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Infineon Technologies S27KS0641DPBHB023

Part No.:
S27KS0641DPBHB023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KS0641DPBHB023.pdf
Description:
IC PSRAM 64MBIT PARALLEL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,409

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Product details

Overview

S27KS0641DPBHB023 from Infineon Technologies (formerly Cypress) is a 64 Mb (8 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and bidirectional RWDS strobe/mask. It delivers 333 MBps throughput at 166 MHz DDR, features DCARS timing for read data eye alignment, and integrates on-die refresh control to emulate PSRAM behavior in microcontroller-based systems requiring high-bandwidth external memory.

For engineers reviewing the S27KS0641DPBHB023 datasheet, S27KS0641DPBHB023 pinout, S27KS0641DPBHB023 application, or S27KS0641DPBHB023 equivalent, key selection criteria include its 24-ball FBGA package, 1.8 V I/O compatibility, RWDS-driven latency signaling, configurable burst lengths (16–128 bytes), and Deep Power Down current of 20 µA at 1.8 V - critical for low-power HMI and edge AI inference accelerators.

Technical Context

This HyperRAM device implements a DDR-based HyperBus interface with center-aligned command/address transfers and edge-aligned read data synchronized to RWDS transitions. Its internal refresh controller eliminates host-managed refresh cycles, enabling seamless integration with MCU or FPGA masters lacking DRAM timing controllers.

The DCARS (DDR Center-Aligned Read Strobe) architecture uses a phase-shifted clock derived from CK to position RWDS edges within the read data eye, ensuring reliable capture at 166 MHz. Burst transactions support dynamic selection between wrapped (cache-line fill) and linear (graphics buffer) modes per command, with initial latency signaled via RWDS during CA transfer.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mb (8 MB) - sufficient for frame buffers in 720p display controllers or firmware overlay storage in real-time OS environments
Interface Speed166 MHz DDR clock → 333 MBps peak bandwidth - enables sub-30 ns effective access latency for burst reads in graphics pipelines
I/O Voltage1.8 V VCCQ - compatible with modern low-voltage SoCs and reduces signal integrity margining effort vs. 3.0 V variants
Burst LengthConfigurable: 16/32/64/128 bytes - supports cache-line-aligned fetches (64-byte) and streaming DMA transfers (128-byte)
Power ModesDeep Power Down: 20 µA @ 1.8 V - enables multi-week battery operation in always-on sensor hubs
Package24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - provides compact footprint with thermal performance suitable for stacked PCB designs
Timing ArchitectureDCARS with RWDS phase-shifted clock - eliminates need for board-level delay tuning in high-speed layout

Pinout & Package

24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) with ball-out optimized for signal integrity and thermal dissipation in space-constrained embedded applications.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides timing reference for DDR command/address/data; CK# enables jitter rejection and skew compensation
CS#Chip select inputActive-low enable for all transactions; deassertion terminates burst and initiates power-down entry
RWDSBidirectional strobe/maskOutputs initial latency indicator during CA phase; serves as read data strobe or write mask during data phase
DQ[7:0]8-bit bidirectional data busCarries command/address (6 bytes), then read/write data; supports DDR transfers with center-aligned writes
VCC / VCCQCore and I/O suppliesVCC = 1.8 V core; VCCQ = 1.8 V I/O - decoupled rails reduce switching noise coupling into memory array
RESET#Hardware reset inputAsynchronous active-low signal that clears internal state and forces re-initialization of refresh logic

Key Features

FeatureDesign Value
Self-refresh DRAM coreEliminates host refresh overhead - allows use with resource-constrained MCUs lacking DRAM controllers
HyperBus low-signal-count interface12-pin total (CK/CK#, CS#, RWDS, DQ[7:0]) - reduces PCB layer count and routing complexity vs. parallel NOR/NAND
DCARS timing architecturePhase-shifted RWDS clock ensures data valid window alignment without trace length matching constraints
Configurable burst modePer-transaction selection of wrapped (cache line) or linear (streaming) bursts - enables optimal memory access patterns for mixed workloads
Deep Power Down mode20 µA standby current at 1.8 V - extends battery life in portable medical monitors and industrial handhelds

Applications

Automotive Digital ClusterIndustrial HMI Display

Use Scenario: Rendering animated gauges and infotainment overlays in real time on 1280×720 TFT panels.

IC Role / Device Role / Timing Role: External frame buffer memory interfaced to MCU GPU subsystem via HyperBus, providing low-latency pixel data access.

Use Value: 333 MBps bandwidth sustains 60 fps rendering with zero stutter; DCARS timing simplifies layout in ECU's tight EMI-constrained PCB stackup.

Use Scenario: Storing and updating dynamic UI assets (icons, fonts, vector graphics) in factory-floor HMIs with flash wear limitations.

IC Role / Device Role / Timing Role: High-speed PSRAM replacement for NOR flash in GUI engine, enabling fast asset decompression and redraw.

Use Value: Wrapped 64-byte bursts align with cache lines of ARM Cortex-M7 cores; 20 µA Deep Power Down extends uptime during panel sleep mode.

Edge AI Inference AcceleratorMedical Patient Monitor

Use Scenario: Buffering intermediate tensors during CNN inference on low-power vision SoCs with limited on-chip SRAM.

IC Role / Device Role / Timing Role: Off-chip working memory accessed via DMA engine with burst-length optimization per layer output size.

Use Value: Linear 128-byte bursts maximize throughput for large feature maps; 1.8 V I/O matches SoC voltage domain, avoiding level shifters.

Use Scenario: Real-time waveform buffering (ECG, SpO₂) and alarm-triggered snapshot storage in battery-powered bedside monitors.

IC Role / Device Role / Timing Role: Low-power, high-reliability memory for cyclic data acquisition and emergency event logging.

Use Value: Self-refresh eliminates risk of data loss during brown-out events; 300 µA standby current enables >72-hour operation on single Li-ion cell.

Equivalent & Alternatives

The following parts are listed as comparable options for similar self-refresh DRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS66WV12816EBLL-15BLIParallel SRAM interface (44-pin TSOP), no self-refresh, 15 ns async accessRequires full address/data bus and external refresh management; higher pin count and static power drawSelect only if legacy design lacks HyperBus support and requires true asynchronous access
S27KL0641DPBHB020Same die, 3.0 V I/O variant - higher VCCQ, 100 MHz max clock, 200 MBps bandwidthCompatible with older 3.3 V tolerant MCUs but consumes 3× more active current (60 mA vs. 20 mA at 166 MHz)Choose when system-level voltage rail constraints prevent 1.8 V adoption, accepting bandwidth and power trade-offs

Compared with IS66WV12816EBLL-15BLI and S27KL0641DPBHB020, the S27KS0641DPBHB023 offers superior power efficiency and interface simplicity for new designs targeting 1.8 V ecosystems, while maintaining identical memory density and HyperBus protocol compatibility.

Availability

S27KS0641DPBHB023 is available at Aetrix Electronics and suitable for automotive digital clusters, industrial HMI displays, and edge AI inference accelerators requiring stable component supply, long-term lifecycle assurance, and qualified sourcing for production ramp.

Supply support for S27KS0641DPBHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.

This part belongs to the HyperRAM™ product line, designed specifically to bridge the performance gap between serial NOR flash and parallel DRAM by delivering DDR bandwidth with PSRAM-like ease of use in resource-constrained embedded systems.

FAQ

What is the maximum supported clock frequency for S27KS0641DPBHB023?

The device supports up to 166 MHz DDR clock frequency at 1.8 V VCCQ, delivering 333 MBps peak bandwidth. This rating is validated across commercial temperature range (–40 °C to +85 °C) and requires proper termination and layout per Infineon's HyperBus design guidelines. Operation above this frequency violates AC timing specifications and may cause data corruption.

Does S27KS0641DPBHB023 require external refresh circuitry?

No. The device integrates autonomous self-refresh logic that maintains data integrity without host intervention. Refresh cycles occur transparently during idle periods or transaction gaps, making it functionally equivalent to PSRAM for software and driver development - no refresh registers or timing-critical host scheduling is needed.

Can RWDS be used as a dedicated read strobe without masking functionality?

Yes. During read transactions, RWDS operates exclusively as a source-synchronous read data strobe with edge-aligned transitions. Its masking function is inactive in read mode. The same physical signal serves dual roles: output-only latency indicator/strobe in reads, and bidirectional strobe/mask in writes - automatically managed by internal state machine based on transaction type.

Is S27KS0641DPBHB023 pin-compatible with S27KL0641DPBHB020?

Yes - both share identical 24-ball FBGA package, pinout, and mechanical footprint. However, they differ electrically: S27KS0641DPBHB023 uses 1.8 V I/O (VCCQ), while S27KL0641DPBHB020 uses 3.0 V I/O. Direct substitution requires matching the host's I/O voltage rail and verifying timing margins at the lower voltage.

S27KS0641DPBHB023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KS
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
40 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KS0641DPBHB023 FAQ

1.How can I place an order for S27KS0641DPBHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KS0641DPBHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KS0641DPBHB023 reliable?

The price and inventory of S27KS0641DPBHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0641DPBHB023 is usually 5 days.

3.What payment methods are accepted for S27KS0641DPBHB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0641DPBHB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KS0641DPBHB023?

S27KS0641DPBHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KS0641DPBHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KS0641DPBHB023?

For technical support, including S27KS0641DPBHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0641DPBHB023 requirements.

6.How does Aetrix verify that S27KS0641DPBHB023 is sourced from the original manufacturer or authorized distributors?

All S27KS0641DPBHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0641DPBHB023 meets industry standards.

7.What is the process for return or replacement of S27KS0641DPBHB023?

All S27KS0641DPBHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0641DPBHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KS0641DPBHB023 part is unused and in its original packaging.

Return procedure for S27KS0641DPBHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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