Infineon Technologies S27KL0643DPBHA023
- Part No.:
- S27KL0643DPBHA023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KL0643DPBHA023.pdf
- Description:
- IC PSRAM 64MBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S27KL0643DPBHA023 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O, 200 MHz DDR clock, 400 MBps data throughput, and industrial temperature range (–40°C to +85°C); used as high-bandwidth, low-pin-count external memory for microcontrollers in automotive instrument clusters and ADAS domain controllers.
For engineers reviewing the S27KL0643DPBHA023 datasheet, S27KL0643DPBHA023 pinout, S27KL0643DPBHA023 application, or S27KL0643DPBHA023 equivalent, key selection factors include xSPI octal DDR timing compliance, RWDS strobe behavior during read/write, configurable burst lengths (16–128 bytes), hybrid sleep power mode, and FBGA-24 package compatibility with high-density PCB layouts.
Technical Context
This PSRAM integrates DRAM array refresh control logic that autonomously manages partial/full array refresh without host intervention, enabling static RAM-like interface abstraction. It uses LV-CMOS signaling with optional differential clock (CK/CK#) and bidirectional RWDS for timing-critical DDR data capture.
The xSPI octal interface executes all transactions under chip select (CS#) framing, with 16-bit command fields (dual 8-bit opcodes sent on both CK edges), linear or wrapped burst addressing, and DCARS-enabled center-aligned read strobe for improved setup/hold margin at 200 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB), organized as 8,388,608 × 8 bits - supports compact external memory expansion without wide bus routing. |
| Interface | Octal xSPI DDR - transfers two 8-bit words per CK cycle using DQ[7:0], reducing pin count vs. parallel SRAM/DRAM. |
| Max Clock Rate | 200 MHz DDR - delivers up to 400 MBps effective bandwidth, sufficient for real-time graphics frame buffering. |
| Burst Length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) - enables optimization for cache line size or DMA transfer alignment. |
| Power Modes | Hybrid Sleep & Deep Power Down - 12 µA (1.8 V) or 15 µA (3.0 V) deep power down current enables ultra-low-power standby in always-on systems. |
| Timing Latency | tACC ≤ 35 ns - defines minimum CS# assertion-to-first-valid-data delay, critical for deterministic boot-time memory initialization. |
| Operating Temp | –40°C to +85°C (Industrial grade) - qualified for under-hood and dashboard electronics without derating. |
Pinout & Package
Package: 24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch, RoHS-compliant, bottom-side thermal pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for xSPI transaction framing; must be held stable for ≥1 CK before command launch. |
| CK / CK# | Clock Input (optional differential) | DDR edge-triggered timing reference; CK# enables jitter reduction in noisy automotive environments. |
| RWDS | Read/Write Data Strobe | Bidirectional: output as read strobe (phase-shifted for DCARS), input as write mask - eliminates need for separate DQS. |
| DQ[7:0] | Data I/O Bus | Octal bidirectional data path; transfers 16 bits per CK cycle in DDR mode - replaces 16-bit parallel bus with 8 pins. |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and forces re-initialization of refresh logic and configuration registers. |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Autonomous refresh management eliminates host CPU overhead and timing-critical refresh scheduling. |
| DCARS (DDR Center-Aligned Read Strobe) | Phase-shifts RWDS by 90° relative to CK to center strobe edge within read data eye - improves timing margin at 200 MHz. |
| Configurable drive strength | Adjustable DQ/RWDS output strength reduces signal integrity issues across varied PCB trace lengths and loads. |
| Partial array refresh | Supports 1/8, 1/4, or 1/2 array refresh cycles - lowers average current during light traffic vs. full-array refresh. |
| Hybrid Sleep mode | Retains data while stopping CK and reducing VCCQ current - enables fast wake-up (<100 ns) for latency-sensitive applications. |
Applications
| Automotive Instrument Cluster | ADAS Domain Controller |
|---|---|
Use Scenario: Rendering vector-based gauges and HUD overlays with real-time updates from CAN/FD networks. IC Role / Device Role / Timing Role: External frame buffer memory interfaced via xSPI to MCU's octal SPI peripheral, providing low-latency pixel data access. Use Value: 400 MBps bandwidth sustains 1080p@60Hz rendering; hybrid sleep mode cuts idle power below 15 µA during display blanking intervals. | Use Scenario: Buffering sensor fusion data (camera, radar, IMU) prior to AI accelerator ingestion. IC Role / Device Role / Timing Role: High-throughput streaming buffer between sensor interface and NPU, managed via DMA with configurable 64-byte bursts. Use Value: Wrapped burst mode aligns with typical radar point cloud packet sizes; DCARS ensures reliable read capture at 200 MHz across temperature. |
| Industrial HMI Panel | Medical Patient Monitor |
