Infineon Technologies S27KL0643GABHI023
- Part No.:
- S27KL0643GABHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KL0643GABHI023.pdf
- Description:
- IC PSRAM 64MBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,634
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S27KL0643GABHI023 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O, 200 MHz DDR clock, and 400 MBps data throughput. It delivers linear/wrapped burst lengths up to 128 bytes, configurable drive strength, and operates across industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded memory expansion in microcontroller-based systems.
For engineers reviewing the S27KL0643GABHI023 datasheet, S27KL0643GABHI023 pinout, S27KL0643GABHI023 application, or S27KL0643GABHI023 equivalent, this device serves as a drop-in high-bandwidth, low-pin-count PSRAM replacement for legacy parallel SRAM or Quad SPI Flash in resource-constrained host interfaces requiring deterministic latency and partial array refresh control.
Technical Context
The S27KL0643GABHI023 implements an xSPI-compliant octal DDR interface with 11–12 signal lines (including optional CK#/RWDS), using LV-CMOS signaling and supporting both single-ended and differential clock modes. Its internal logic manages autonomous self-refresh of the 38-nm DRAM array without host intervention, while enforcing transaction-length limits to guarantee refresh timing compliance.
It supports hybrid sleep and deep power-down modes with sub-15 µA current draw at 105°C, and features DCARS (DDR center-aligned read strobe) to optimize RWDS timing alignment within the read data eye-enabling reliable high-speed reads at 200 MHz with minimal setup/hold margin requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB), organized as 8,388,608 × 8-bit for byte-addressable access |
| Interface Standard | Octal xSPI DDR - transfers two 8-bit words per CK edge, reducing pin count vs parallel SRAM |
| Max Clock Rate | 200 MHz at 1.8 V or 3.0 V - enables 400 MBps peak bandwidth with 8-bit DQ bus |
| Burst Lengths | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) - balances latency and throughput per access pattern |
| Refresh Management | On-chip self-refresh with partial array options (1/8, 1/4, 1/2) - eliminates host refresh scheduling overhead |
| Power Modes | Hybrid Sleep (330 µA @ 2.0 V, 105°C) and Deep Power Down (12 µA @ 2.0 V, 105°C) - extends battery life in portable systems |
| Operating Temp | Industrial grade: –40°C to +85°C - qualified for extended-temperature embedded control and display subsystems |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for all xSPI transactions; must be held low for entire command/address/data sequence |
| CK / CK# | Clock Input (optional differential) | DDR timing reference; CK# enables phase-matched sampling in high-noise environments |
| RWDS | Read-Write Data Strobe | Bidirectional: output during reads (data valid indicator), input during writes (byte mask control) |
| DQ[7:0] | Data Bus | Octal bidirectional data path; transfers two bytes per CK edge in DDR mode |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and forces re-initialization on power-up or fault recovery |
Key Features
| Feature | Design Value |
|---|---|
| DCARS (DDR Center-Aligned Read Strobe) | Phase-shifted RWDS output aligns transition edge to center of read data eye, improving timing margin at 200 MHz |
| Configurable Output Drive Strength | Selectable via register to match PCB trace impedance and reduce signal integrity issues in high-speed routing |
| Hybrid Burst Mode | Combines one wrapped burst followed by linear burst - optimizes sequential access efficiency in cache-like workloads |
| Partial Array Refresh Control | Host-selectable refresh granularity (1/8 to full array) - reduces power and latency when only subset of memory is active |
| Low-Power Deep Power Down | 12 µA standby current at 2.0 V/105°C - enables multi-week battery operation in always-on sensor nodes |
Applications
| Automotive Instrument Clusters | Industrial HMI Displays |
|---|---|
Use Scenario: Real-time rendering of animated gauges and infotainment overlays in digital dashboards with limited MCU external bus pins. IC Role / Device Role / Timing Role: PSRAM acting as frame buffer and UI asset cache, interfaced via xSPI to reduce MCU pin count and PCB layer count. Use Value: 400 MBps bandwidth sustains 60 Hz 1280×720 RGB565 updates; self-refresh eliminates CPU overhead for memory maintenance. | Use Scenario: Local GUI acceleration in programmable logic controllers with integrated touchscreens and real-time logging buffers. IC Role / Device Role / Timing Role: High-speed memory expansion for ARM Cortex-M7/M33-based HMI SoCs lacking sufficient on-chip SRAM. Use Value: Wrapped burst mode reduces average access latency for small widget draws; industrial temp rating ensures reliability in factory ambient conditions. |
| Edge AI Sensor Nodes | Medical Portable Monitors |
