Value: 333 MBps bandwidth sustains 60 Hz updates for 1280×720 RGB888 content with zero CPU intervention for refresh management.

Use Scenario: Local GUI execution on ARM Cortex-A7-based panel PCs with capacitive touch and serial peripherals.

IC Role / Device Role / Timing Role: Code XIP and overlay RAM for Qt-based applications, decoupling from main DDR to reduce bus contention.

Use Value: Wrapped burst mode aligns with 64-byte cache lines, cutting instruction fetch latency by 35% vs. discrete SRAM.

Smart Home Gateway UIMedical Patient Monitor Displays

Use Scenario: Local web UI rendering and firmware OTA staging on resource-constrained Linux gateways.

IC Role / Device Role / Timing Role: Dual-role memory: executes boot code from HyperBus XIP region and buffers compressed UI assets.

Use Value: Deep power-down current (20 µA) extends battery backup runtime during AC loss without compromising wake-up responsiveness.

Use Scenario: High-reliability waveform display with guaranteed update timing in Class II medical devices.

IC Role / Device Role / Timing Role: Dedicated display buffer isolated from main system DRAM to prevent timing jitter from background tasks.

Use Value: Deterministic 36 ns tACC and RWDS-aligned reads ensure sub-frame timing compliance for ECG/SpO₂ overlays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar self-refresh DRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS66WV51216EDALL-15BLIParallel async SRAM interface (48-pin TSOP), no DDR or self-refresh; 512 K × 16 organizationLacks burst capability and HyperBus integration; requires full address/data bus and external refresh logicSelect only if legacy design lacks HyperBus support and prioritizes deterministic timing over density
S27KS0641DABHI020Same die, identical electrical specs, but automotive-grade (AEC-Q100 Grade 2, –40°C to +105°C)Validated for under-hood and dashboard environments; same pinout and timing, higher screening costChoose for automotive production; S27KL0641DABHI023 is industrial-grade (–40°C to +85°C)

Compared with IS66WV51216EDALL-15BLI, S27KL0641DABHI023 reduces signal count by >60% and eliminates refresh firmware, while delivering 16× more density; versus S27KS0641DABHI020, it trades automotive qualification for lower cost in non-automotive industrial use cases.

Availability

S27KL0641DABHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI panels, smart home gateway UIs, and medical patient monitor displays requiring stable component supply and long-term manufacturability.

Supply support for S27KL0641DABHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.

This part belongs to the HyperRAM™ product line, designed to bridge the gap between SRAM simplicity and DRAM density for embedded systems needing high-bandwidth, low-pin-count external memory.

FAQ

What is the difference between S27KL0641DABHI023 and S27KS0641DABHI020?

S27KL0641DABHI023 is rated for industrial temperature (–40°C to +85°C) and standard reliability screening, while S27KS0641DABHI020 meets AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C) with extended HTOL and ESD testing. Both share identical pinout, timing, and electrical specs.

Does this device require external refresh circuitry?

No. S27KL0641DABHI023 integrates autonomous self-refresh logic that maintains data retention without host intervention. The HyperBus interface abstracts DRAM complexity, presenting behavior identical to PSRAM - no refresh commands or scheduling are needed from the host controller.

Can RWDS be used as a dedicated read strobe only?

No. RWDS is inherently bidirectional: it outputs initial latency and read strobe during reads, and inputs write mask during writes. Its dual function eliminates the need for a separate DQM signal, but requires host logic to switch direction per transaction phase - a requirement defined in the HyperBus specification.

Is DCARS timing mandatory for correct operation at 166 MHz?

Yes. At 166 MHz (1.8 V), DCARS - using a phase-shifted clock to align RWDS edges within the read data eye - is required to meet setup/hold timing. The device does not support non-DCARS read capture at maximum speed; omitting DCARS implementation risks data corruption in high-speed read bursts.

S27KL0641DABHI023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
40 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0641DABHI023 FAQ

1.How can I place an order for S27KL0641DABHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0641DABHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0641DABHI023 reliable?

The price and inventory of S27KL0641DABHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0641DABHI023 is usually 5 days.

3.What payment methods are accepted for S27KL0641DABHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0641DABHI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KL0641DABHI023?

S27KL0641DABHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0641DABHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0641DABHI023?

For technical support, including S27KL0641DABHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0641DABHI023 requirements.

6.How does Aetrix verify that S27KL0641DABHI023 is sourced from the original manufacturer or authorized distributors?

All S27KL0641DABHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0641DABHI023 meets industry standards.

7.What is the process for return or replacement of S27KL0641DABHI023?

All S27KL0641DABHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0641DABHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0641DABHI023 part is unused and in its original packaging.

Return procedure for S27KL0641DABHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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