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Infineon Technologies S27KL0643DPBHA020

Part No.:
S27KL0643DPBHA020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0643DPBHA020.pdf
Description:
IC PSRAM 64MBIT SPI/OCTAL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,177

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Product details

Overview

S27KL0643DPBHA020 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, 1.8 V/3.0 V dual-supply support, 200 MHz DDR clock, 400 MBps data throughput, and 24-ball FBGA package. It serves as high-bandwidth, low-pin-count external memory for microcontrollers and SoCs in embedded vision, industrial HMI, and automotive infotainment systems where SRAM density is insufficient and DRAM complexity must be avoided.

For engineers reviewing the S27KL0643DPBHA020 datasheet, S27KL0643DPBHA020 pinout, S27KL0643DPBHA020 application, or S27KL0643DPBHA020 equivalent, this device delivers configurable burst lengths (16–128 bytes), hybrid sleep/deep power-down modes, DCARS-enabled read strobe alignment, partial array refresh, and AEC-Q100 Grade 2 qualification - all critical for real-time memory interfacing in resource-constrained designs.

Technical Context

The S27KL0643DPBHA020 implements an octal xSPI interface with DDR signaling on DQ[7:0], using CK/CK# differential clock option and RWDS bidirectional strobe for timing control. Its internal logic manages autonomous self-refresh without host intervention, while requiring host-enforced transaction length limits to accommodate internal refresh cycles.

It supports linear and wrapped burst modes (8–64 clocks), configurable output drive strength, and register-accessible control of power modes (hybrid sleep, deep power down), voltage thresholds, and DCARS phase offset - enabling precise timing margin optimization in high-speed PCB layouts.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB) - provides SRAM-like interface with DRAM-level density for cost-sensitive buffer memory
Clock RateUp to 200 MHz DDR - enables 400 MBps peak bandwidth on 8-bit bus, reducing pin count vs parallel SRAM
InterfaceOctal xSPI - 11–12 signal interface (CS#, CK/CK#, RWDS, DQ[7:0], RESET#) compatible with SPI controllers via xSPI extension
Supply VoltagesVCC/VCCQ = 1.8 V or 3.0 V nominal - supports dual-voltage system integration without level shifters
Burst LengthConfigurable: 16/32/64/128 bytes (8/16/32/64 clocks) - balances latency, throughput, and refresh scheduling flexibility
Power ModesHybrid Sleep (330 µA @ 2.0 V), Deep Power Down (12 µA @ 2.0 V) - extends battery life in always-on edge nodes
Operating Temp−40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood automotive and factory-floor operation
Package24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - compact footprint compatible with fine-pitch routing and thermal management

Pinout & Package

24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) with ball map optimized for signal integrity: CS# and RESET# placed adjacent to power balls for noise immunity; CK/CK# differential pair routed on opposite edges; RWDS centered between DQ[7:0] for balanced strobe skew.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select (active-low)Asserts transaction boundary; must remain low for entire command/address/data sequence
CK / CK#Differential clock inputProvides DDR timing reference; CK# enables jitter-resistant edge detection for 200 MHz operation
RWDSBidirectional read/write strobeOutput during reads (data valid indicator), input during writes (byte mask); DCARS shifts its phase for optimal eye centering
DQ[7:0]Octal data I/ODDR data bus transferring two 8-bit nibbles per clock cycle; LV-CMOS compatible at 1.8 V or 3.0 V
RESET#Hardware reset inputAsynchronous active-low signal forcing device into known state; required before initialization sequence

Key Features

FeatureDesign Value
Self-refresh DRAM coreEliminates host-side refresh management while retaining DRAM density; appears as static RAM to software stack
DCARS (DDR Center-Aligned Read Strobe)Phase-shifts RWDS by one CK edge during reads to align strobe transition within data eye - improves timing margin at 200 MHz
Configurable partial array refreshSupports 1/8, 1/4, or 1/2 array refresh intervals - reduces average current during idle periods without full-array overhead
Hybrid Sleep modeRetains memory contents while cutting standby current to 330 µA (at 2.0 V, 105 °C) - ideal for intermittent sensor logging
xSPI command set compatibilitySupports standard xSPI opcodes (READ ID, DEEP POWER DOWN, READ/WRITE ANY REGISTER) - enables reuse of existing xSPI driver stacks

Applications

Automotive Instrument ClusterIndustrial HMI Display Buffer

Use Scenario: Real-time rendering of animated gauges and warning icons in digital dashboards with <10 ms frame latency.

IC Role / Device Role / Timing Role: External frame buffer memory for MCU-driven display controller; supplies pixel data via burst reads synchronized to display refresh rate.

Use Value: 400 MBps bandwidth sustains 1280×720@60 Hz RGB888 transfers; AEC-Q100 Grade 2 rating ensures reliability at 105 °C ambient.

Use Scenario: Local caching of GUI assets (fonts, icons, bitmaps) in programmable logic controllers with limited internal SRAM.

IC Role / Device Role / Timing Role: PSRAM replacement for legacy SRAM sockets; interfaces via xSPI-compatible MCU peripheral without redesigning PCB layout.

