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Infineon Technologies S27KL0641DABHV020

Part No.:
S27KL0641DABHV020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0641DABHV020.pdf
Description:
IC PSRAM 64MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,982

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Product details

Overview

S27KL0641DABHV020 from Infineon Technologies (formerly Cypress) is a 64 Mb (8 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and bidirectional RWDS strobe/mask. It delivers 333 MBps throughput at 166 MHz DDR, features DCARS timing for read data eye alignment, and supports wrapped/linear burst lengths up to 128 bytes. Used in embedded graphics buffers and real-time display controllers where low pin count and high bandwidth are critical.

For engineers reviewing the S27KL0641DABHV020 datasheet, S27KL0641DABHV020 pinout, S27KL0641DABHV020 application, or S27KL0641DABHV020 equivalent, key selection criteria include HyperBus interface compatibility, 1.8 V I/O voltage requirement, 24-ball FBGA package footprint, DCARS-enabled read strobe timing, and support for dynamic burst type selection per transaction.

Technical Context

This device implements a pseudo-static RAM architecture using internally managed self-refresh DRAM cells, eliminating host refresh overhead while maintaining DRAM density and cost advantages. Its HyperBus interface uses only 12 signals - including CK/CK#, CS#, RWDS, and DQ[7:0] - enabling high-speed DDR transfers without complex routing.

The DCARS (DDR Center-Aligned Read Strobe) function shifts RWDS phase relative to CK during reads to center strobe edges within the data eye, improving timing margin at 166 MHz. Burst configuration (wrapped/linear/hybrid) and output drive strength are register-programmable, allowing runtime adaptation to system signal integrity requirements.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 Mbit (8 MB) - provides sufficient frame buffer capacity for HD display pipelines without external memory controller complexity
Interface Standard HyperBus v2.0 - low-signal-count (12-pin), DDR interface with command/address/data multiplexed on DQ[7:0]
Max Data Rate 333 MBps at 166 MHz DDR - enables real-time streaming of 1080p video data with minimal latency
I/O Voltage 1.8 V nominal - compatible with modern low-voltage SoCs and reduces power consumption vs. 3.0 V variants
Burst Length Configurable: 16/32/64/128 bytes - supports cache-line fill (wrapped) and linear image transfer in same system
Package 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) - compact footprint suitable for space-constrained display modules
Power Modes Deep Power Down: 20 µA @ 1.8 V - enables ultra-low standby current in battery-backed UI subsystems

Pinout & Package

24-ball FBGA package with 5 × 5 array, 0.8 mm ball pitch, and standard JEDEC MO-279 footprint. Pin assignments conform to HyperBus v2.0 specification for 1.8 V operation with differential clock.

Pin/Terminal Circuit Role Design Meaning
CK / CK# Differential clock input Source-synchronous timing reference for all DDR transfers; required for DCARS phase alignment
CS# Chip select (active low) Enables command/address transfer and initiates all transactions; deassertion terminates burst
RWDS Bidirectional read/write data strobe/mask Indicates initial latency during CA phase; acts as edge-aligned read strobe or write mask during data phase
DQ[7:0] 8-bit bidirectional data bus Carries command, address, and DDR data; center-aligned with CK for writes, edge-aligned with RWDS for reads
VCC / VCCQ Core and I/O supply VCC = 1.8 V core; VCCQ = 1.8 V I/O - separate supplies allow independent power domain control
RESET# Hardware reset input Asynchronous active-low reset that clears internal state and forces power-on initialization sequence

Key Features

Feature Design Value
Self-refresh DRAM core Eliminates host refresh management overhead while retaining DRAM density and cost efficiency
DCARS timing mode Phase-shifts RWDS relative to CK to center strobe transitions in read data eye at 166 MHz
Per-transaction burst control Allows dynamic selection of wrapped, linear, or hybrid burst type without reconfiguration delay
Configurable drive strength Adjusts DQ/RWDS output drive to match PCB trace impedance and reduce EMI in high-speed layouts
Low-power Deep Power Down Reduces current to 20 µA at 1.8 V - extends battery life in always-on display subsystems

Applications

Automotive Digital Instrument Clusters Industrial HMI Display Controllers

Use Scenario: Real-time rendering of vehicle speed, navigation, and ADAS alerts on TFT-LCD clusters with <100 ms latency.

IC Role / Device Role / Timing Role: Frame buffer memory interfaced directly to MCU's HyperBus port; provides deterministic access timing via DCARS-aligned RWDS.

Use Value: Eliminates need for external SDRAM controller logic and reduces BOM count by integrating refresh management.

Use Scenario: Local GUI rendering on factory-floor HMIs with 720p resolution and touch-responsive overlays.

IC Role / Device Role / Timing Role: High-bandwidth PSRAM acting as primary graphics buffer; burst-length flexibility supports both icon caching (wrapped) and image streaming (linear).

Use Value: 333 MBps throughput sustains 60 fps updates without frame tearing or CPU bottlenecks.

