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Infineon Technologies S27KL0642DPBHV020

Part No.:
S27KL0642DPBHV020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0642DPBHV020.pdf
Description:
IC PSRAM 64MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,966

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Product details

Overview

S27KL0642DPBHV020 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz clock rate and 400 MBps throughput. It features bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), partial/full array refresh, and industrial-plus temperature range (–40°C to +105°C) in 24-ball FBGA package. Used in embedded systems requiring low-pin-count high-bandwidth memory expansion without host-managed refresh.

For engineers reviewing the S27KL0642DPBHV020 datasheet, S27KL0642DPBHV020 pinout, S27KL0642DPBHV020 application, or S27KL0642DPBHV020 equivalent, key selection factors include HYPERBUS™ timing compliance, RWDS phase alignment for read eye optimization, DCARS support, hybrid sleep/deep power-down entry latency, and VCC/VCCQ voltage configuration compatibility with host controller I/O domains.

Technical Context

This PSRAM integrates DRAM array with on-die refresh control and HYPERBUS™ physical layer logic, eliminating external refresh management. Its DDR interface uses center-aligned command/address and edge-aligned data on DQ[7:0], with RWDS serving as both read-data strobe and write-data mask - dynamically driven by internal timing logic based on transaction type and latency state.

The device implements configurable output drive strength, linear/wrapped burst modes, and optional differential clock (CK/CK#) support. DCARS functionality shifts RWDS phase by one clock cycle during reads to center transitions within the data eye, directly improving timing margin at 200 MHz operation under varying signal integrity conditions.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB), organized as 8,388,608 × 8-bit for byte-accessible storage expansion
Interface StandardHYPERRAM™-compliant HYPERBUS™ DDR interface with 11–12 signal count (CS#, CK/CK#, RWDS, DQ[7:0])
Max Clock Rate200 MHz DDR - enables 400 MBps peak bandwidth with dual-edge data capture on DQ bus
Burst LengthConfigurable wrapped bursts: 16/32/64/128 bytes - determines minimum transaction size and refresh window availability
Access LatencytACC ≤ 35 ns at 1.8 V - defines minimum time from CS# assertion to first valid read data on DQ
Power ModesHybrid Sleep (μA-range standby) and Deep Power-Down (12–15 µA) - reduce system-level idle power without losing data retention
Operating Temp–40°C to +105°C (Industrial Plus grade) - qualified for extended-temperature embedded control and automotive infotainment

Pinout & Package

Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select (active-low)Asserted to initiate all HYPERBUS™ transactions; deassertion terminates burst and enables internal refresh
CK / CK#Differential clock input (optional)When enabled, provides noise-immune clocking; single-ended CK mode uses CK only, CK# floated or tied
RWDSBidirectional read/write strobeOutput during reads (data-valid indicator); input during writes (byte mask for DQ[7:0]); phase-shifted in DCARS mode
DQ[7:0]8-bit bidirectional data busCarries command/address (first 6 bytes), then read/write data; LV-CMOS compatible at 1.8 V or 3.0 V VCCQ
RESET#Hardware reset (active-low)Forces device into known state; resets internal registers and aborts ongoing transactions
VCC / VCCQCore & I/O supplySeparate 1.8 V or 3.0 V supplies - allows independent voltage scaling for array vs. interface logic

Key Features

FeatureDesign Value
Self-refresh DRAM architectureEliminates host-side refresh scheduling; retains data indefinitely in standby without CPU intervention
DCARS-enabled RWDS timingShifts RWDS edge by one clock cycle during reads to maximize setup/hold margin in high-speed PCB layouts
Configurable output drive strengthAdjusts DQ/RWDS slew rate to match trace impedance and reduce EMI in dense routing environments
Partial array refreshRefreshes only 1/8, 1/4, or 1/2 of array per cycle - reduces current spikes and improves real-time determinism
Hybrid Sleep modeRetains data while cutting I/O power and disabling clock receivers - faster wake-up than Deep Power-Down

Applications

Automotive Instrument ClustersIndustrial HMI Panels

Use Scenario: Real-time rendering of vector graphics and animated UI elements in digital dashboards with limited MCU SRAM.

IC Role / Device Role / Timing Role: Off-chip PSRAM providing 8 MB frame buffer and overlay storage, interfaced via HYPERBUS™ to MCU's integrated controller.

Use Value: Enables 60 Hz GUI updates with <35 ns access latency and deterministic refresh behavior - no frame tearing from host-managed DRAM cycles.

Use Scenario: Local data logging and recipe storage in programmable logic controllers with isolated Ethernet and CAN interfaces.

IC Role / Device Role / Timing Role: Non-volatile-capable memory extension for firmware overlays and buffered sensor history, accessed over HYPERBUS™ with hybrid sleep between writes.