Use Scenario: On-device inference buffering for ultra-low-power vision or audio preprocessing in battery-powered wearables. IC Role / Device Role / Timing Role: Temporary feature map storage between neural network layers, accessed via burst reads aligned to model tensor dimensions. Use Value: Deep power-down mode draws only 12 µA during sleep intervals; partial refresh cuts active power by >30% during sparse inference cycles. | Use Scenario: Waveform capture and display buffering in handheld ECG or SpO₂ monitors requiring deterministic response and long battery life. IC Role / Device Role / Timing Role: Dual-port-capable memory used for simultaneous ADC streaming (write) and display refresh (read) via time-sliced xSPI arbitration. Use Value: Hybrid sleep mode maintains data retention while drawing <330 µA; AEC-Q100 Grade 3 qualification meets medical safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KS0643GABHI020 | Same die, identical pinout and xSPI protocol; differs only in ordering code and minor packaging marking | No functional difference; validated for same industrial and automotive use cases | Select based on distributor stock and lead time - functionally interchangeable |
| Winbond W958D8MBYA | 8-bit QSPI PSRAM, max 133 MHz clock, no DCARS or hybrid burst; 24-ball USON package | Limited to lower bandwidth and lacks advanced timing features; suitable only for non-critical UI or buffer roles | Choose only if xSPI compatibility and 200 MHz performance are not required |
Compared with S27KL0643GABHI023, the Cypress alternative offers identical functionality and qualification, while the Winbond part trades bandwidth and timing precision for cost and footprint - making it viable only where 400 MBps throughput and DCARS-driven signal integrity are unnecessary.
Availability
S27KL0643GABHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI displays, and edge AI sensor nodes requiring stable component supply, AEC-Q100 Grade 3 qualification, and guaranteed long-term availability.
Supply support for S27KL0643GABHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This device belongs to the HYPERRAM™ family, designed specifically to replace parallel SRAM and legacy PSRAM in space- and pin-constrained embedded systems requiring high bandwidth, low power, and simplified interface architecture.
FAQ
What voltage supplies does the S27KL0643GABHI023 require?
The device requires two independent supplies: VCC (1.7–1.95 V or 2.7–3.6 V) for the DRAM core and VCCQ (same range) for the I/O buffers. Both rails must be powered simultaneously during operation, and their voltage levels determine maximum clock rate and timing parameters per datasheet Table 9.3.2.
Does the S27KL0643GABHI023 support true hardware reset recovery?
Yes - asserting RESET# for ≥100 ns forces full internal state reset, clears configuration registers, disables all power modes, and reinitializes the DRAM array. The device exits reset in standard xSPI mode and requires a READ ID command before subsequent operations.
How does RWDS function during write transactions?
During writes, RWDS operates as an input serving as byte-level write mask: each bit corresponds to one DQ lane, enabling selective updating of individual bytes within a burst. This allows efficient partial-word writes without read-modify-write cycles, reducing bus traffic and power consumption.
Is DCARS enabled by default, and how is it configured?
DCARS is disabled by default. It is enabled by setting bit 7 of Configuration Register 2 (CR2) via WRITE ANY REGISTER command. Once enabled, RWDS transitions are phase-shifted by half a CK period relative to CK, and the host must adjust sampling timing accordingly per datasheet Section 12.3.
S27KL0643GABHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KL0643GABHI023 FAQ
1.How can I place an order for S27KL0643GABHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KL0643GABHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KL0643GABHI023 reliable?
The price and inventory of S27KL0643GABHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0643GABHI023 is usually 5 days.
3.What payment methods are accepted for S27KL0643GABHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0643GABHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KL0643GABHI023?
S27KL0643GABHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KL0643GABHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KL0643GABHI023?
For technical support, including S27KL0643GABHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0643GABHI023 requirements.
6.How does Aetrix verify that S27KL0643GABHI023 is sourced from the original manufacturer or authorized distributors?
All S27KL0643GABHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0643GABHI023 meets industry standards.
7.What is the process for return or replacement of S27KL0643GABHI023?
All S27KL0643GABHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0643GABHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KL0643GABHI023 part is unused and in its original packaging.
Return procedure for S27KL0643GABHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S27KL0643GABHI023 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