Use Value: 24-ball FBGA fits same footprint as 32-pin SOIC SRAM; wrapped burst mode matches typical GUI asset fetch patterns.

Edge AI Vision PreprocessingSmart Home Gateway Memory Expansion

Use Scenario: Temporary storage of raw image frames from MIPI CSI-2 sensors prior to neural network inference on embedded NPU.

IC Role / Device Role / Timing Role: High-throughput line buffer for image pipeline; operates in hybrid sleep between frame captures to minimize system power.

Use Value: 200 MHz DDR clock enables 160 MBps sustained write speed for 1920×1080 YUV422 streams; DCARS mitigates skew across 8-bit DQ bus.

Use Scenario: Expanding application memory for Zigbee/Z-Wave protocol stacks running on low-cost ARM Cortex-M7 MCUs.

IC Role / Device Role / Timing Role: Off-chip code+data memory mapped via XIP-capable xSPI interface; eliminates need for external SDRAM controller logic.

Use Value: Linear burst mode supports sequential instruction fetch; deep power down (12 µA) extends battery backup duration during mains outage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KS0643DPBHA020Same die, identical pinout and electrical specs; rebranded post-Infineon acquisition - functionally identical firmware and timing.No difference; drop-in replacement with identical AEC-Q100 Grade 2 qualification and FBGA package.Select based on distributor stock and lead time; no design change required.
ISSI IS66WV1288GBLL-100B3LI128Mb LPDDR2-based PSRAM; 1.2 V core, 1.8 V I/O; 100 MHz max clock; 16-bit bus; different command set and no DCARS.Lacks xSPI compatibility and self-refresh autonomy; requires host-managed refresh and separate controller IP.Only consider if xSPI interface is unavailable and board space allows 48-ball BGA; higher pin count and lower bandwidth.

Compared with S27KS0643DPBHA020, the Infineon part offers identical performance but clearer long-term supply chain visibility; versus ISSI's LPDDR2 PSRAM, it delivers 4× higher bandwidth, 50% lower active current, and true xSPI plug-and-play integration - critical for fast time-to-market in automotive and industrial designs.

Availability

S27KL0643DPBHA020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, edge AI vision preprocessing, and smart home gateway memory expansion requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S27KL0643DPBHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The HYPERRAM™ product line targets high-speed, low-pin-count external memory for MCUs and SoCs where traditional SRAM is too costly and SDRAM too complex - delivering PSRAM simplicity with DRAM density and xSPI ease-of-use.

FAQ

Does S27KL0643DPBHA020 require external refresh circuitry?

No. The device integrates autonomous self-refresh logic that executes internal DRAM refresh cycles without host intervention. The host only needs to observe maximum burst length limits (e.g., ≤128 bytes) to ensure sufficient idle time for refresh. This makes it functionally equivalent to SRAM in software abstraction, eliminating refresh-related firmware complexity.

What is the purpose of the RWDS signal and how does DCARS improve timing?

RWDS serves as a bidirectional strobe: output during reads to indicate data validity, input during writes as byte mask. DCARS shifts RWDS phase by one CK edge specifically during reads, moving its transition edge into the center of the DQ data eye. This compensates for PCB trace skew and setup/hold uncertainty, enabling reliable 200 MHz DDR operation without custom layout tuning.

Can S27KL0643DPBHA020 operate with only single-ended clock (CK), or is CK# mandatory?

CK# is optional. The device supports both single-ended (CK only) and differential (CK/CK#) clock modes. When using single-ended mode, CK# must be tied to VSS or VCC per datasheet guidance. Differential mode is recommended for >166 MHz operation to suppress common-mode noise and improve jitter tolerance - essential for robust 200 MHz timing margins.

How does Hybrid Sleep mode differ from Deep Power Down in terms of retention and wake-up latency?

In Hybrid Sleep, memory contents are retained and wake-up latency is <1 µs (no initialization required); current draw is 330 µA at 2.0 V. In Deep Power Down, contents are lost and wake-up requires full power-up initialization (~100 µs), but current drops to 12 µA. Use Hybrid Sleep for frequent low-latency wake events; use Deep Power Down only for extended idle periods where content loss is acceptable.

S27KL0643DPBHA020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
36ns
Access Time:
36 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0643DPBHA020 FAQ

1.How can I place an order for S27KL0643DPBHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0643DPBHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0643DPBHA020 reliable?

The price and inventory of S27KL0643DPBHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0643DPBHA020 is usually 5 days.

3.What payment methods are accepted for S27KL0643DPBHA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0643DPBHA020 transactions.

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4.How is shipping managed for S27KL0643DPBHA020?

S27KL0643DPBHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0643DPBHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0643DPBHA020?

For technical support, including S27KL0643DPBHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0643DPBHA020 requirements.

6.How does Aetrix verify that S27KL0643DPBHA020 is sourced from the original manufacturer or authorized distributors?

All S27KL0643DPBHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0643DPBHA020 meets industry standards.

7.What is the process for return or replacement of S27KL0643DPBHA020?

All S27KL0643DPBHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0643DPBHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0643DPBHA020 part is unused and in its original packaging.

Return procedure for S27KL0643DPBHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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