Infineon Technologies S27KL0642GABHB020
- Part No.:
- S27KL0642GABHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KL0642GABHB020.pdf
- Description:
- IC PSRAM 64MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,754
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Product details
Overview
S27KL0642GABHB020 from Infineon Technologies is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz clock rate and 400 MBps throughput. It features 8-bit DQ bus, bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), and industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used in embedded systems requiring low-pin-count, high-bandwidth external memory with no host-managed refresh.
For engineers reviewing the S27KL0642GABHB020 datasheet, S27KL0642GABHB020 pinout, S27KL0642GABHB020 application, or S27KL0642GABHB020 equivalent, key selection factors include HYPERBUS™ timing compliance, RWDS phase alignment for read eye optimization, partial array refresh configuration, hybrid sleep mode current (360 µA standby), and FBGA-24 mechanical compatibility with space-constrained PCB layouts.
Technical Context
This PSRAM integrates on-die refresh control logic that autonomously schedules DRAM array refreshes during idle cycles, eliminating host intervention. Its HYPERBUS™ interface uses only 11–12 signals (including optional CK#) and transfers command/address/data over the same 8-bit DQ bus using time-multiplexed protocol.
The RWDS signal serves dual roles: as a read-data strobe edge-aligned with CK during reads, and as a write-data mask input during writes; optional DCARS mode shifts RWDS phase by one-half clock to center-align transitions within the read data eye for improved timing margin at 200 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MByte) pseudo-static RAM with self-refresh capability |
| Interface Standard | HYPERRAM™ compliant HYPERBUS™ DDR interface - 11 signal minimum (CK, CS#, RWDS, DQ[7:0]) |
| Max Clock Rate | 200 MHz DDR - enables 400 MBps peak bandwidth with dual-edge data capture |
| Burst Length | Configurable wrapped bursts: 16/32/64/128 bytes - supports cache-line-aligned access patterns |
| Power Modes | Hybrid Sleep (360 µA @ 105°C) and Deep Power-Down (15 µA @ 105°C) - reduces system-level idle power |
| Operating Voltage | 1.8 V or 3.0 V VCC/VCCQ - dual-voltage support enables interoperability with mixed-supply SoCs |
| Temperature Range | Industrial grade: –40°C to +85°C - qualified for extended-temperature embedded control applications |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[7:0] | Bi-directional data bus | Time-multiplexed command/address/data transfer; DDR-capable I/O with LV-CMOS levels |
| CK / CK# | Differential clock inputs (optional) | Enables precise timing capture; CK# required for DCARS mode and jitter-sensitive designs |
| RWDS | Bi-directional read/write data strobe | Indicates initial latency before read data; acts as write mask during writes; phase-shifted in DCARS mode |
| CS# | Chip select input | Active-low enable for all transactions; deassertion terminates ongoing burst and triggers internal state cleanup |
| RESET# | Hardware reset input | Asynchronous active-low reset that clears internal registers and forces device into known power-on state |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates host refresh overhead - appears as SRAM to processor while retaining DRAM density/cost advantage |
| HYPERBUS™ low-pin-count interface | Reduces PCB routing complexity: only 11–12 signals vs. 30+ for parallel NOR/NAND or LPDDR |
| DCARS (DDR Center-Aligned Read Strobe) | Shifts RWDS edge by ½ clock cycle to maximize setup/hold margin in high-speed read windows |
| Configurable output drive strength | Allows tuning of signal integrity for varying trace length/load - critical for noise-sensitive automotive ECUs |
| Partial array refresh | Supports 1/8, 1/4, or 1/2 array refresh - enables fine-grained power management during low-activity periods |
Applications
| Automotive Instrument Clusters | Industrial HMI Panels |
|---|---|
Use Scenario: Real-time rendering of vector graphics and animated UI elements in digital dashboards with <100 ms latency requirements. IC Role / Device Role / Timing Role: External frame buffer memory interfaced to MCU's HYPERBUS™ controller; provides burst-aligned pixel data delivery synchronized to display refresh rate. Use Value: 400 MBps bandwidth sustains 1280×720@60 Hz RGB888 rendering without frame buffering bottlenecks; hybrid sleep mode cuts background power during static screen states. | Use Scenario: Local storage of firmware images, configuration tables, and log buffers in programmable logic controllers (PLCs) with limited board space. IC Role / Device Role / Timing Role: Non-volatile code/data extension memory mapped via MCU's external bus interface; accessed via linear burst reads for fast boot-time image loading. Use Value: 24-ball FBGA footprint fits tight layout constraints; industrial temperature rating ensures reliability in uncooled cabinet environments; deep power-down mode (<15 µA) extends battery backup runtime. |
| Edge AI Inference Accelerators | Medical Imaging Gateways |
