Infineon Technologies S27KL0643GABHV023
- Part No.:
- S27KL0643GABHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KL0643GABHV023.pdf
- Description:
- IC PSRAM 64MBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,987
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Product details
Overview
S27KL0643GABHV023 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, 1.8 V/3.0 V dual-supply support, 200 MHz DDR clock, and 24-ball FBGA package. It delivers up to 400 MBps throughput, supports linear/wrapped burst lengths (16–128 bytes), and operates across industrial temperature range (–40°C to +105°C). Used in embedded microcontroller systems requiring high-bandwidth, low-pin-count external memory with SRAM-like ease of use.
For engineers reviewing the S27KL0643GABHV023 datasheet, S27KL0643GABHV023 pinout, S27KL0643GABHV023 application, or S27KL0643GABHV023 equivalent, key selection criteria include xSPI octal DDR timing compliance, RWDS strobe behavior, configurable burst mode, hybrid sleep/deep power down current specs (12 µA at 1.8 V), and AEC-Q100 Grade 2 qualification for automotive edge computing.
Technical Context
This PSRAM integrates DRAM array refresh control logic that autonomously manages partial/full array refresh without host intervention-enabling SRAM-like command interface over xSPI. Its octal DDR interface uses CK/RWDS synchronization with optional differential CK# and DCARS phase-shifted read strobe for timing margin optimization in high-speed layouts.
The device implements 16-bit command encoding (dual 8-bit opcodes on each CK edge), supports register-based configuration of drive strength, burst type, and power modes, and enforces transaction-level access latency when internal refresh is pending-requiring host firmware to respect tACC (35 ns) and initial read latency indicators via RWDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB) pseudo-static RAM with self-refresh DRAM core |
| Clock Rate | Up to 200 MHz DDR - enables 400 MBps peak data throughput |
| Interface | Octal xSPI - 11–12 signal count (CK/CK#, CS#, DQ[7:0], RWDS, RESET#) |
| Supply Voltage | 1.8 V or 3.0 V VCC/VCCQ - dual-voltage I/O and core support |
| Burst Length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) or hybrid wrapped+linear |
| Power Modes | Hybrid Sleep (330 µA @ 1.8 V) and Deep Power Down (12 µA @ 1.8 V) |
| Operating Temp | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) |
Pinout & Package
24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3. Package footprint matches JEDEC MO-270AC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for all xSPI transactions; must be held high between operations |
| CK / CK# | Clock Input | Single-ended (CK only) or differential (CK/CK#) DDR clock source; defines all data edges |
| RWDS | Read-Write Data Strobe | Bidirectional: output during reads (data valid indicator), input during writes (mask signal); also signals refresh latency at transaction start |
| DQ[7:0] | Data Bus | Octal bidirectional data lines; transfers two 8-bit nibbles per CK cycle in DDR mode |
| RESET# | Hardware Reset | Asynchronous active-low reset; forces device into known state and clears internal registers |
Key Features
| Feature | Design Value |
|---|---|
| Self-Refresh DRAM Core | Eliminates external refresh controller; host sees SRAM-like interface while internal logic schedules partial/full array refreshes autonomously |
| DCARS Read Strobe | Phase-shifted RWDS offset by one CK edge improves read data eye alignment in high-speed PCB layouts |
| Configurable Drive Strength | Adjustable output drive on DQ/RWDS pins reduces signal integrity issues across varied trace lengths and loads |
| Hybrid Burst Mode | Combines wrapped burst (for cache-line efficiency) followed by linear burst (for sequential streaming), optimizing bandwidth per transaction |
| AEC-Q100 Grade 2 | Qualified for automotive applications up to +105°C ambient, supporting ADAS and infotainment SoC offload memory |
Applications
| Automotive ADAS Camera Buffer | Industrial HMI Frame Buffer |
|---|---|
Use Scenario: Real-time buffering of 1080p60 image frames from MIPI CSI-2 receivers before GPU processing. IC Role / Device Role / Timing Role: Off-chip PSRAM providing low-latency, high-throughput frame storage with deterministic tACC (35 ns) and burst-aligned access. Use Value: Enables zero-copy frame handoff using 128-byte wrapped bursts, reducing CPU overhead and eliminating external refresh management. | Use Scenario: Storing dynamic UI assets (fonts, icons, rendered widgets) in PLC touch panels operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: High-reliability external memory with AEC-Q100 Grade 2 rating and deep power down (12 µA) for energy-constrained edge HMIs. Use Value: Maintains data retention during extended standby while supporting fast wake-up via xSPI command-driven resume. |
| Edge AI Inference Scratchpad | Wireless Gateway Packet Buffer |
Use Scenario: Temporary tensor scratchpad for lightweight neural network inference on Cortex-M7/M33 microcontrollers. IC Role / Device Role / Timing Role: Low-pin-count external memory interfaced via xSPI to avoid multiplexing GPIOs; supports hybrid burst for irregular memory access patterns. Use Value: Doubles effective bandwidth vs quad-SPI while maintaining MCU firmware compatibility through standardized xSPI command set. | Use Scenario: Deep packet buffering in 802.11ax/Wi-Fi 6 gateways handling concurrent VoIP, video, and IoT traffic streams. IC Role / Device Role / Timing Role: High-throughput, low-power buffer with configurable drive strength to match varying PHY trace impedances. Use Value: Achieves 400 MBps sustained write/read with DCARS-assisted timing margin, reducing packet loss under thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KS0643GABHV020 | Same die, identical pinout and xSPI command set; differs only in ordering code suffix and tape/reel packaging | No functional difference; validated for same automotive and industrial use cases | Select when sourcing from legacy Cypress channel or requiring specific reel size |
| ISSI IS66WV12816EBLL-100B3LI | Parallel-interface 2MB SRAM (not PSRAM); no self-refresh, no xSPI, 100 MHz async interface, higher pin count (48-pin TSOP) | Requires full parallel bus allocation and external refresh logic; unsuitable for space-constrained xSPI designs | Only viable if system lacks xSPI controller but has spare GPIOs and needs guaranteed static retention without refresh latency |
Compared with S27KS0643GABHV020, this part offers identical functionality with updated Infineon branding and lifecycle support; versus IS66WV12816EBLL-100B3LI, it trades pin count and static guarantee for xSPI integration, bandwidth, and power efficiency in modern embedded SoCs.
Availability
S27KL0643GABHV023 is available at Aetrix Electronics and suitable for automotive ADAS camera buffers, industrial HMI frame buffers, and edge AI inference scratchpads requiring stable component supply, AEC-Q100 qualification, and long-term industrial temperature operation.
Supply support for S27KL0643GABHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
S27KL0643GABHV023 belongs to the HYPERRAM™ PSRAM product line, designed specifically to replace parallel SRAM and low-density DDR in resource-constrained embedded systems needing high bandwidth, low pin count, and simplified memory subsystem design.
FAQ
Does S27KL0643GABHV023 require external refresh circuitry?
No. The device contains integrated self-refresh logic that autonomously manages DRAM array refresh during idle periods. Host controllers interact with it using standard xSPI commands and do not need to issue refresh cycles or track refresh timing-making it functionally equivalent to SRAM in software interface.
What is the purpose of the RWDS signal beyond data strobing?
RWDS serves three roles: (1) indicates read data validity during reads, (2) acts as write mask during writes, and (3) pulses at the start of every transaction to signal pending internal refresh latency-requiring the host to insert additional wait states before accessing data.
Can S27KL0643GABHV023 operate at 1.8 V and 3.0 V simultaneously?
No. VCC (core) and VCCQ (I/O) must be supplied at the same nominal voltage: either both at 1.8 V or both at 3.0 V. Mixed-supply operation is not supported and violates absolute maximum ratings per the datasheet.
Is DCARS functionality enabled by default?
DCARS is disabled by default. It must be activated by setting bit 7 of Configuration Register 2 (CR2) via WRITE ANY REGISTER command. Once enabled, RWDS transitions align to the phase-shifted clock edge during reads, improving setup/hold margins in high-speed layouts.
S27KL0643GABHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KL0643GABHV023 FAQ
1.How can I place an order for S27KL0643GABHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KL0643GABHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KL0643GABHV023 reliable?
The price and inventory of S27KL0643GABHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KL0643GABHV023 is usually 5 days.
3.What payment methods are accepted for S27KL0643GABHV023?
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S27KL0643GABHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KL0643GABHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KL0643GABHV023?
For technical support, including S27KL0643GABHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KL0643GABHV023 requirements.
6.How does Aetrix verify that S27KL0643GABHV023 is sourced from the original manufacturer or authorized distributors?
All S27KL0643GABHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KL0643GABHV023 meets industry standards.
7.What is the process for return or replacement of S27KL0643GABHV023?
All S27KL0643GABHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KL0643GABHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KL0643GABHV023 part is unused and in its original packaging.
Return procedure for S27KL0643GABHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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