Infineon Technologies S27KS0641DPBHI023
- Part No.:
- S27KS0641DPBHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0641DPBHI023.pdf
- Description:
- IC PSRAM 64MBIT PARALLEL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,398
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Product details
Overview
S27KS0641DPBHI023 from Infineon Technologies (formerly Cypress) is a 64 Mb (8 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and bidirectional RWDS strobe/mask. It delivers 333 MBps throughput at 166 MHz DDR, features DCARS timing for read data eye alignment, and integrates on-die refresh control to emulate PSRAM behavior in microcontroller-based embedded systems.
For engineers reviewing the S27KS0641DPBHI023 datasheet, S27KS0641DPBHI023 pinout, S27KS0641DPBHI023 application, or S27KS0641DPBHI023 equivalent, key selection criteria include HyperBus signal count reduction (12-pin interface), self-refresh latency handling via RWDS, configurable burst lengths (16–128 bytes), DCARS phase-shifted strobe alignment, and FBGA-24 package compatibility with high-density PCB layouts.
Technical Context
This device implements a DDR HyperBus interface with command/address/data multiplexing over DQ[7:0], using CK/CK# for synchronous capture and RWDS for source-synchronous read strobe and write mask signaling. Its internal refresh controller eliminates host-managed refresh cycles, enabling seamless integration into resource-constrained MCUs.
The DCARS (DDR Center-Aligned Read Strobe) architecture shifts RWDS phase relative to CK to center transitions within the read data eye-critical for reliable high-speed sampling at 166 MHz. Burst transactions support dynamic selection between wrapped (cache-line fill) and linear (graphics buffer) modes per access, with initial latency indicated by RWDS during CA transfer.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (8 MB) - sufficient for frame buffers, firmware overlays, and real-time data logging in edge devices |
| Interface | HyperBus DDR - 12-signal interface (CK/CK#, CS#, RWDS, DQ[7:0]) enabling low-pin-count high-bandwidth connectivity |
| Max Data Rate | 333 MBps at 166 MHz (1.8 V) - supports HD display streaming and fast boot code execution |
| Burst Length | Configurable: 16/32/64/128 bytes - matches cache line sizes and DMA transfer granularities |
| Access Latency | tACC = 36 ns at 166 MHz - defines minimum time from CS# assertion to first valid read data |
| Power Modes | Deep Power Down: 20 µA (1.8 V, 105°C) - enables ultra-low-power sleep states in battery-operated IoT nodes |
| Package | 24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - compatible with automated SMT assembly and thermal pad grounding |
Pinout & Package
Package: 24-ball Fine-Pitch Ball Grid Array (FBGA), 5 mm × 5 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides edge-aligned timing reference for DDR command/address/data capture; CK# enables noise rejection |
| CS# | Chip select input | Active-low enable for all HyperBus transactions; deassertion terminates current burst and initiates power-down entry |
| RWDS | Bidirectional read/write data strobe/mask | Outputs initial latency indicator during CA phase; serves as edge-aligned read strobe or write mask during data phase |
| DQ[7:0] | Bi-directional data/command/address bus | Time-multiplexed 8-bit bus carrying CA bytes, read data, and write data; LV-CMOS compatible at 1.8 V |
| VCC / VCCQ | Core and I/O supply | VCC = 1.8 V core voltage; VCCQ = 1.8 V I/O voltage - single-supply operation simplifies power design |
| VSS / VSSQ | Ground returns | Separate analog/digital ground pins reduce switching noise coupling into sensitive timing paths |
| RESET# | Hardware reset input | Asynchronous active-low reset that clears internal state and forces re-initialization of memory controller interface |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates external refresh controller and timing overhead - appears as PSRAM to host MCU |
| DCARS timing implementation | Phase-shifts RWDS relative to CK to center strobe edges in read data eye - improves timing margin at 166 MHz |
| Configurable burst type per transaction | Enables runtime selection of wrapped (cache-line) or linear (streaming) bursts - optimizes bandwidth vs. locality trade-offs |
| Low-signal-count HyperBus interface | Reduces PCB layer count and routing complexity versus parallel NOR/NAND or LPDDR interfaces |
| Deep Power Down mode | 20 µA standby current at 1.8 V enables multi-year battery life in always-on sensor endpoints |
Applications
| Automotive Instrument Clusters | Industrial HMI Displays |
|---|---|
Use Scenario: Rendering animated gauges and real-time vehicle metrics on TFT-LCD panels with 60+ FPS update rates. IC Role / Device Role / Timing Role: Frame buffer memory interfaced directly to MCU's HyperBus controller, providing low-latency pixel data access without external refresh management. Use Value: 333 MBps bandwidth sustains 1280×720@60Hz RGB888 transfers; DCARS ensures reliable read sampling across temperature (-40°C to 105°C). | Use Scenario: Storing and updating multi-language UI assets, touch gesture buffers, and alarm history logs in factory HMIs. IC Role / Device Role / Timing Role: Shared system memory for ARM Cortex-M7 MCU running FreeRTOS, serving both graphics stack and real-time control tasks. Use Value: Wrapped burst mode accelerates cache-line fills from flash; Deep Power Down reduces idle power by >99% during operator inactivity. |
| Medical Portable Monitors | Smart Home Gateways |
Use Scenario: Capturing and buffering ECG waveforms at 1 kS/s while overlaying trend graphs and patient alerts on OLED displays. IC Role / Device Role / Timing Role: Dual-port memory resource: one port for ADC DMA writes, second for display controller reads - coordinated via RWDS handshaking. Use Value: 36 ns tACC enables sub-10 µs response to waveform trigger events; 24-ball FBGA fits compact 4-layer PCBs with strict EMI constraints. | Use Scenario: Hosting Zigbee/Z-Wave protocol stacks, OTA firmware partitions, and encrypted device-state databases in battery-backed gateways. IC Role / Device Role / Timing Role: Non-volatile extension memory for ESP32-S3, expanding heap and instruction cache beyond on-chip SRAM limits. Use Value: Linear burst mode streams OTA binaries at full 333 MBps; configurable drive strength matches trace impedance for 6-inch RF-sensitive routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar HyperBus-compatible DRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S27KL0641DPBHI020 | Same 64 Mb density and FBGA-24 package, but rated for industrial temperature range (–40°C to +85°C) instead of automotive (–40°C to +105°C) | Lacks AEC-Q100 qualification; unsuitable for under-hood automotive use | Select when cost sensitivity outweighs extended temperature requirement and no automotive qualification is mandated |
| S70KS1281DPBHI020 | 128 Mb (16 MB) dual-die stacked variant in identical FBGA-24 package; same 1.8 V HyperBus interface and DCARS timing | Provides double memory capacity for larger UI assets or multi-zone display buffering | Choose when application requires >8 MB contiguous memory and board layout allows same footprint |
Compared with S27KS0641DPBHI023, the S27KL0641DPBHI020 offers identical functionality at lower cost but excludes automotive qualification, while the S70KS1281DPBHI020 doubles capacity in the same footprint-enabling scalable memory design without PCB redesign.
Availability
S27KS0641DPBHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, portable medical monitors, and smart home gateways requiring stable component supply, AEC-Q100 compliance, and long-term lifecycle support.
Supply support for S27KS0641DPBHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.
This part belongs to Infineon's HyperRAM™ product line, engineered to replace legacy PSRAM and low-density LPDDR in MCU-centric designs where low pin count, deterministic latency, and self-refresh simplicity are critical.
FAQ
What is the purpose of the RWDS signal in S27KS0641DPBHI023?
RWDS serves three distinct roles: (1) outputting initial latency indication during command/address transfer, (2) acting as edge-aligned read data strobe during read bursts, and (3) functioning as byte-level write mask during write bursts. Its bidirectional nature eliminates need for separate strobe and mask lines, reducing interface complexity while maintaining precise timing control at 166 MHz DDR rates.
Does S27KS0641DPBHI023 require external refresh circuitry?
No. The device contains fully autonomous on-die refresh logic that executes background refresh cycles without host intervention. The HyperBus interface presents it as a pseudo-static RAM (PSRAM), meaning the host MCU only issues standard read/write commands-no refresh commands, timers, or scheduling logic are required in firmware or hardware.
How does DCARS improve timing margin in high-speed reads?
DCARS generates a phase-shifted version of the CK signal to drive RWDS transitions, positioning its edges precisely at the center of the read data eye. This compensates for skew between clock and data paths, increasing setup/hold margins by up to 150 ps compared to fixed-phase strobes-enabling robust 166 MHz operation across voltage and temperature extremes.
Can S27KS0641DPBHI023 operate with a single 1.8 V supply?
Yes. The device uses a unified 1.8 V supply for both VCC (core) and VCCQ (I/O), eliminating need for dual-rail power design. All I/Os are LV-CMOS compatible at 1.8 V, and internal regulators ensure stable core voltage-simplifying power delivery and reducing BOM count in space-constrained embedded systems.
S27KS0641DPBHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 40 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0641DPBHI023 FAQ
1.How can I place an order for S27KS0641DPBHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0641DPBHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0641DPBHI023 reliable?
The price and inventory of S27KS0641DPBHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0641DPBHI023 is usually 5 days.
3.What payment methods are accepted for S27KS0641DPBHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0641DPBHI023 transactions.
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4.How is shipping managed for S27KS0641DPBHI023?
S27KS0641DPBHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0641DPBHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0641DPBHI023?
For technical support, including S27KS0641DPBHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0641DPBHI023 requirements.
6.How does Aetrix verify that S27KS0641DPBHI023 is sourced from the original manufacturer or authorized distributors?
All S27KS0641DPBHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0641DPBHI023 meets industry standards.
7.What is the process for return or replacement of S27KS0641DPBHI023?
All S27KS0641DPBHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0641DPBHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0641DPBHI023 part is unused and in its original packaging.
Return procedure for S27KS0641DPBHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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