Use Scenario: On-device inference acceleration using lightweight CNN models where intermediate tensor buffers exceed on-chip SRAM capacity. IC Role / Device Role / Timing Role: High-bandwidth off-chip working memory for weight/activation storage; accessed via wrapped bursts aligned to convolution kernel tile sizes. Use Value: Configurable 32/64-byte bursts match typical neural network tile dimensions; RWDS-driven latency signaling prevents pipeline stalls during dynamic refresh arbitration. | Use Scenario: DICOM image preprocessing pipeline in portable ultrasound devices requiring real-time pixel scaling, filtering, and compression prior to wireless transmission. IC Role / Device Role / Timing Role: Dual-port accessible memory bank shared between imaging ASIC and ARM Cortex-A processor; used for ping-pong buffering of raw RF data frames. Use Value: 200 MHz DDR timing meets 12-bit ADC sampling rates up to 100 MSPS; AEC-Q100 Grade 2 qualification (–40°C to +105°C) satisfies medical thermal safety margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0641GABHI020 | Same die, but -40°C to +105°C (V-grade); identical electrical specs and pinout | Required for extended-temperature industrial or under-hood automotive use | Select when ambient operating temperature exceeds +85°C |
| Infineon S27KS0642GABHB020 | Same 64Mb HYPERRAM™, but with 1.2 V VCCQ option (vs. 1.8/3.0 V); otherwise identical timing and package | Needed for ultra-low-power SoC interfaces with 1.2 V I/O domains | Select when host MCU I/O voltage is fixed at 1.2 V and level-shifting is undesirable |
Compared with S27KL0642GABHB020, the S27KL0641GABHI020 extends thermal range without changing power or timing behavior, while the S27KS0642GABHB020 adds 1.2 V I/O compatibility at the cost of reduced voltage flexibility - both retain identical HYPERBUS™ transaction structure and RWDS timing behavior.
Availability
S27KL0642GABHB020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI panels, edge AI accelerators, and medical imaging gateways requiring stable component supply across multi-year production cycles.
Supply support for S27KL0642GABHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The HYPERRAM™ product line delivers high-density, low-pin-count external memory optimized for microcontroller-based systems needing SRAM-like simplicity with DRAM economics - targeting cost-sensitive, space-constrained embedded applications.
FAQ
Is S27KL0642GABHB020 pin-compatible with other HYPERRAM™ devices?
Yes - it shares identical 24-ball FBGA footprint and signal mapping with all S27KL/S27KS series devices, including S27KL0641GABHI020 and S27KS0642GABHB020. Mechanical and electrical pin assignments are fully aligned per Infineon's HYPERBUS™ specification, enabling drop-in replacement where voltage and temperature grades match.
Does this device require external refresh circuitry?
No - S27KL0642GABHB020 contains integrated self-refresh logic that autonomously manages DRAM array refresh during idle periods. The host processor accesses it as a pseudo-static RAM; no refresh commands, timers, or scheduling routines are needed in firmware.
What is the role of the RWDS signal during write operations?
During writes, RWDS functions as an input write-data mask: each bit controls whether the corresponding DQ[7:0] byte is written to the memory array. This enables selective byte programming without read-modify-write cycles, reducing latency and power in partial-update scenarios like register overlays or packet headers.
Can DCARS mode be disabled after power-up?
Yes - DCARS is controlled by Configuration Register 1 (CR1) bit [3]. It can be enabled or disabled dynamically via HYPERBUS™ register write commands. Disabling DCARS reverts RWDS to standard edge-aligned operation, useful for debugging or legacy host controller compatibility where phase-shifted strobes are unsupported.
S27KL0642GABHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KL0642GABHB020 FAQ
1.How can I place an order for S27KL0642GABHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KL0642GABHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KL0642GABHB020 reliable?
The price and inventory of S27KL0642GABHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0642GABHB020 is usually 5 days.
3.What payment methods are accepted for S27KL0642GABHB020?
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S27KL0642GABHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KL0642GABHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KL0642GABHB020?
For technical support, including S27KL0642GABHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0642GABHB020 requirements.
6.How does Aetrix verify that S27KL0642GABHB020 is sourced from the original manufacturer or authorized distributors?
All S27KL0642GABHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0642GABHB020 meets industry standards.
7.What is the process for return or replacement of S27KL0642GABHB020?
All S27KL0642GABHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0642GABHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KL0642GABHB020 part is unused and in its original packaging.
Return procedure for S27KL0642GABHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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