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Infineon Technologies S27KS0641DPBHI020

Part No.:
S27KS0641DPBHI020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KS0641DPBHI020.pdf
Description:
IC PSRAM 64MBIT PARALLEL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,469

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Product details

Overview

S27KS0641DPBHI020 from Infineon Technologies (formerly Cypress) is a 64 Mb (8 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and bidirectional RWDS strobe/mask. It delivers 333 MBps throughput at 166 MHz DDR, features DCARS timing for read data eye alignment, and integrates on-die refresh control to emulate PSRAM behavior in embedded systems requiring low-pin-count high-bandwidth memory.

For engineers reviewing the S27KS0641DPBHI020 datasheet, S27KS0641DPBHI020 pinout, S27KS0641DPBHI020 application, or S27KS0641DPBHI020 equivalent, key selection criteria include HyperBus signal count reduction (12-pin interface), configurable burst length (16–128 bytes), deep power-down current (20 µA @ 1.8 V), and support for wrapped/linear/hybrid burst modes in real-time display and graphics buffering applications.

Technical Context

This device implements a DDR HyperBus interface with center-aligned command/address transfers and edge-aligned read data strobed by RWDS. Its internal refresh controller eliminates host-managed refresh cycles, enabling seamless integration as pseudo-static RAM while retaining DRAM density advantages.

The DCARS (DDR Center-Aligned Read Strobe) function uses a phase-shifted clock derived from CK to position RWDS transitions precisely within the read data eye-critical for reliable high-speed sampling at 166 MHz. Burst transactions are fully configurable per-command: wrapped (cache-line fill), linear (frame buffer), or hybrid (first wrapped then linear).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 Mb (8 MB) - sufficient for full HD frame buffers or multi-layer UI rendering in resource-constrained SoCs
Interface HyperBus DDR - 12-signal interface (CK/CK#, CS#, RWDS, DQ[7:0]) enabling low-PCB-layer memory expansion
Max Throughput 333 MBps at 166 MHz - supports 1080p60 video streaming without external memory bandwidth bottlenecks
Burst Config 16/32/64/128-byte wrapped or linear bursts - allows cache-line alignment or sequential DMA transfers per transaction
Deep Power Down 20 µA @ 1.8 V - enables ultra-low standby power in always-on display subsystems
Access Latency 36 ns tACC at 166 MHz - deterministic timing for hard real-time graphics pipeline scheduling
Package 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) - compact footprint compatible with high-density mobile and automotive PCB layouts

Pinout & Package

24-ball FBGA package with 0.8 mm ball pitch and 5 mm × 5 mm body size. Pin assignments conform to HyperBus standard layout for interoperability across HyperRAM generations.

Pin/Terminal Circuit Role Design Meaning
VCC Core supply 1.8 V nominal - powers internal logic and refresh controller; decoupling required per datasheet layout guidelines
VCCQ I/O supply 1.8 V nominal - sets DQ/RWDS/CK drive levels; independent from VCC for mixed-voltage system interfacing
CK / CK# Differential clock input LVCMOS differential pair - provides source-synchronous timing reference for all DDR transfers; enables DCARS phase shifting
CS# Chip select Active-low enable - must be asserted before CA transfer; deassertion terminates burst and initiates auto-precharge
RWDS Bidirectional strobe/mask Output during CA phase (indicates refresh latency); edge-aligned read strobe; input write mask (HIGH = byte masked)
DQ[7:0] Data bus 8-bit bidirectional DDR bus - carries command/address (6 bytes), read/write data, and register access payloads
RESET# Hardware reset Asynchronous active-low - forces device into known state and clears internal registers; required after power-up

Key Features

Feature Design Value
Self-refresh DRAM core On-die refresh controller eliminates host CPU overhead and timing-critical refresh scheduling
DCARS timing architecture Phase-shifted RWDS clock ensures stable data capture at 166 MHz DDR without external delay tuning
Configurable burst mode Per-transaction selection of wrapped (cache line), linear (DMA), or hybrid burst - no fixed-mode firmware constraints
Low-power Deep Power Down 20 µA quiescent current at 1.8 V - extends battery life in portable HMI and smart display modules
HyperBus interface 12-pin signaling (vs. 40+ pins for parallel NOR/NAND) reduces PCB layer count and EMI emissions

Applications

Automotive Digital Cluster Industrial HMI Display

Use Scenario: Real-time rendering of animated gauges, navigation overlays, and ADAS alerts in instrument clusters with strict ASIL-B timing requirements.

IC Role / Device Role / Timing Role: Frame buffer memory providing deterministic 333 MBps pixel data delivery to GPU or display controller via HyperBus.

Use Value: Wrapped burst mode aligns with 64-byte cache lines for zero-wait-state gauge redraw; DCARS ensures pixel integrity at 125°C junction temperature.

