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Infineon Technologies S27KL0642GABHI023

Part No.:
S27KL0642GABHI023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0642GABHI023.pdf
Description:
IC PSRAM 64MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,716

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Product details

Overview

S27KL0642GABHI023 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V/3.0 V VCC/VCCQ, supporting 200 MHz DDR clocking, 400 MBps data throughput, and industrial temperature range (–40°C to +85°C). It functions as a high-bandwidth, low-pin-count external memory buffer in microcontroller-based embedded systems requiring seamless SRAM-like access to DRAM density.

For engineers reviewing the S27KL0642GABHI023 datasheet, S27KL0642GABHI023 pinout, S27KL0642GABHI023 application, or S27KL0642GABHI023 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-driven read/write strobe synchronization, configurable burst lengths (16–128 bytes), hybrid sleep/deep power-down modes, and FBGA-24 package compatibility with space-constrained PCB layouts.

Technical Context

The device implements a self-refresh DRAM core with integrated refresh control logic, eliminating host-managed refresh cycles and presenting static RAM semantics to the controller. Its HYPERBUS™ interface uses 8-bit DQ lines with bidirectional RWDS for latency signaling and data strobing - not a standard SPI or parallel NOR interface.

It supports both single-ended (11-signal) and optional differential clock (12-signal) configurations, with DCARS mode enabling phase-shifted RWDS alignment to maximize read data eye margin at 200 MHz. Command/address and data share the same DQ[7:0] bus under time-multiplexed protocol.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB), organized as 8,388,608 × 8 bits - supports compact code/data storage without external address latching.
Clock RateUp to 200 MHz DDR - delivers 400 MBps peak bandwidth on 8-bit bus, matching mid-range MCU external memory needs.
Interface StandardHYPERRAM™ / HYPERBUS™ - 11–12 signal count, LV-CMOS compatible, eliminates wide parallel buses and reduces routing complexity.
Burst LengthConfigurable wrapped bursts: 16/32/64/128 bytes - enables cache-line-aligned transfers and deterministic latency for real-time firmware.
Power ModesHybrid Sleep (330 µA @ 2.0 V) and Deep Power-Down (12 µA @ 2.0 V) - extends battery life in always-on edge nodes.
Operating TempIndustrial grade: –40°C to +85°C - qualified for deployment in industrial HMIs, PLCs, and gateway controllers without derating.
Access TimetACC ≤ 35 ns at 1.8 V - ensures sub-100 ns effective read latency with initial access overhead, critical for interrupt response.

Pinout & Package

Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, suitable for automated SMT assembly and thermal management in dense layouts.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VCCQCore & I/O supplySeparate 1.8 V or 3.0 V supplies allow independent voltage scaling for logic and interface, reducing noise coupling.
CK / CK#Differential clock inputEnables precise edge-aligned sampling of command/address/data; CK# required only when DCARS or jitter-sensitive operation is used.
CS#Chip selectActive-low enable for all transactions; deassertion terminates ongoing burst and triggers internal state cleanup.
RWDSBidirectional strobeIndicates refresh latency start, serves as read data strobe (edge-aligned), and write mask during writes - no separate RD/WR control needed.
DQ[7:0]Time-multiplexed I/OCarries command/address (first 6 bytes) then read/write data - reduces pin count vs. parallel interfaces while maintaining bandwidth.
RESET#Hardware resetAsynchronous active-low signal that clears internal state and forces reinitialization - essential for safe cold boot recovery.

Key Features

FeatureDesign Value
Self-refresh DRAM coreEliminates host refresh overhead and timing constraints - appears as SRAM to software, simplifying driver development.
HYPERBUS™ interface11–12 signal count replaces 24+ pin parallel interfaces - cuts PCB layer count and improves signal integrity in high-speed routing.
DCARS modePhase-shifts RWDS by one-half clock cycle to center strobe transitions within read data eye - increases timing margin at 200 MHz.
Configurable drive strengthAdjustable output drive on DQ/RWDS pins - optimizes signal integrity across varying trace lengths and load capacitance.
Partial array refreshSupports 1/8, 1/4, 1/2 refresh segments - reduces average current during idle periods compared to full-array refresh.

Applications

Industrial HMI Display BufferAutomotive ADAS Sensor Cache

Use Scenario: Stores frame buffers and GUI assets for ARM Cortex-M7-based human-machine interface panels with TFT-LCD drivers.

IC Role / Device Role / Timing Role: External PSRAM acting as low-latency, high-bandwidth memory extension - replaces slower QSPI Flash + SRAM combo.

Use Value: Enables 60 Hz full-screen updates using linear 128-byte bursts and maintains <100 ns effective read latency via RWDS-synchronized access.

Use Scenario: Buffers raw image data from 1–2 MP CMOS sensors in parking camera modules before JPEG compression.

IC Role / Device Role / Timing Role: High-throughput streaming memory with deterministic burst timing - absorbs sensor line-rate bursts without DMA stalls.

Use Value: Delivers 400 MBps sustained write throughput using wrapped 64-byte bursts, synchronized to sensor pixel clock via CK input.

Smart Gateway Protocol StackMedical IoT Edge Node

Use Scenario: Holds TLS handshake context, packet queues, and OTA update staging area in Linux-based industrial gateways.

IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by CPU and crypto accelerator over AXI/AHB bridge.

Use Value: Supports concurrent read/write with hybrid sleep mode - reduces idle power to 330 µA while retaining data for rapid wake-up.

Use Scenario: Stores real-time ECG waveform samples and algorithm intermediate results in portable patient monitors.

IC Role / Device Role / Timing Role: Low-power, AEC-Q100 grade memory providing SRAM-equivalent access to battery-powered devices.

Use Value: Achieves 12 µA deep power-down current at 2.0 V - extends single-cell Li-ion runtime beyond 72 hours in standby mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KS0642GABHI020Same die, identical electrical specs and pinout - rebranded part post-Cypress acquisition by Infineon.No functional difference; legacy ordering channel only.Select only if sourcing from pre-acquisition inventory or distributor stock with original Cypress branding.
ISSI IS66WV12816EBLL-70BLIParallel async SRAM (128K × 16), 70 ns access, no self-refresh - requires wider bus (32+ pins) and external refresh management.Lacks HYPERBUS™ bandwidth efficiency and low-pin-count advantage; higher board cost and layout complexity.Choose only for legacy designs requiring pin-compatible drop-in replacement with zero firmware changes.

Compared with S27KS0642GABHI020 (identical function), and IS66WV12816EBLL-70BLI (wider bus, no self-refresh), the S27KL0642GABHI023 uniquely balances DDR bandwidth, ultra-low pin count, and SRAM-like usability - making it optimal for new designs targeting MCU external memory expansion with minimal footprint and power budget.

Availability

S27KL0642GABHI023 is available at Aetrix Electronics and suitable for industrial HMIs, automotive ADAS modules, and medical IoT edge nodes requiring stable component supply, long-lifecycle support, and AEC-Q100 grade assurance.

Supply support for S27KL0642GABHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This device belongs to the HYPERRAM™ product line, designed specifically to replace parallel SRAM and QSPI Flash+RAM combinations in resource-constrained embedded systems needing high bandwidth and low pin count.

FAQ

Does S27KL0642GABHI023 require external refresh circuitry?

No. The device integrates self-refresh logic that autonomously manages DRAM array refresh during idle periods. The host processor sees only SRAM-like behavior - no refresh commands, timers, or scheduling are required. Refresh occurs transparently between transactions, triggered by internal counters and signaled via RWDS latency pulses at transaction start.

What is the role of the RWDS signal in read versus write operations?

In read operations, RWDS is driven by the device as a read data strobe, edge-aligned with DQ transitions to indicate valid data windows. In write operations, RWDS is driven by the host as a write data mask, controlling which byte lanes accept incoming data. During idle or refresh, RWDS remains high-impedance or tri-stated per HYPERBUS™ protocol rules.

Can S27KL0642GABHI023 operate with only single-ended clock (CK), or is CK# mandatory?

CK# is optional. The device supports single-ended clocking (CK only) in standard mode, using 11-signal HYPERBUS™ configuration. CK# is required only when enabling DCARS mode or when system-level jitter requirements demand differential clock rejection - in which case the full 12-signal interface must be implemented.

How does burst length configuration affect timing and power consumption?

Longer bursts (e.g., 128 bytes) improve sequential throughput but increase transaction duration, delaying internal refresh opportunities and raising average current. Shorter bursts (e.g., 16 bytes) reduce latency variance and allow more frequent refresh, lowering peak current. Configuration is register-controlled and persists across power cycles via nonvolatile settings stored in on-die configuration registers.

S27KL0642GABHI023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0642GABHI023 FAQ

1.How can I place an order for S27KL0642GABHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0642GABHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0642GABHI023 reliable?

The price and inventory of S27KL0642GABHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0642GABHI023 is usually 5 days.

3.What payment methods are accepted for S27KL0642GABHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0642GABHI023 transactions.

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S27KL0642GABHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0642GABHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0642GABHI023?

For technical support, including S27KL0642GABHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0642GABHI023 requirements.

6.How does Aetrix verify that S27KL0642GABHI023 is sourced from the original manufacturer or authorized distributors?

All S27KL0642GABHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0642GABHI023 meets industry standards.

7.What is the process for return or replacement of S27KL0642GABHI023?

All S27KL0642GABHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0642GABHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0642GABHI023 part is unused and in its original packaging.

Return procedure for S27KL0642GABHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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