Infineon Technologies S27KL0643DPBHI020
- Part No.:
- S27KL0643DPBHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KL0643DPBHI020.pdf
- Description:
- IC PSRAM 64MBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,688
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Product details
Overview
S27KL0643DPBHI020 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O and core supplies, 200 MHz DDR clock, 400 MBps data throughput, and industrial temperature range (–40°C to +85°C). It functions as a high-bandwidth, low-pin-count external memory buffer in microcontroller-based edge AI inference accelerators.
For engineers reviewing the S27KL0643DPBHI020 datasheet, S27KL0643DPBHI020 pinout, S27KL0643DPBHI020 application, or S27KL0643DPBHI020 equivalent, key selection criteria include xSPI octal DDR timing compliance, RWDS strobe behavior during read/write, configurable burst lengths (16–128 bytes), hybrid sleep power mode, and FBGA-24 package compatibility with high-density PCB layouts.
Technical Context
This PSRAM integrates on-die refresh control logic that autonomously manages DRAM array refresh without host intervention, presenting static RAM-like behavior to the xSPI master. Its octal DDR interface uses CK and RWDS for precise data capture timing, with optional differential CK#/CK and DCARS phase-shifted strobe support.
The device implements command-based transactions with 16-bit opcodes (dual 8-bit sent on both CK edges), supports linear/wrapped/hybrid burst modes, and provides partial array refresh (1/8, 1/4, 1/2) alongside full refresh - all managed via internal state machine independent of host timing constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB) usable storage with self-refresh DRAM architecture |
| Clock Rate | Up to 200 MHz DDR - enables 400 MBps peak bandwidth on 8-bit DQ bus |
| Interface | Octal xSPI - 11–12 signal count (CS#, CK/CK#, RWDS, DQ[7:0], RESET#) for minimal PCB routing |
| Burst Length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) or hybrid wrapped+linear mode |
| Power Modes | Hybrid Sleep (330 µA @ 2.0 V) and Deep Power Down (12 µA @ 2.0 V) for battery-constrained edge nodes |
| Timing Latency | tACC ≤ 35 ns - defines minimum CS# assertion-to-first-valid-data window for timing-critical boot loaders |
| Operating Temp | Industrial grade: –40°C to +85°C - qualified for fanless industrial gateways and motor drives |
Pinout & Package
24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) with 1.8 V/3.0 V dual-supply support (VCC/VCCQ). Ball assignment follows JEDEC MO-270DA standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select (active-low) | Asserts transaction boundary; must remain low for entire command/address/data sequence |
| CK / CK# | Single-ended or differential clock input | Drives DDR timing; CK# enables jitter-immune sampling when used differentially |
| RWDS | Bidirectional read-write data strobe | Output during reads (data valid indicator); input during writes (byte mask enable) |
| DQ[7:0] | Octal bidirectional data bus | Transfers two 8-bit nibbles per CK cycle in DDR mode - no separate address bus required |
| RESET# | Hardware reset input | Forces device into known state; resets internal registers and terminates ongoing transactions |
Key Features
| Feature | Design Value |
|---|---|
| On-die refresh controller | Eliminates host-driven refresh scheduling - simplifies firmware and avoids bus contention during memory access |
| DCARS strobe option | Phase-shifts RWDS by one CK edge to center-align strobe transitions within read data eye - improves timing margin at 200 MHz |
| Configurable drive strength | Adjusts DQ output impedance to match trace impedance - reduces signal integrity issues on long flex PCB runs |
| Partial array refresh | Refreshes only 1/8, 1/4, or 1/2 of array per cycle - lowers average current vs. full-array refresh in low-activity states |
| xSPI command set | Standardized 16-bit opcode format (dual 8-bit) compatible with ARM Cortex-M7/M33 and RISC-V host controllers |
Applications
| Smart Wearable Display Buffer | Automotive ADAS Preprocessing Cache |
|---|---|
Use Scenario: Stores frame buffers for 320×240 OLED displays in hearables with <100 ms UI response requirement. IC Role / Device Role / Timing Role: External PSRAM acting as low-latency, high-throughput graphics memory mapped directly to MCU's AHB bus via xSPI controller. Use Value: 200 MHz DDR interface delivers 400 MBps bandwidth - sufficient for double-buffered 24-bit RGB frames at 60 Hz with <2% CPU overhead. | Use Scenario: Caches sensor fusion outputs (IMU + camera ROI) in parking assist ECUs operating at –40°C to +85°C. IC Role / Device Role / Timing Role: High-reliability off-chip memory providing deterministic read latency (<35 ns tACC) for real-time motion vector computation. Use Value: Hybrid Sleep mode draws only 330 µA - extends battery life during vehicle standby while retaining cached calibration data. |
| Industrial PLC Logic Program Storage | Edge AI Inference Accelerator Memory |
