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Infineon Technologies S27KL0642GABHV020

Part No.:
S27KL0642GABHV020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0642GABHV020.pdf
Description:
IC PSRAM 64MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,089

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Product details

Overview

S27KL0642GABHV020 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting up to 200 MHz DDR clock rate and delivering 400 MBps data throughput. It features 8-bit DQ bus, bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), and industrial-plus temperature range (–40°C to +105°C) in 24-ball FBGA package. Used in embedded systems requiring low-pin-count, high-bandwidth memory expansion without external refresh management.

For engineers reviewing the S27KL0642GABHV020 datasheet, S27KL0642GABHV020 pinout, S27KL0642GABHV020 application, or S27KL0642GABHV020 equivalent, key selection factors include HYPERBUS™ timing compliance, RWDS phase alignment for read eye optimization, partial array refresh configuration, DCARS support, and AEC-Q100 Grade 2 qualification for automotive infotainment and ADAS host processors.

Technical Context

This PSRAM integrates on-die refresh control logic that autonomously manages DRAM array refresh during idle cycles, eliminating host-side refresh overhead. Its HYPERBUS™ interface uses only 11–12 signals (including optional CK#), with command/address and data multiplexed over DQ[7:0], enabling compact PCB routing.

The device supports both single-ended and differential clocking, and RWDS serves dual roles: as initial latency indicator at transaction start and as edge-aligned read strobe or write mask during transfers. DCARS mode provides a second-phase-shifted clock to center RWDS transitions within the read data eye, improving timing margin at 200 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB), organized as 8,388,608 × 8 bits - enables direct replacement of legacy SRAM/PSRAM in memory-mapped peripherals.
Interface StandardHYPERRAM™ compliant HYPERBUS™ - low-pin-count DDR interface with command/address/data multiplexing on DQ[7:0].
Max Clock Rate200 MHz DDR - delivers 400 MBps peak bandwidth; requires precise CK/RWDS phase alignment per DCARS timing spec.
Burst LengthConfigurable wrapped bursts: 16/32/64/128 bytes - matches typical cache line or DMA transfer sizes in MCU-based systems.
Power ModesHybrid Sleep and Deep Power-Down - reduces standby current to 12 µA (1.8 V) or 15 µA (3.0 V) at 105°C for battery-sensitive applications.
Operating Temp–40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood automotive and industrial edge controllers.
Package24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - compatible with standard reflow profiles and supports high-density layout.

Pinout & Package

24-ball FBGA (5 × 5 array, 0.8 mm pitch) with ball-out optimized for signal integrity and thermal dissipation in space-constrained designs. Pin functions validated per Infineon datasheet 002-24692 Rev. *I.

Pin/TerminalCircuit RoleDesign Meaning
DQ[7:0]Data I/O busMultiplexed command/address/data path; LV-CMOS compatible; supports DDR transfers on both CK edges.
CK / CK#Clock inputDifferential clock pair (optional); defines timing reference for all CA and data transfers; enables DCARS phase shift.
RWDSBidirectional strobeIndicates initial access latency; acts as read data strobe (edge-aligned) or write mask (input); phase-shifted in DCARS mode.
CS#Chip selectActive-low enable for transaction initiation; deassertion terminates ongoing read/write and triggers internal state cleanup.
RESET#Hardware resetAsynchronous active-low signal forcing device into known power-on-reset state; required before initialization sequence.

Key Features

FeatureDesign Value
Self-refresh DRAM coreOn-die refresh controller eliminates host CPU intervention; maintains data retention during sleep modes without software overhead.
HYPERBUS™ interface11–12 signal count (vs. 40+ for parallel NOR/NAND) reduces PCB layer count and routing complexity in MCU-based systems.
DCARS timing modeSecond-phase-shifted RWDS clock improves setup/hold margin by centering strobe edge in read data eye at 200 MHz.
Configurable drive strengthAdjustable output drive on DQ/RWDS allows optimization for trace length and noise immunity without external termination.
Partial array refreshRefresh granularity selectable as 1/8, 1/4, or 1/2 array - reduces average current during light traffic vs. full-array refresh.

Applications

Automotive Infotainment Head UnitIndustrial PLC HMI Display Buffer

Use Scenario: High-resolution GUI rendering with frequent frame buffer updates and limited board space.

IC Role / Device Role / Timing Role: PSRAM acting as off-chip frame buffer and code execution memory for ARM Cortex-A MCU.

Use Value: 400 MBps bandwidth sustains 1080p @ 60 Hz display refresh; 24-ball FBGA fits tight layout; AEC-Q100 Grade 2 ensures reliability at 105°C ambient.

Use Scenario: Real-time visualization of sensor data and control status on capacitive touch HMI panel.

IC Role / Device Role / Timing Role: Memory-mapped PSRAM providing low-latency access to graphics assets and dynamic UI elements.

Use Value: Configurable burst lengths align with DMA engine packet size; Hybrid Sleep mode cuts idle power to <15 µA for fanless enclosure thermal management.

Edge AI Sensor HubMedical Portable Diagnostic Device

Use Scenario: Local inference acceleration using microNPU with onboard feature buffer storage.

IC Role / Device Role / Timing Role: High-speed memory extension for neural network weight caching and intermediate tensor storage.

Use Value: RWDS-driven latency signaling enables deterministic transaction scheduling; DCARS mode ensures robust timing at 200 MHz across voltage/temp corners.

Use Scenario: Battery-powered ultrasound or ECG device requiring fast waveform buffering and low-power standby.

IC Role / Device Role / Timing Role: PSRAM serving as acquisition buffer and firmware overlay memory for ARM Cortex-M7 processor.

Use Value: Deep Power-Down current of 12 µA (1.8 V) extends battery life; industrial-plus temp rating supports clinical environment operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KS0642GABHV020Same die, identical electrical specs and pinout; rebranded post-Infineon acquisition - functionally identical.No difference; drop-in replacement with same HYPERBUS™ timing, DCARS, and power modes.Select when sourcing from legacy Cypress-distributed channels or for BOM continuity in pre-acquisition designs.
ISSI IS66WV1288GBLL-150B3LIParallel SRAM (not PSRAM); 128Mb, 15 ns async access; no self-refresh, no HYPERBUS™, 44-pin TSOP.Requires full address/data bus and external refresh logic; higher pin count and static power draw.Only suitable if system lacks HYPERBUS™ controller support and prioritizes zero-latency random access over density and pin efficiency.

Compared with S27KS0642GABHV020, the Infineon part offers identical performance but benefits from unified post-merger technical support; versus ISSI's parallel SRAM, it trades deterministic latency for 3× lower pin count, 10× lower standby power, and integrated refresh - critical for modern embedded SoC interfaces.

Availability

S27KL0642GABHV020 is available at Aetrix Electronics and suitable for automotive infotainment head units, industrial PLC HMIs, and edge AI sensor hubs requiring stable component supply, AEC-Q100 qualification, and high-bandwidth low-pin-count memory expansion.

Supply support for S27KL0642GABHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This device belongs to the HYPERRAM™ product line, designed specifically to replace parallel SRAM and NOR flash in memory-mapped MCU and SoC applications where high bandwidth, low pin count, and embedded self-refresh are essential.

FAQ

What is the minimum initial access latency for a read transaction at 200 MHz?

The minimum initial access latency is one clock cycle (1× tCK), indicated by a low-level pulse on RWDS at transaction start. This latency may extend to two cycles (2× tCK) if internal refresh is pending, as signaled by a high-level RWDS pulse. The host must sample RWDS before reading DQ to determine actual latency count before data valid window begins.

Does S27KL0642GABHV020 require external refresh circuitry?

No. The device contains fully autonomous on-die refresh logic that executes partial or full array refreshes during idle periods without host intervention. The host treats it as pseudo-static memory - no refresh commands, timers, or scheduling are needed, simplifying firmware and reducing CPU load.

Can DCARS mode be disabled to use standard RWDS timing?

Yes. DCARS is an optional feature enabled via Configuration Register 1 (bit CR1[2]). When disabled, RWDS operates in standard edge-aligned mode synchronized to CK. Enabling DCARS introduces a fixed 90° phase shift to RWDS relative to CK, which must be accounted for in controller timing calibration.

What are the voltage requirements for VCC and VCCQ in industrial-plus operation?

For Industrial Plus (–40°C to +105°C), the device supports two configurations: 1.8 V ±0.15 V for both VCC (array) and VCCQ (I/O), or 3.0 V ±0.3 V for both supplies. Mixed-voltage operation (e.g., 1.8 V VCC / 3.0 V VCCQ) is not supported per datasheet Section 9.4.2.

S27KL0642GABHV020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0642GABHV020 FAQ

1.How can I place an order for S27KL0642GABHV020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0642GABHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0642GABHV020 reliable?

The price and inventory of S27KL0642GABHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0642GABHV020 is usually 5 days.

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S27KL0642GABHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0642GABHV020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0642GABHV020?

For technical support, including S27KL0642GABHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0642GABHV020 requirements.

6.How does Aetrix verify that S27KL0642GABHV020 is sourced from the original manufacturer or authorized distributors?

All S27KL0642GABHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0642GABHV020 meets industry standards.

7.What is the process for return or replacement of S27KL0642GABHV020?

All S27KL0642GABHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0642GABHV020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0642GABHV020 part is unused and in its original packaging.

Return procedure for S27KL0642GABHV020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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