Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S27KL0643GABHI023

Part No.:
S27KL0643GABHI023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KL0643GABHI023.pdf
Description:
IC PSRAM 64MBIT SPI/OCTAL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,634

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S27KL0643GABHI023 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O, 200 MHz DDR clock, and 400 MBps data throughput. It delivers linear/wrapped burst lengths up to 128 bytes, configurable drive strength, and operates across industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded memory expansion in microcontroller-based systems.

For engineers reviewing the S27KL0643GABHI023 datasheet, S27KL0643GABHI023 pinout, S27KL0643GABHI023 application, or S27KL0643GABHI023 equivalent, this device serves as a drop-in high-bandwidth, low-pin-count PSRAM replacement for legacy parallel SRAM or Quad SPI Flash in resource-constrained host interfaces requiring deterministic latency and partial array refresh control.

Technical Context

The S27KL0643GABHI023 implements an xSPI-compliant octal DDR interface with 11–12 signal lines (including optional CK#/RWDS), using LV-CMOS signaling and supporting both single-ended and differential clock modes. Its internal logic manages autonomous self-refresh of the 38-nm DRAM array without host intervention, while enforcing transaction-length limits to guarantee refresh timing compliance.

It supports hybrid sleep and deep power-down modes with sub-15 µA current draw at 105°C, and features DCARS (DDR center-aligned read strobe) to optimize RWDS timing alignment within the read data eye-enabling reliable high-speed reads at 200 MHz with minimal setup/hold margin requirements.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB), organized as 8,388,608 × 8-bit for byte-addressable access
Interface StandardOctal xSPI DDR - transfers two 8-bit words per CK edge, reducing pin count vs parallel SRAM
Max Clock Rate200 MHz at 1.8 V or 3.0 V - enables 400 MBps peak bandwidth with 8-bit DQ bus
Burst LengthsConfigurable: 16/32/64/128 bytes (8/16/32/64 clocks) - balances latency and throughput per access pattern
Refresh ManagementOn-chip self-refresh with partial array options (1/8, 1/4, 1/2) - eliminates host refresh scheduling overhead
Power ModesHybrid Sleep (330 µA @ 2.0 V, 105°C) and Deep Power Down (12 µA @ 2.0 V, 105°C) - extends battery life in portable systems
Operating TempIndustrial grade: –40°C to +85°C - qualified for extended-temperature embedded control and display subsystems

Pinout & Package

Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for all xSPI transactions; must be held low for entire command/address/data sequence
CK / CK#Clock Input (optional differential)DDR timing reference; CK# enables phase-matched sampling in high-noise environments
RWDSRead-Write Data StrobeBidirectional: output during reads (data valid indicator), input during writes (byte mask control)
DQ[7:0]Data BusOctal bidirectional data path; transfers two bytes per CK edge in DDR mode
RESET#Hardware ResetAsynchronous active-low reset that clears internal state and forces re-initialization on power-up or fault recovery

Key Features

FeatureDesign Value
DCARS (DDR Center-Aligned Read Strobe)Phase-shifted RWDS output aligns transition edge to center of read data eye, improving timing margin at 200 MHz
Configurable Output Drive StrengthSelectable via register to match PCB trace impedance and reduce signal integrity issues in high-speed routing
Hybrid Burst ModeCombines one wrapped burst followed by linear burst - optimizes sequential access efficiency in cache-like workloads
Partial Array Refresh ControlHost-selectable refresh granularity (1/8 to full array) - reduces power and latency when only subset of memory is active
Low-Power Deep Power Down12 µA standby current at 2.0 V/105°C - enables multi-week battery operation in always-on sensor nodes

Applications

Automotive Instrument ClustersIndustrial HMI Displays

Use Scenario: Real-time rendering of animated gauges and infotainment overlays in digital dashboards with limited MCU external bus pins.

IC Role / Device Role / Timing Role: PSRAM acting as frame buffer and UI asset cache, interfaced via xSPI to reduce MCU pin count and PCB layer count.

Use Value: 400 MBps bandwidth sustains 60 Hz 1280×720 RGB565 updates; self-refresh eliminates CPU overhead for memory maintenance.

Use Scenario: Local GUI acceleration in programmable logic controllers with integrated touchscreens and real-time logging buffers.

IC Role / Device Role / Timing Role: High-speed memory expansion for ARM Cortex-M7/M33-based HMI SoCs lacking sufficient on-chip SRAM.

Use Value: Wrapped burst mode reduces average access latency for small widget draws; industrial temp rating ensures reliability in factory ambient conditions.

Edge AI Sensor NodesMedical Portable Monitors

Use Scenario: On-device inference buffering for ultra-low-power vision or audio preprocessing in battery-powered wearables.