Use Scenario: Holds ladder logic program code and I/O mapping tables in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile-equivalent memory accessed via xSPI with zero-refresh software overhead - replaces slower NOR flash for faster scan cycles. Use Value: Wrapped burst mode (64-byte) aligns with typical IEC 61131-3 instruction fetch size - reduces instruction cache misses by 42% vs. linear burst. | Use Scenario: Buffers intermediate tensors between convolution layers in sub-1W vision inference modules using TinyML models. IC Role / Device Role / Timing Role: Low-power, high-bandwidth working memory interfaced to custom NPU via octal xSPI - avoids bottlenecking 8-bit MAC throughput. Use Value: 128-byte burst length matches typical tensor tile size - achieves >92% bus utilization during inference kernels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KS0643DPBHI020 | Same die, identical pinout and timing - rebranded part post-Cypress acquisition by Infineon | No functional difference; legacy design-in continuity for Cypress-based BOMs | Select when maintaining existing Cypress qualification documentation or supply chain contracts |
| Winbond W958D8MWYX1I | 64Mb octal DDR PSRAM but lacks DCARS and hybrid sleep mode; max 166 MHz clock | Lower timing margin in high-noise automotive environments; higher active current (38 mA vs. 30 mA) | Choose only if cost sensitivity outweighs need for 200 MHz operation and ultra-low deep power down (12 µA) |
Compared with S27KS0643DPBHI020 (identical function) and W958D8MWYX1I (lower speed, no DCARS), the S27KL0643DPBHI020 offers optimal balance of industrial temperature rating, 200 MHz performance, and 12 µA deep power down - critical for thermally constrained edge AI deployments.
Availability
S27KL0643DPBHI020 is available at Aetrix Electronics and suitable for smart wearable display buffers, automotive ADAS preprocessing caches, and industrial PLC logic program storage requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for S27KL0643DPBHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensing, and connectivity solutions for industrial, automotive, and IoT markets.
The HYPERRAM™ product line delivers high-speed, low-pin-count PSRAMs optimized for microcontroller-based systems needing external memory bandwidth without complex DRAM controller logic or refresh management overhead.
FAQ
Does S27KL0643DPBHI020 require external refresh circuitry?
No. The device contains integrated self-refresh logic that autonomously manages DRAM array refresh during idle periods. Host processors interact with it as a static RAM - no refresh commands, timers, or scheduling are needed in firmware. Refresh occurs transparently between transactions, triggered by internal counters aligned to temperature and voltage conditions.
What is the purpose of the RWDS signal in read versus write operations?
In read operations, RWDS outputs a strobe synchronized to read data edges to indicate valid data windows. In write operations, RWDS serves as a byte mask input - each rising edge enables writing to the corresponding DQ byte. This dual-role eliminates need for separate RD/WR control lines and reduces interface complexity compared to parallel SRAM.
Can S27KL0643DPBHI020 operate with only single-ended clock (CK), or is differential CK#/CK mandatory?
Single-ended CK is fully supported and sufficient for most applications. Differential CK#/CK is optional and improves noise immunity in electrically noisy environments (e.g., automotive under-hood). When enabled, CK# must be driven complementary to CK with matched trace length and termination - no additional configuration is required beyond hardware layout.
How does the hybrid burst mode differ from pure linear or wrapped burst in practice?
Hybrid burst executes one wrapped burst (e.g., 64-byte circular wrap) followed immediately by a linear burst (e.g., 32-byte sequential). This combines spatial locality benefits of wrapping (cache line reuse) with predictable addressing of linear access - ideal for streaming video decode where macroblock headers and pixel data have differing access patterns.
S27KL0643DPBHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 36ns
- Access Time:
- 36 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KL0643DPBHI020 FAQ
1.How can I place an order for S27KL0643DPBHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KL0643DPBHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KL0643DPBHI020 reliable?
The price and inventory of S27KL0643DPBHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0643DPBHI020 is usually 5 days.
3.What payment methods are accepted for S27KL0643DPBHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0643DPBHI020 transactions.
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4.How is shipping managed for S27KL0643DPBHI020?
S27KL0643DPBHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KL0643DPBHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KL0643DPBHI020?
For technical support, including S27KL0643DPBHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0643DPBHI020 requirements.
6.How does Aetrix verify that S27KL0643DPBHI020 is sourced from the original manufacturer or authorized distributors?
All S27KL0643DPBHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0643DPBHI020 meets industry standards.
7.What is the process for return or replacement of S27KL0643DPBHI020?
All S27KL0643DPBHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0643DPBHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KL0643DPBHI020 part is unused and in its original packaging.
Return procedure for S27KL0643DPBHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S27KL0643DPBHI020 Tags

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