Use Scenario: Storing UI assets (fonts, icons, animation frames) for ARM Cortex-A7/A53-based Linux HMI platforms. IC Role / Device Role / Timing Role: PSRAM replacing parallel NOR flash + SRAM combo, accessed via MMIO-mapped xSPI controller. Use Value: 24-ball FBGA footprint saves >40% board area vs. 48-pin TSOP; tACC ≤35 ns enables sub-100 ns memory-mapped read response. | Use Scenario: Real-time waveform buffering (ECG, SpO₂) with guaranteed data retention during brief AC power loss. IC Role / Device Role / Timing Role: Battery-backed volatile memory holding last 30 seconds of clinical data, refreshed autonomously during host sleep. Use Value: Deep power down current of 12 µA (1.8 V) extends coin-cell backup runtime to >72 hours; AEC-Q100 Grade 3 qualification ensures reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KS0643DPBHA020 | Same die, identical xSPI timing and register map; differs only in ordering code suffix and minor test screening. | No functional difference; validated for same automotive and industrial use cases. | Select when sourcing from legacy Cypress channel or requiring identical qualification documentation. |
| ISSI IS66WV1288GL-100BLLI | Parallel 128Mbit SRAM (no DRAM refresh), 100 MHz async interface, 32-pin SOIC - higher pin count, no DDR, no self-refresh. | Lacks burst efficiency and bandwidth; requires host-managed timing and larger PCB footprint. | Consider only if xSPI interface unavailable or legacy design mandates parallel SRAM compatibility. |
Compared with S27KS0643DPBHA020, this part offers identical functionality and qualification; versus IS66WV1288GL-100BLLI, it trades pin count and simplicity for 4× bandwidth, autonomous refresh, and 90% lower active power at equivalent throughput.
Availability
S27KL0643DPBHA023 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, and industrial HMI panels requiring stable component supply with AEC-Q100 Grade 3 qualification and long-term lifecycle support.
Supply support for S27KL0643DPBHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
S27KL0643DPBHA023 belongs to the HYPERRAM™ product line, designed specifically to replace parallel SRAM and low-density DDR in resource-constrained embedded systems needing high bandwidth with minimal pin count and zero refresh overhead.
FAQ
Does S27KL0643DPBHA023 require external refresh commands from the host processor?
No. The device contains integrated self-refresh logic that autonomously executes partial or full array refresh cycles during idle periods. Host software does not issue refresh commands; the xSPI interface presents a static RAM abstraction. Refresh timing is fully managed internally, including during Hybrid Sleep mode.
What is the function of the RWDS pin during write transactions?
During write operations, RWDS serves as a write data mask: each rising edge samples one byte of DQ[7:0] for latching into the memory array. This eliminates the need for separate write-enable signals and allows precise per-byte masking without additional control lines.
Can S27KL0643DPBHA023 operate with only single-ended clock (CK), or is differential clock (CK/CK#) mandatory?
Single-ended CK operation is fully supported and default; CK# is optional. The device detects presence of CK# via internal biasing and auto-configures for differential mode only when CK# is externally driven. No configuration register change is needed - mode selection is hardware-determined.
Is DCARS (DDR Center-Aligned Read Strobe) enabled by default, and how is it configured?
DCARS is disabled by default. It is activated by setting bit 4 (DCARS_EN) in Configuration Register 1 (CR1), accessible via READ/WRITE ANY REGISTER xSPI commands. Once enabled, RWDS output shifts by 90° relative to CK for all subsequent read transactions until disabled or reset.
S27KL0643DPBHA023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 36ns
- Access Time:
- 36 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KL0643DPBHA023 FAQ
1.How can I place an order for S27KL0643DPBHA023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KL0643DPBHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KL0643DPBHA023 reliable?
The price and inventory of S27KL0643DPBHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0643DPBHA023 is usually 5 days.
3.What payment methods are accepted for S27KL0643DPBHA023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0643DPBHA023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KL0643DPBHA023?
S27KL0643DPBHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KL0643DPBHA023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KL0643DPBHA023?
For technical support, including S27KL0643DPBHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0643DPBHA023 requirements.
6.How does Aetrix verify that S27KL0643DPBHA023 is sourced from the original manufacturer or authorized distributors?
All S27KL0643DPBHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0643DPBHA023 meets industry standards.
7.What is the process for return or replacement of S27KL0643DPBHA023?
All S27KL0643DPBHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0643DPBHA023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KL0643DPBHA023 part is unused and in its original packaging.
Return procedure for S27KL0643DPBHA023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S27KL0643DPBHA023 Tags

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