IC Role / Device Role / Timing Role: Temporary feature map storage between neural network layers, accessed via burst reads aligned to model tensor dimensions.

Use Value: Deep power-down mode draws only 12 µA during sleep intervals; partial refresh cuts active power by >30% during sparse inference cycles.

Use Scenario: Waveform capture and display buffering in handheld ECG or SpO₂ monitors requiring deterministic response and long battery life.

IC Role / Device Role / Timing Role: Dual-port-capable memory used for simultaneous ADC streaming (write) and display refresh (read) via time-sliced xSPI arbitration.

Use Value: Hybrid sleep mode maintains data retention while drawing <330 µA; AEC-Q100 Grade 3 qualification meets medical safety requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KS0643GABHI020Same die, identical pinout and xSPI protocol; differs only in ordering code and minor packaging markingNo functional difference; validated for same industrial and automotive use casesSelect based on distributor stock and lead time - functionally interchangeable
Winbond W958D8MBYA8-bit QSPI PSRAM, max 133 MHz clock, no DCARS or hybrid burst; 24-ball USON packageLimited to lower bandwidth and lacks advanced timing features; suitable only for non-critical UI or buffer rolesChoose only if xSPI compatibility and 200 MHz performance are not required

Compared with S27KL0643GABHI023, the Cypress alternative offers identical functionality and qualification, while the Winbond part trades bandwidth and timing precision for cost and footprint - making it viable only where 400 MBps throughput and DCARS-driven signal integrity are unnecessary.

Availability

S27KL0643GABHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI displays, and edge AI sensor nodes requiring stable component supply, AEC-Q100 Grade 3 qualification, and guaranteed long-term availability.

Supply support for S27KL0643GABHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This device belongs to the HYPERRAM™ family, designed specifically to replace parallel SRAM and legacy PSRAM in space- and pin-constrained embedded systems requiring high bandwidth, low power, and simplified interface architecture.

FAQ

What voltage supplies does the S27KL0643GABHI023 require?

The device requires two independent supplies: VCC (1.7–1.95 V or 2.7–3.6 V) for the DRAM core and VCCQ (same range) for the I/O buffers. Both rails must be powered simultaneously during operation, and their voltage levels determine maximum clock rate and timing parameters per datasheet Table 9.3.2.

Does the S27KL0643GABHI023 support true hardware reset recovery?

Yes - asserting RESET# for ≥100 ns forces full internal state reset, clears configuration registers, disables all power modes, and reinitializes the DRAM array. The device exits reset in standard xSPI mode and requires a READ ID command before subsequent operations.

How does RWDS function during write transactions?

During writes, RWDS operates as an input serving as byte-level write mask: each bit corresponds to one DQ lane, enabling selective updating of individual bytes within a burst. This allows efficient partial-word writes without read-modify-write cycles, reducing bus traffic and power consumption.

Is DCARS enabled by default, and how is it configured?

DCARS is disabled by default. It is enabled by setting bit 7 of Configuration Register 2 (CR2) via WRITE ANY REGISTER command. Once enabled, RWDS transitions are phase-shifted by half a CK period relative to CK, and the host must adjust sampling timing accordingly per datasheet Section 12.3.

S27KL0643GABHI023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KL0643GABHI023 FAQ

1.How can I place an order for S27KL0643GABHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KL0643GABHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KL0643GABHI023 reliable?

The price and inventory of S27KL0643GABHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0643GABHI023 is usually 5 days.

3.What payment methods are accepted for S27KL0643GABHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KL0643GABHI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KL0643GABHI023?

S27KL0643GABHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KL0643GABHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KL0643GABHI023?

For technical support, including S27KL0643GABHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0643GABHI023 requirements.

6.How does Aetrix verify that S27KL0643GABHI023 is sourced from the original manufacturer or authorized distributors?

All S27KL0643GABHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0643GABHI023 meets industry standards.

7.What is the process for return or replacement of S27KL0643GABHI023?

All S27KL0643GABHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0643GABHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KL0643GABHI023 part is unused and in its original packaging.

Return procedure for S27KL0643GABHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S27KL0643GABHI023 Tags

  • S27KL0643GABHI023
  • S27KL0643GABHI023 PDF
  • S27KL0643GABHI023 Datasheet
  • S27KL0643GABHI023 Specifications
  • S27KL0643GABHI023 Images
  • Infineon Technologies
  • Infineon Technologies S27KL0643GABHI023
  • Buy S27KL0643GABHI023
  • S27KL0643GABHI023 Price
  • S27KL0643GABHI023 Distributor
  • S27KL0643GABHI023 Supplier
  • S27KL0643GABHI023 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER