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Infineon Technologies S27KL0642GABHV023

Part No.:
S27KL0642GABHV023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0642GABHV023.pdf
Description:
IC PSRAM 64MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,076

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Product details

Overview

S27KL0642GABHV023 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz and 400 MBps throughput. It features bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), partial/full array refresh, and industrial-plus temperature range (−40°C to +105°C) in 24-ball FBGA package. Used in embedded microcontroller systems requiring low-pin-count, high-bandwidth external memory with no host-managed refresh.

For engineers reviewing the S27KL0642GABHV023 datasheet, S27KL0642GABHV023 pinout, S27KL0642GABHV023 application, or S27KL0642GABHV023 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS phase alignment for read capture, DCARS support, burst configuration register settings, and power mode sequencing for hybrid sleep/deep power-down entry.

Technical Context

This PSRAM implements a self-refresh DRAM core with integrated refresh controller, eliminating host-side refresh management. Its HYPERBUS™ interface uses 8-bit DQ lines with single- or differential clock (CK/CK#), CS#, RESET#, and bidirectional RWDS - all LV-CMOS compatible. Command/address and data share the same DQ bus in time-multiplexed fashion.

Read transactions begin with six CA bytes followed by initial access latency (tACC = 35 ns max), then DDR-aligned data transfers. RWDS serves dual roles: output indicating refresh latency at transaction start and read-data strobe edge-aligned with DQ; input as write mask during writes. Optional DCARS shifts RWDS phase to center it within the read data eye.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density64 Mbit (8 MB), organized as 8,388,608 × 8 bits - supports byte-wide access without external width conversion.
Interface standardHYPERRAM™ / HYPERBUS™ - 11–12 signal DDR interface (CS#, CK/CK#, RWDS, DQ[7:0], RESET#) enabling compact PCB routing.
Max clock rate200 MHz DDR - delivers 400 MBps peak bandwidth; requires precise setup/hold timing on DQ relative to RWDS/CK.
Burst lengthConfigurable wrapped bursts: 16/32/64/128 bytes - determines minimum transaction size and internal row activation efficiency.
Access latencytACC ≤ 35 ns - defines earliest valid data sampling point after command completion; impacts real-time response in MCU boot/code fetch.
Power modesHybrid Sleep (μA standby) and Deep Power-Down (12–15 µA) - enable dynamic power scaling in battery-constrained edge devices.
Operating temp−40°C to +105°C (Industrial Plus grade) - qualified for under-hood automotive and industrial control environments.

Pinout & Package

24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, with ball map matching JEDEC MO-270CA. Package supports automated optical inspection and fine-pitch reflow.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for all HYPERBUS™ transactions; deassertion terminates ongoing burst and initiates auto-precharge.
CK / CK#Clock InputDifferential clock pair (optional); defines DDR edge timing for DQ and RWDS sampling; single-ended CK supported.
RWDSBidirectional StrobeOutput: indicates refresh latency start and reads data edge; Input: masks write data per byte during write cycles.
DQ[7:0]Data I/OTime-multiplexed bus for command/address (6 bytes) and read/write data (DDR, 8-bit wide); LV-CMOS 1.8 V/3.0 V compatible.
RESET#Hardware ResetAsynchronous active-low reset that clears internal state and forces device into known power-on initialization sequence.

Key Features

FeatureDesign Value
Self-refresh DRAM coreEliminates host refresh overhead; internal logic autonomously schedules partial/full array refresh during idle intervals.
DCARS supportEnables programmable RWDS phase shift to center strobe transition in read data eye - critical for timing margin at 200 MHz.
Configurable drive strengthAdjustable DQ/RWDS output drive reduces signal integrity issues on long traces or multi-drop buses.
Hybrid Sleep modeRetains memory contents while reducing current to ~330 µA (1.8 V) - ideal for periodic sensor wake-up architectures.
HYPERBUS™ command encoding6-byte CA field supports extended addressing, burst type selection, and register access - enables flexible memory mapping and configuration.

Applications

Automotive Instrument ClustersIndustrial HMI Panels

Use Scenario: Real-time rendering of vector graphics and firmware overlays in digital dashboards with MCU-based display controllers.

IC Role / Device Role / Timing Role: External PSRAM providing frame buffer storage with deterministic 35 ns access latency and seamless burst streaming over HYPERBUS™.

Use Value: Enables 800×480 @ 60 Hz UI updates using only 11 signal pins, avoiding parallel NOR/NAND complexity and reducing BOM count.

Use Scenario: Local code execution and configuration storage in programmable logic controllers with ARM Cortex-M7 hosts.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory extension supporting XIP (execute-in-place) with minimal wait states.

Use Value: Delivers 400 MBps throughput at 200 MHz DDR, allowing full firmware image load in <100 ms while maintaining AEC-Q100 Grade 2 qualification.

Smart Home GatewaysMedical Patient Monitors

Use Scenario: Concurrent handling of Zigbee/Z-Wave protocol stacks, TLS encryption buffers, and local web server assets.

IC Role / Device Role / Timing Role: Shared memory resource accessed by dual-core MCU subsystems via HYPERBUS™ arbitration.

Use Value: Configurable burst lengths (16–128 bytes) optimize cache line fills and packet buffering without over-fetching or fragmentation.

Use Scenario: Buffering high-resolution ECG waveform samples and DICOM thumbnail images prior to wireless transmission.

IC Role / Device Role / Timing Role: Low-power PSRAM operating in Hybrid Sleep between acquisition bursts to extend battery life.

Use Value: 12 µA deep power-down current at 1.8 V enables >12-month standby on coin-cell batteries while retaining volatile context.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KS0642GABHV020Same die, identical electrical specs and pinout; differs only in ordering code suffix and traceability marking.No functional difference; both qualified for Industrial Plus (−40°C to +105°C) and AEC-Q100 Grade 2.Select based on distributor stock availability and lot traceability requirements.
Infineon S27KL0641GABHV02064Mb variant with fixed 1.8 V VCC/VCCQ only (no 3.0 V option); lacks DCARS functionality.Not suitable where RWDS phase tuning is required for marginal board layouts or higher-speed timing closure.Choose only if system operates strictly at 1.8 V and does not require DCARS for read timing margin.

Compared with S27KL0641GABHV020, this part adds DCARS and dual-voltage support, enabling broader system compatibility; versus S27KS0642GABHV020, it offers identical performance but distinct manufacturing traceability for OEM audit compliance.

Availability

S27KL0642GABHV023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI panels, smart home gateways, and medical patient monitors requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S27KL0642GABHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and wafer fabrication facilities.

This device belongs to the HYPERRAM™ family - designed specifically to replace parallel NOR/NAND flash in MCU-based systems needing fast, low-pin-count, pseudo-static memory with no refresh overhead.

FAQ

What is the purpose of the RWDS signal in S27KL0642GABHV023?

RWDS is a bidirectional strobe used to indicate initial refresh latency at transaction start and to synchronize read data capture. During writes, it acts as a byte-enable mask. Its edge alignment with DQ is critical for timing closure, and optional DCARS allows phase shifting to center RWDS in the read data eye for robustness at 200 MHz.

Does S27KL0642GABHV023 require external refresh management?

No. The device integrates autonomous self-refresh logic that schedules partial or full array refreshes during idle periods. The host processor interacts with it as a static RAM - no refresh commands, counters, or timing windows are required in software or firmware.

Can S27KL0642GABHV023 operate at both 1.8 V and 3.0 V simultaneously?

No. VCC and VCCQ must be supplied at the same nominal voltage: either 1.8 V ±0.15 V or 3.0 V ±0.3 V. Mixing voltages violates absolute maximum ratings and may cause functional failure or accelerated wear-out.

How is burst length configured in S27KL0642GABHV023?

Burst length is set via Configuration Register 0 (CR0), bit [1:0], which selects wrapped burst sizes of 16, 32, 64, or 128 bytes. Linear burst is also supported. The setting persists across power cycles and is applied automatically on each transaction initiation.

S27KL0642GABHV023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0642GABHV023 FAQ

1.How can I place an order for S27KL0642GABHV023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0642GABHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0642GABHV023 reliable?

The price and inventory of S27KL0642GABHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0642GABHV023 is usually 5 days.

3.What payment methods are accepted for S27KL0642GABHV023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0642GABHV023 transactions.

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4.How is shipping managed for S27KL0642GABHV023?

S27KL0642GABHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0642GABHV023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0642GABHV023?

For technical support, including S27KL0642GABHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0642GABHV023 requirements.

6.How does Aetrix verify that S27KL0642GABHV023 is sourced from the original manufacturer or authorized distributors?

All S27KL0642GABHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0642GABHV023 meets industry standards.

7.What is the process for return or replacement of S27KL0642GABHV023?

All S27KL0642GABHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0642GABHV023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0642GABHV023 part is unused and in its original packaging.

Return procedure for S27KL0642GABHV023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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