Infineon Technologies S27KL0642GABHB023
- Part No.:
- S27KL0642GABHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KL0642GABHB023.pdf
- Description:
- IC PSRAM 64MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,476
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Product details
Overview
S27KL0642GABHB023 from Infineon Technologies is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V/3.0 V, supporting DDR transfers up to 200 MHz and delivering up to 400 MBps throughput in a 24-ball FBGA package for industrial temperature range (–40°C to +85°C). It integrates on-die refresh control, eliminating host-managed refresh, and uses RWDS for read/write strobe/mask timing with configurable burst lengths (16–128 bytes).
For engineers reviewing the S27KL0642GABHB023 datasheet, S27KL0642GABHB023 pinout, S27KL0642GABHB023 application, or S27KL0642GABHB023 equivalent, key selection criteria include HYPERBUS™ compatibility, self-refresh capability, DCARS support, hybrid sleep/deep power-down modes, and industrial-grade thermal performance.
Technical Context
The device implements a DDR HYPERBUS™ interface with 11–12 signal lines (including optional CK#/CK differential clock), using DQ[7:0] for multiplexed command/address/data and RWDS as a bidirectional strobe/mask signal synchronized to CK. Internal logic manages partial/full array refresh autonomously during idle cycles.
It supports linear and wrapped burst modes (16/32/64/128-byte), hybrid burst (wrapped + linear), configurable output drive strength, and DCARS-where RWDS is phase-shifted by one clock edge to center-align transitions within the read data eye for improved timing margin at high speed.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB), organized as 8,388,608 × 8-bit for byte-aligned access |
| Interface Standard | HYPERRAM™ with HYPERBUS™ protocol - low-pin-count DDR interface using shared DQ bus for CA/data |
| Max Clock Rate | 200 MHz DDR - enables 400 MBps peak bandwidth with dual-edge sampling on DQ[7:0] |
| Burst Length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) - balances latency vs. throughput per transaction |
| Power Modes | Hybrid Sleep (low-leakage active retention) and Deep Power-Down (12 µA @ 2.0 V, 105°C) |
| Operating Temp | Industrial grade: –40°C to +85°C - validated for extended embedded control and display subsystems |
| Supply Voltages | VCC/VCCQ = 1.8 V ±0.15 V or 3.0 V ±0.3 V - dual-voltage I/O flexibility with separate array/I/O rails |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for all transactions; deassertion terminates current operation and initiates internal refresh if needed |
| CK / CK# | Clock Input | Single-ended (CK only) or differential (CK/CK#) reference for DDR timing; determines data capture edges on DQ/RWDS |
| RWDS | Bidirectional Strobe/Mask | Output during reads (indicates start of valid data and serves as read strobe); input during writes (acts as byte mask) |
| DQ[7:0] | Bi-directional Data Bus | Time-multiplexed command/address/data lane; LV-CMOS compatible; supports 8-bit parallel transfers per half-cycle |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and forces re-initialization sequence on next CS# assertion |
Key Features
| Feature | Design Value |
|---|---|
| Self-Refresh DRAM Core | On-die refresh controller eliminates host CPU overhead and timing-critical refresh scheduling |
| DCARS Timing Enhancement | RWDS phase-shifted by one CK edge to center its transition in read data eye - improves setup/hold margin at 200 MHz |
| Configurable Drive Strength | Programmable output driver strength on DQ/RWDS to optimize signal integrity across varying PCB trace lengths and loads |
| Partial Array Refresh | Supports 1/8, 1/4, 1/2 refresh segments - reduces power during partial-access workloads without full-array overhead |
| Hybrid Burst Mode | Combines wrapped burst (for cache-line efficiency) followed by linear burst (for streaming) - optimizes mixed-access patterns |
Applications
| Automotive Instrument Clusters | Industrial HMI Displays |
|---|---|
Use Scenario: Real-time rendering of vector graphics and animated UI elements in digital dashboards with limited MCU memory bandwidth. IC Role / Device Role / Timing Role: PSRAM serving as frame buffer and overlay memory, interfaced via HYPERBUS™ to reduce pin count versus parallel NOR/SDRAM. Use Value: 400 MBps throughput sustains 1080p@60fps rendering; self-refresh avoids CPU intervention during display idle periods. | Use Scenario: Local GUI storage and dynamic content caching in programmable logic controllers with integrated touchscreens. IC Role / Device Role / Timing Role: High-bandwidth, low-latency external memory supplementing microcontroller SRAM for real-time HMI updates. Use Value: Hybrid sleep mode cuts standby current to 330 µA, enabling energy-efficient always-on display wake-up responsiveness. |
| Edge AI Sensor Gateways | Medical Patient Monitoring UIs |
Use Scenario: Buffering time-series sensor fusion data and inference model weights in compact gateway devices with constrained PCB area. IC Role / Device Role / Timing Role: Low-pin-count, high-throughput memory enabling efficient DMA transfers between Cortex-M7 and neural network accelerators. Use Value: 24-ball FBGA footprint saves >40% board space vs. standard x16 SDRAM packages while maintaining DDR bandwidth. | Use Scenario: Storing waveform overlays, alarm history, and multi-language UI assets in portable patient monitors requiring long battery life. IC Role / Device Role / Timing Role: Non-volatile-equivalent memory with deterministic access latency for safety-critical UI rendering paths. Use Value: Deep power-down draws only 12 µA at 2.0 V, extending battery runtime without compromising boot-time memory readiness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KS0642GABHB020 | Same die, identical electrical specs and pinout; differs only in ordering code suffix and AEC-Q100 qualification status (Grade 2 vs Grade 3) | Qualified for automotive AEC-Q100 Grade 2 (–40°C to +105°C); S27KL0642GABHB023 is Grade 3 (–40°C to +85°C) | Select S27KS0642GABHB020 for under-hood or higher-temp automotive use; otherwise S27KL0642GABHB023 suffices for cabin/in-dash systems |
| ISSI IS66WV12816EBLL-150B3LI | Parallel SRAM (x16, 150 MHz async), no self-refresh, no HYPERBUS™, larger 48-pin TSOP package | Requires 22+ address/data/control pins vs. 11–12 for HYPERBUS™; lacks power-saving modes and burst flexibility | Choose only when legacy parallel interface is mandated and board space/power are not constraints |
Compared with S27KS0642GABHB020, the S27KL0642GABHB023 offers identical functionality at lower thermal grade but reduced cost; versus IS66WV12816EBLL-150B3LI, it delivers 2.6× higher bandwidth in <50% pin count and enables dynamic power scaling unattainable with async SRAM.
Availability
S27KL0642GABHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI displays, and edge AI sensor gateways requiring stable component supply, long-term lifecycle support, and industrial temperature compliance.
Supply support for S27KL0642GABHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This part belongs to the HYPERRAM™ product line, designed specifically to replace parallel NOR/PSRAM in bandwidth-constrained, space-limited embedded systems where DDR complexity and pin count must be minimized without sacrificing throughput.
FAQ
Does S27KL0642GABHB023 require external refresh control from the host processor?
No. The device contains an integrated self-refresh controller that autonomously manages DRAM array refresh during idle cycles. The host only issues standard HYPERBUS™ read/write commands; no refresh timing or scheduling is required. This behavior makes it functionally equivalent to static RAM from the host's perspective, simplifying firmware design and reducing CPU load.
What is the purpose of the RWDS signal in read versus write operations?
In read operations, RWDS is driven by the S27KL0642GABHB023 to indicate initial access latency and serve as a read data strobe aligned with DQ transitions. In write operations, RWDS is driven by the host as a byte mask signal - each bit controls whether the corresponding DQ byte is written, enabling partial-word updates without read-modify-write cycles.
Can S27KL0642GABHB023 operate with both 1.8 V and 3.0 V supplies simultaneously?
No. VCC and VCCQ must be supplied at the same nominal voltage: either 1.8 V ±0.15 V or 3.0 V ±0.3 V. Mixing voltages violates absolute maximum ratings and may cause functional failure or accelerated wear. The device does not support split-rail operation; both rails must track within specification during power-up and steady-state.
Is DCARS supported on all S27KL0642GABHB023 units, or is it option-dependent?
Yes, DCARS (DDR Center-Aligned Read Strobe) is a standard feature enabled by default in all S27KL0642GABHB023 units. It is implemented in silicon and requires no external configuration - the RWDS signal is automatically phase-shifted by one CK edge during read transactions to center its transition in the data eye, improving timing margin at 200 MHz operation.
S27KL0642GABHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KL0642GABHB023 FAQ
1.How can I place an order for S27KL0642GABHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KL0642GABHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KL0642GABHB023 reliable?
The price and inventory of S27KL0642GABHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0642GABHB023 is usually 5 days.
3.What payment methods are accepted for S27KL0642GABHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0642GABHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KL0642GABHB023?
S27KL0642GABHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KL0642GABHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KL0642GABHB023?
For technical support, including S27KL0642GABHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0642GABHB023 requirements.
6.How does Aetrix verify that S27KL0642GABHB023 is sourced from the original manufacturer or authorized distributors?
All S27KL0642GABHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0642GABHB023 meets industry standards.
7.What is the process for return or replacement of S27KL0642GABHB023?
All S27KL0642GABHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0642GABHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KL0642GABHB023 part is unused and in its original packaging.
Return procedure for S27KL0642GABHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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