Use Value: Achieves <15 µA deep power-down current and –40°C to +105°C operation - supports uncooled cabinet deployment with battery-backed retention.

Edge AI Inference AcceleratorsMedical Imaging Front-Ends

Use Scenario: Temporary activation tensor storage for microNPU co-processors running quantized CNN models on resource-constrained SoCs.

IC Role / Device Role / Timing Role: High-throughput memory buffer feeding convolution engines via 400 MBps HYPERBUS™ bursts, synchronized using DCARS-aligned RWDS.

Use Value: Delivers sustained 200 MHz DDR bandwidth with phase-adjusted RWDS - eliminates read-data sampling errors across temperature and voltage corners.

Use Scenario: Pixel buffering and histogram accumulation in portable ultrasound probe electronics with strict EMI limits.

IC Role / Device Role / Timing Role: Low-pin-count memory expansion for FPGA-based image pipeline, using single-ended CK and configurable drive strength to meet CISPR-22 Class B emissions.

Use Value: Reduces signal count vs. parallel NOR/SDRAM while maintaining <35 ns tACC - simplifies 4-layer PCB layout without sacrificing real-time pixel throughput.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KS0642DPBHV020Same die, identical electrical specs and pinout - rebranded part pre-Infineon acquisition; identical DCARS, RWDS, and refresh behaviorNo functional difference; legacy design-in continuity for Cypress-originated BOMsSelect when maintaining legacy sourcing or cross-checking against Cypress documentation archives
ISSI IS66WV12816EBLL-200B1Parallel SRAM (not PSRAM), 128K × 16, 200 MHz async interface - no refresh, no RWDS, 48-pin TSOPHigher pin count, no DDR, no low-power modes - suitable only where timing predictability outweighs density and power constraintsChoose only if system lacks HYPERBUS™ controller support and requires zero-latency random access without burst dependency

Compared with S27KL0642DPBHV020, the Cypress rebrand offers identical performance and drop-in compatibility, while the ISSI SRAM trades bandwidth efficiency and power savings for absolute timing determinism and interface simplicity - making it viable only in non-HYPERBUS™ designs with ample board space.

Availability

S27KL0642DPBHV020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, edge AI accelerators, and medical imaging front-ends requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S27KL0642DPBHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This device belongs to the HYPERRAM™ product line, designed specifically to replace parallel NOR/PSRAM in microcontroller-based systems where pin count, power, and bandwidth must be optimized simultaneously - targeting cost-sensitive, thermally constrained embedded applications.

FAQ

What is the function of the RWDS signal in read versus write operations?

RWDS serves as a bidirectional strobe: during reads, it is driven by the S27KL0642DPBHV020 to indicate valid data timing on DQ[7:0]; during writes, it is driven by the host as a byte mask to selectively update individual DQ lines. Its phase is adjustable via DCARS to align with read data eye center, improving timing margin at 200 MHz.

Does this device require external refresh circuitry or host software intervention?

No. The S27KL0642DPBHV020 contains fully autonomous on-die refresh logic that executes partial or full array refreshes during idle periods or transaction gaps. Host only needs to observe maximum burst length limits and initial latency indications - no refresh commands or timers are required.

Can the device operate with only single-ended clock (CK), or is differential clock (CK/CK#) mandatory?

Single-ended clock operation is fully supported: CK is used as the primary clock input, and CK# may be left unconnected or tied to VSS. Differential mode is optional and improves noise immunity in electrically noisy environments but is not required for specification compliance or basic functionality.

How does Hybrid Sleep mode differ from Deep Power-Down in terms of wake-up latency and data retention?

Hybrid Sleep retains data while disabling clock receivers and reducing I/O power, enabling wake-up in sub-microsecond time with no initialization delay. Deep Power-Down cuts deeper power (12–15 µA) but requires ~100 µs wake-up and internal reinitialization before next access - both retain data across the full –40°C to +105°C range.

S27KL0642DPBHV020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
HyperBus
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
36ns
Access Time:
36 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0642DPBHV020 FAQ

1.How can I place an order for S27KL0642DPBHV020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0642DPBHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0642DPBHV020 reliable?

The price and inventory of S27KL0642DPBHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0642DPBHV020 is usually 5 days.

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S27KL0642DPBHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0642DPBHV020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0642DPBHV020?

For technical support, including S27KL0642DPBHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0642DPBHV020 requirements.

6.How does Aetrix verify that S27KL0642DPBHV020 is sourced from the original manufacturer or authorized distributors?

All S27KL0642DPBHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0642DPBHV020 meets industry standards.

7.What is the process for return or replacement of S27KL0642DPBHV020?

All S27KL0642DPBHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0642DPBHV020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0642DPBHV020 part is unused and in its original packaging.

Return procedure for S27KL0642DPBHV020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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