Smart Home Hub UI Subsystems Medical Patient Monitor Displays

Use Scenario: Always-on status dashboard with animated icons and live sensor graphs on 4.3″ capacitive displays.

IC Role / Device Role / Timing Role: Low-power memory supporting Deep Power Down between UI updates; wake-up latency <50 µs after CS# assertion.

Use Value: 20 µA deep sleep current enables multi-year battery operation in portable smart hubs.

Use Scenario: Critical waveform display (ECG, SpO₂) requiring glitch-free, jitter-free pixel updates in clinical environments.

IC Role / Device Role / Timing Role: Deterministic-access memory with fixed tACC (36 ns at 166 MHz) ensuring consistent render timing across temperature range.

Use Value: Predictable access latency prevents visual artifacts during life-critical real-time monitoring.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus-compatible PSRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
S27KL0641DABHV010 Same 64 Mb density and FBGA-24 package, but rated for industrial temperature range (–40°C to +85°C) vs. automotive (–40°C to +105°C) Lacks AEC-Q100 qualification; not suitable for under-hood automotive use Select for cost-sensitive industrial HMIs where extended temperature is unnecessary
S27KS0641DABHV020 Identical electrical specs and pinout, but uses single-ended CK instead of differential CK/CK#; requires different clock driver design Lower EMI sensitivity but reduced noise immunity at 166 MHz; unsuitable for high-noise automotive environments Choose when board layout constraints prevent differential clock routing or when EMI is not critical

Compared with S27KL0641DABHV020, the S27KL0641DABHV010 trades automotive qualification for lower cost in industrial settings, while the S27KS0641DABHV020 replaces differential clocking with single-ended to simplify clock generation - both require validation of timing margins and thermal behavior in final system integration.

Availability

S27KL0641DABHV020 is available at Aetrix Electronics and suitable for automotive digital instrument clusters, industrial HMI display controllers, smart home hub UI subsystems, and medical patient monitor displays requiring stable component supply and long-term lifecycle support.

Supply support for S27KL0641DABHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong focus on reliability and industrial-grade performance.

This part belongs to Infineon's HyperRAM™ product line, designed specifically to replace parallel NOR/NAND and legacy PSRAM in bandwidth-constrained embedded systems needing simple, high-speed, low-pin-count memory expansion.

FAQ

Is S27KL0641DABHV020 pin-compatible with S27KS0641DABHV020?

No - although both share the same 24-ball FBGA package and DQ/RWDS/CS#/VCC/VCCQ/RESET# pin assignments, S27KL0641DABHV020 requires differential CK/CK# inputs, whereas S27KS0641DABHV020 uses single-ended CK only. The CK# ball on the KL variant is functional and must be driven; leaving it unconnected or tied off violates AC timing specifications and may cause transaction failures at 166 MHz.

What is the minimum initial latency required for read transactions at 166 MHz?

At 166 MHz with 1.8 V supply, the minimum initial latency is one clock cycle (1×), indicated by RWDS LOW during the command-address phase. However, if internal refresh is pending, RWDS goes HIGH to signal two-cycle (2×) latency. Host firmware must sample RWDS during CA transfer and insert the corresponding wait state before reading first data word - this is mandatory for timing compliance and data integrity.

Can S27KL0641DABHV020 operate with 3.0 V I/O voltage?

No - S27KL0641DABHV020 is specified exclusively for 1.8 V VCCQ (I/O supply). The "L" in the part number denotes 1.8 V I/O; 3.0 V variants use "S" suffix (e.g., S27KS0641). Applying 3.0 V to VCCQ exceeds absolute maximum ratings (2.05 V), risking immediate latch-up or latent reliability degradation. System design must ensure strict 1.8 V regulation on VCCQ.

Does this device support hardware reset recovery without power cycling?

Yes - asserting RESET# (active low, min pulse width 100 ns) forces a full internal initialization sequence identical to power-on reset, including register reload, DLL calibration, and memory array precharge. This allows safe recovery from bus lockup or configuration errors without removing VCC/VCCQ. After RESET# release, the device enters standby mode and is ready for new CS#-initiated transactions within 100 µs.

S27KL0641DABHV020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
40 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0641DABHV020 FAQ

1.How can I place an order for S27KL0641DABHV020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0641DABHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0641DABHV020 reliable?

The price and inventory of S27KL0641DABHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0641DABHV020 is usually 5 days.

3.What payment methods are accepted for S27KL0641DABHV020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0641DABHV020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KL0641DABHV020?

S27KL0641DABHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0641DABHV020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0641DABHV020?

For technical support, including S27KL0641DABHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0641DABHV020 requirements.

6.How does Aetrix verify that S27KL0641DABHV020 is sourced from the original manufacturer or authorized distributors?

All S27KL0641DABHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0641DABHV020 meets industry standards.

7.What is the process for return or replacement of S27KL0641DABHV020?

All S27KL0641DABHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0641DABHV020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0641DABHV020 part is unused and in its original packaging.

Return procedure for S27KL0641DABHV020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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