Use Scenario: Multi-language UI rendering with dynamic font scaling and touch-responsive widgets in factory-floor HMIs.

IC Role / Device Role / Timing Role: Offload memory for GUI assets and bitmap layers, decoupled from main application processor via HyperBus.

Use Value: Linear burst transfers enable rapid full-screen updates; 20 µA deep power down supports energy harvesting-powered status panels.

Smart Home Gateway UI Medical Patient Monitor

Use Scenario: Local display of HVAC controls, security camera thumbnails, and voice assistant feedback on 7-inch capacitive touch panels.

IC Role / Device Role / Timing Role: High-bandwidth PSRAM replacement for cost-sensitive ARM Cortex-M7-based gateways with limited pin count.

Use Value: 12-pin HyperBus interface saves 28+ PCB traces vs. parallel SRAM; hybrid burst mode optimizes mixed icon/text rendering.

Use Scenario: Continuous waveform display (ECG, SpO₂) with overlay annotations and alarm history in Class II medical devices.

IC Role / Device Role / Timing Role: Dual-port memory buffer synchronized to display controller and sensor acquisition engine.

Use Value: Deterministic 36 ns tACC enables sub-millisecond waveform update latency; VCC/VCCQ separation supports isolated analog/digital domains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus DRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
S27KL0641DPBHI020 1.8 V VCC/VCCQ, 24-ball FBGA, same die as S27KS0641 but with different ordering suffix indicating identical electrical spec No functional difference; used interchangeably in production where OPN mapping permits Select when sourcing flexibility or legacy BOM alignment is required
S70KS1281DPBHI020 128 Mb (16 MB) dual-die stack, same package and interface, higher density with identical timing and power specs Supports larger frame buffers or multi-application UIs without changing PCB layout or driver software Choose for future-proofing or when >8 MB memory is needed for OS-level graphics compositing

Compared with S27KS0641DPBHI020, S27KL0641DPBHI020 offers identical performance in a functionally equivalent package, while S70KS1281DPBHI020 doubles capacity with no interface or timing penalty-enabling scalable memory design without re-spinning HyperBus routing.

Availability

S27KS0641DPBHI020 is available at Aetrix Electronics and suitable for automotive digital clusters, industrial HMIs, smart home gateways, and medical patient monitors requiring stable component supply and long-term lifecycle support.

Supply support for S27KS0641DPBHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.

This part belongs to the HyperRAM™ product line-designed specifically to replace parallel NOR/NAND and legacy PSRAM in bandwidth-constrained embedded systems where pin count, power, and deterministic timing are critical.

FAQ

Is S27KS0641DPBHI020 pin-compatible with S27KL0641DPBHI020?

Yes-both share identical 24-ball FBGA mechanical footprint, pin assignment, and electrical characteristics. The "S" and "L" suffixes denote identical silicon die; differences are limited to ordering nomenclature and internal manufacturing lot tracking. No PCB or firmware changes are required for substitution.

Does this device require external refresh management from the host processor?

No. S27KS0641DPBHI020 contains an integrated self-refresh controller that autonomously executes all necessary DRAM refresh cycles. The host only issues HyperBus commands; refresh operations occur transparently during idle periods or with minimal latency insertion signaled via RWDS.

What is the purpose of the RWDS signal during write transactions?

During writes, RWDS acts as a per-byte write mask: HIGH disables writing to the corresponding DQ[7:0] byte, LOW enables it. This enables precise byte-level merging of non-aligned data-e.g., updating individual fields in a structure without reading-modify-write cycles-and supports partial-word DMA transfers.

Can S27KS0641DPBHI020 operate with a single-ended clock instead of differential CK/CK#?

No-this specific variant (PBHI020 suffix) is specified for 1.8 V operation with differential clock input only. Single-ended clock support is available only in 3.0 V variants (e.g., S27KS0641DHBHI020), which use CK-only and 11-signal interface. Mixing clock configurations violates AC timing specifications.

S27KS0641DPBHI020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KS
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
40 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KS0641DPBHI020 FAQ

1.How can I place an order for S27KS0641DPBHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KS0641DPBHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KS0641DPBHI020 reliable?

The price and inventory of S27KS0641DPBHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0641DPBHI020 is usually 5 days.

3.What payment methods are accepted for S27KS0641DPBHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0641DPBHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KS0641DPBHI020?

S27KS0641DPBHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KS0641DPBHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KS0641DPBHI020?

For technical support, including S27KS0641DPBHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0641DPBHI020 requirements.

6.How does Aetrix verify that S27KS0641DPBHI020 is sourced from the original manufacturer or authorized distributors?

All S27KS0641DPBHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0641DPBHI020 meets industry standards.

7.What is the process for return or replacement of S27KS0641DPBHI020?

All S27KS0641DPBHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0641DPBHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KS0641DPBHI020 part is unused and in its original packaging.

Return procedure for S27KS0641DPBHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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